APA3010

APA3010 ANPEC | Alldatasheet

Document overview

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Technical content

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw1 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 3W Mono Low-Voltage Audio Power Amplifier APA3010/1 The APA3010/1 is a bridged-tied load (BTL) audio power amplifier developed especially for low-voltage applica- tions where internal speakers. Operating with a 5V supply, the APA3010/1 can deliver 3.3W of continuous power into a BTL 3 Ω load at 10% THD+N throughout voice band frequencies. Although this device is characterized out to 20kHz, its operation is optimized for narrow band appli- cations such as wireless communications. The BTL con- figuration eliminates the need for external coupling ca- pacitors on the output in most applications, which is par- ticularly important for small battery-powered equipment. This device features a shutdown mode for power sensi- tive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The APA3010/1 are available in a SOP-8, SOP-8P or MSOP-8P.

• Operating Voltage : 2.5V-5.5V
• Bridge-Tied Load (BTL) Mode Operation
• Supply Current – IDD=7mA at VDD=5V
• Low Shutdown Current – IDD=0.1mA
• Low Distortion – 2.5W, at VDD=5V, BTL, RL=3W, THD+N=0.1% – 2.1W, at VDD=5V, BTL, RL=4W, THD+N=0.1%
• Output Power at 1% THD+N – 2.6W, at VDD=5V, BTL, RL=3W – 2.3W, at VDD=5V, BTL, RL=4W at 10% THD+N – 3.3W at VDD=5V, BTL, RL=3W – 2.7W at VDD=5V, BTL, RL=4W
• Depop Circuitry Integrated
• Thermal Shutdown Protection and Over-Current Protection Circuitry
• High Supply Voltage Ripple Rejection
• Surface-Mount Packaging – MSOP-8P (with Enhanced Thermal Pad) – SOP-8P (with Enhanced Thermal Pad) – SOP-8
• Lead Free and Green Devices Available (RoHS Compliant) Features General Description

Applications

• Mobil Phones
• PDAs
• Portable Electronic Devices
• Desktop Computers 4 5 8SHUTDOWN BYPASS INP VOP GND VDD INN VON MSOP-8P / SOP-8P TOP VIEW = Thermal Pad (connected to the GND plane for better heat dissipation) APA3010 4 5 8SHUTDOWN BYPASS INP VOP GND VDD INN VON MSOP-8P / SOP-8P TOP VIEW APA3011 Pin Configuration

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw2 APA3010/1 Ordering and Marking Information Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). APA3010/1 Package Code K : SOP-8 KA : SOP-8P XA : MSOP-8P Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device Handling Code Temperature Range Package Code Assembly Material APA3010/1 K / KA : APA3010/1 XXXXX XXXXX - Date Code XXXXX - Date CodeAPA3010/1 XA : A3010/1 XXX XX Pin Configuration (Cont.) 4 5 8SHUTDOWN BYPASS INP VOP GND VDD INN VON SOP-8 TOP VIEW APA3010 Symbol Parameter Rating Unit VDD Supply Voltage -0.3 to 6 V VIN, VO Input Voltage Range, SHUTDOWN, SHUTDOWN, BYPASS, VO -0.3 to VDD+0.3 V TA Operating Junction Temperature Range -40 to 85 °C TJ Maximum Junction Temperature Internally Limited °C TSTG Storage Temperature Range -65 to +150 °C TS Soldering Temperature Range 260 °C PD Power Dissipation Internally Limited W Absolute Maximum Ratings (Over operating free-air temperature range unless otherwise noted.)

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw3 APA3010/1 Symbol Parameter Test Conditions Range Unit VDD Supply Voltage 2.5 ~ 5.5 V VIH High-Level Voltage SHUTDOWN, SHUTDOWN 2.2 ~ V VIL Low-Level Voltage SHUTDOWN, SHUTDOWN ~ 0.4 V Recommended Operating Conditions Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Thermal Resistance - Junction to Ambient (Note 1) MSOP-8P SOP-8P SOP-8 160 °C/W Note 1 : Please refer to “Thermal Pad Consideration.” 2 layered 5 in2 printed circuit board with 2oz trace and copper through several thermal vias. The thermal pad is solder on the PCB.

Electrical Characteristics

Unless otherwise noted these specifications apply over full temperature VDD= 5V, TA= 25°C (unless otherwise noted). APA3010/1 Symbol Parameter Test Conditions Min. Typ. Max. Unit VOS Output Offset Voltage RL=8Ω , Ri=Rf=20kΩ - - 20 mV IDD Supply Current IO=0mA - 7 14 mA IDD(SD) Supply Current Shutdown Mode - 0.1 - µA SHUTDOWN, Vi=VDD - 0.1 - |IH| SHUTDOWN, Vi=VDD - 0.1 - µA SHUTDOWN, Vi=0V - 0.1 - |IL| SHUTDOWN, Vi=0V - 0.1 - µA OPERATING CHARACTERISTICS, VDD=5V,TA=25°C THD+N=1%, fin=1kHz, RL=3Ω RL=4Ω RL=8Ω 2.6 2.3 1.3 PO Output Power THD+N=10%, fin =1kHz, RL=3Ω RL=4Ω RL=8Ω 3.3 2.7 1.7 W THD+N Total Harmonic Distortion Plus Noise fin =1kHz, PO=2W, RL=3Ω PO=1.6W, RL=4Ω PO=1W, RL=8Ω 0.06 0.04 0.03 - % B1 Unity-Gain Bandwidth Open Loop - 2 - MHz PSRR Power Supply Rejection Ratio CB=1µF, RL=8Ω, fin =120kHz - 60 - dB Vn Noise Output Voltage AV=6dB, CB=1µF, RL=8Ω - 28 - µV(rms) TWU Wake-Up Time CB=1µF - 380 - ms

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw4 APA3010/1 Typical Operating Characteristics THD+N (%) Output Power (W) Output Power (W) THD+N (%)THD+N (%) THD+N (%) THD+N vs. Output Power Frequency (Hz) Frequency (Hz) THD+N vs. Output Power THD+N vs. Frequency THD+N vs. Frequency THD+N (%) THD+N (%) Output Power (W) Frequency (Hz) THD+N vs. Output Power THD+N vs. Frequency 0.01 0.1 0 3.50.5 1 1.5 2 2.5 3 RL=8Ω RL=4Ω RL=3Ω VDD=5V AV=6dB fin=1kHz 0.01 0.1 10m 5100m 1 2 VDD=5V AV=6dB RL=3Ω fin=20kHz fin=20Hz fin=1kHz 0.01 0.1 20 20k100 1k 10k VDD=5V AV=6dB RL=3Ω PO=2W PO=1W 0.01 0.1 20 20k100 1k 10k VDD=5V PO=2W RL=3Ω AV=6dB AV=20dB 0.0 0.1 10m 5100m 1 2 VDD=5V AV=6dB RL=4Ω fin= 20kHz fin= 20Hz fin= 1kHz 0.01 0.1 20 20k100 1k 10k VDD=5V AV=6dB RL=4Ω PO=1.6W PO=0.8W

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw5 APA3010/1 Typical Operating Characteristics (Cont.) Output Power (W) THD+N (%) THD+N (%) Frequency (Hz) THD+N vs. Output PowerTHD+N vs. Frequency THD+N (%) THD+N (%) Frequency (Hz) Frequency (Hz) THD+N vs. Frequency THD+N vs. Frequency Frequency Response Frequency Response Gain(dB) Frequency (Hz) Frequency (Hz) Gain(dB) Phase(Degrees) Phase(Degrees) 0.01 0.1 20 20k100 1k 10k VDD=5V PO=1.6W RL=4Ω AV=6dB AV=20dB 0.01 0.1 10m 5100m 1 2 VDD=5V AV=6dB RL=8Ω fin= 20kHz fin= 20Hz fin= 1kHz 0.005 0.01 0.1 20 20k100 1k 10k VDD=5V AV=6dB RL=8Ω PO=0.5W PO=1W 0.005 0.01 0.1 20 20k100 1k 10k VDD=5V PO=1W RL=8Ω AV=20dB AV=6dB +170 +220 +180 +190 +200 +210 10 200k100 1k 10k 100k Gain Phase VDD=5V RL=3Ω PO=1W +170 +220 +180 +190 +200 +210 10 200k100 1k 10k 100k VDD=5V RL=4Ω PO=0.8W Gain Phase

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw6 APA3010/1 PSRR vs. Frequency Shutdown Attenuation vs. Frequency Gain(dB) Frequency (Hz) Frequency (Hz) Gain(dB) Phase(Degrees) Frequency Response Input Capacitor vs. Frequency Response Frequency (Hz) Frequency (Hz) Shutdown Attenuation(dB) PSRR(dB) Typical Operating Characteristics (Cont.) Output Noise Voltage vs.Frequency Power Dissipation vs. Output Power Output Noise Voltage(V) Frequency (Hz) Power Dissipation(W) Output Power(W) +170 +220 +180 +190 +200 +210 10 200k100 1k 10k 100k Gain Phase VDD=5V RL=8Ω PO=0.5W -120 -100 -80 -60 -40 -20 20 20k100 1k 10k VDD=5V AV=6dB RL=8Ω 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 RL=3Ω RL=4Ω RL=8Ω VDD=5V THD+N<1% -15 +10 -10 10 20k100 1k 10k Ci=2.2µF Ci=0.47µF Ci=0.1µF Ci=1µF VDD=5V RL=8Ω AV=6dB PO=0.5W Ri=Rf=20kΩ -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 20 20k100 1k 10k VDD=5V RL=8Ω CB=1µF 100µ 10µ 20µ 50µ 20 20k100 1k 10k LPF BW<22kHz A-Weighting

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw7 APA3010/1 Supply Voltage(V) Supply Current(mA) Supply Current vs. Supply Voltage Supply Voltage vs. Output Power Output Power(W) Supply Voltage(V) Typical Operating Characteristics (Cont.) Power Dissipation vs. Output Power Supply Current vs. Supply Voltage Output Power(W) Supply Voltage(V) Output Power(W) Supply Voltage(V) 4.0 5.0 6.0 7.0 8.0 AV=6dB No Load 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VDD=5V AV=6dB RL=3Ω fin=1kHz BW<80kHz THD+N=1% THD+N=10% 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VDD=5V AV=6dB RL=4Ω fin=1kHz BW<80kHz THD+N=10% THD+N=1% 0.0 0.5 1.0 1.5 2.0 2.5 VDD=5V AV=6dB RL=8Ω fin=1kHz BW<80kHz THD+N=10% THD+N=1%

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw8 APA3010/1 Block Diagram Note * : APA3011 is SHUTDOWN Vbias Shutdown Ckt BYPASS INN SHUTDOWN* VOP VON Power and Depop Ckt INP VDD GND Pin Description PIN NO. NAME I/O FUNCTION SHUTDOWN (APA3010) SHUTDOWN (APA3011) I Shutdown mode control signal input, place entire IC in shutdown mode when held high in APA3010 (APA3011 held low). 2 BYPASS I Bypass pin. 3 INP I INP is the non-inverting input. INP is typically tied to the Bypass terminal. 4 INN I INN is the inverting input. INN is typically used as the audio input terminal. 5 VOP O VOP is the positive BTL output. 6 VDD - Supply voltage input pin. 7 GND - Ground connection for circuitry. 8 VON O VON is the negative BTL output.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw9 APA3010/1 Typical Application Circuit VDD Audio IN 1µF 100kΩ 20kΩ0.47µF Vbias Shutdown Ckt BYPASS INN SHUTDOWN* VOP VON Power and Depop Ckt INP VDD GND 20kΩ 10µF Rf Ri Ci CB CS 0.1µF Shutdown Signal *Only for APA3011 For SE input signal VDD 4 Ω VDD Audio IN 1µF 100kΩ 20kΩ0.47µF Vbias Shutdown Ckt BYPASS INN SHUTDOWN* VOP VON Power and Depop Ckt INP VDD GND 20kΩ 10µF Rf Ri Ci CB CS 0.1µF Shutdown Signal Audio IN 20kΩ0.47µF Ri Ci 20kΩ Rf *Only for APA3011 For Differential input signal VDD

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw10 APA3010/1

Application Information

The APA3010/1 output stage (power amplifier) has two pairs of operational amplifiers internally, allowed for dif- ferent amplifier configurations. Figure 1. APA3010/1 Internal Configuration external resistors (Ri and Rf). fect the low frequency performance of audio signal. directly affects the low frequency performance of the circuit. a value in the range of 0.22µF to 1.0µF would be chosen. leakage tantalum or ceramic capacitor is the best choice. pacitor polarity in the application.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw11 APA3010/1 Application Information (Cont.) The effect of a larger bypass capacitor will improve PSRR due to increased supply stability. Typical applications em- ploy a 5V regulator with 1.0µF and a 0.1µF bypass capaci- tor as supply filtering. This does not eliminate the need for bypassing the supply nodes of the APA3010/1. The selection of bypass capacitors, especially CB, is thus de- pendent upon desired PSRR requirements, click and pop performance. To avoid the start-up pop noise occurred, the bypass volt- age should rise slower than the input bias voltage and the relationship shown in equation (4) should be maintained. CB x 125kΩ << 1 40kΩ x Ci (4) The bypass capacitor is fed thru from a 125kΩ resistor inside the amplifier and the 40kΩ is maximum input re- sistance of (Ri+ Rf). Bypass capacitor, CB, values of 3.3µF to 10µF ceramic or tantalum low-ESR capacitors are rec- ommended for the best THD and noise performance. The bypass capacitance also effects to the start-up time. It is determined in the following equation : Tstart up = 5 x (CB x 125kΩ ) (5) Power Supply Decoupling, CS The APA3010/1 is a high-performance CMOS audio am- plifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents the oscillations being caused by long lead length be- tween the amplifier and the speaker. The optimum decoupling is achieved by using two different types of capacitors that target on different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance(ESR) ceramic capacitor, typically 0.1µF placed as close as pos- sible to the device VDD lead works best. For filtering lower- frequency noise signals, a large aluminum electrolytic Optimizing Depop Circuitry Circuitry has been included in the APA3010/1 to minimize the amount of popping noise at power-up and when com- ing out of shutdown mode. Popping occurs whenever a voltage step is applied to the speaker. In order to elimi- nate clicks and pops, all capacitors must be fully dis- charged before turn-on. Rapid on/off switching of the de- vice or the shutdown function will cause the click and pop circuitry. The value of Ci will also affect turn-on pops. (Refer to Effective Bypass Capacitance) The bypass voltage ramp up should be slower than input bias voltage. Although the bypass pin current source cannot be modified, the size of CB can be changed to alter the device turn-on time and the amount of clicks and pops. By increasing the value of CB, turn-on pop can be reduced. However, the tradeoff for using a larger bypass capacitor is to increase the turn-on time for this device. There is a linear relationship be- tween the size of CB and the turn-on time. A high gain amplifier intensifies the problem as the small delta in voltage is multiplied by the gain. Therefore, it is advantageous to use low-gain configurations. Shutdown Function In order to reduce power consumption while not in use, the APA3010/1 contain a SHUTDOWN pin to externally turn off the amplifier bias circuitry. This shutdown feature turns the amplifier off when a logic high (APA3011 held low) is placed on the SHUTDOWN pin. The trigger point between a logic high and logic low level is typically 2.0V. It is best to switch between the ground and the supply VDD to provide maximum device performance. By switching the SHUTDOWN pin to high, the amplifier enters a low-current state, IDD< 0.1µA. APA3010 is in shut- down mode. On normal operating, the SHUTDOWN pin pulls to a low level to keep the IC out of the shutdown mode. The SHUTDOWN pin should be tied to a definite voltage to avoid unwanted state change. BTL Amplifier Efficiency An easy-to-use equation to calculate efficiency starts out as being equal to the ratio of power from the power sup- ply to the power delivered to the load. Effective Bypass Capacitor, CB As other power amplifiers, proper supply bypassing is critical for low noise performance and high power supply rejection. The capacitors located on both the bypass and power supply pins should be as close to the device as possible. capacitor of 10µF or greater placed near the audio power amplifier is recommended.

Copyright  ANPEC Electronics Corp. pation over the normal operating range. ciency equation to an utmost advantage when possible. supply voltage and speaker impedance for the application. ** High peak voltages cause the THD to increase. Table 1. Efficiency Vs Output Power in 5-V/8Ω BTL conditions is 4 times as in SE mode. sistance (θ JA) is equal to 48ο C/W. or the ambient temperature should be reduced. will go into thermal shutdown when driving a 4Ω load. cial attention on thermal design. be soldered down to a copper pad on the circuit board. the thermal pad to the bottom plane.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw13 APA3010/1 Thermal Pad Consideration (Cont.) Application Information (Cont.) For good thermal conduction, the vias must be plated through and solder filled. The copper plane used to con- duct heat away from the thermal pad should be as large as practical. If the ambient temperature is higher than 25°C, a larger copper plane or forced-air cooling will be required to keep the APA3010/1 junction temperature below the thermal shutdown temperature (150°C). In higher ambient temperature, higher airflow rate and/or larger copper area will be required to keep the IC out of thermal shutdown. Thermal Consideration Linear power amplifiers dissipate a significant amount of heat in the package under normal operating conditions. To calculate maximum ambient temperatures, refer the “ Power Dissipation vs. Output Power” graphs. Given θ JA, the maximum allowable junction temperature (TJMAX), and the total internal dissipation (PD), the maximum am- bient temperature can be calculated with the following equation. The maximum recommended junction tem- perature for the APA3010/1 is 150°C. The internal dissi- pation figures are taken from the Power Dissipation vs. Output Power graphs. TAMax = TJMax -θ JAPD (12) The APA3010/1 is designed with a thermal shutdown pro- tection that turns the device off when the junction tem- perature surpasses 150°C to prevent damaging the IC. 0.65mm 1.0mm 2.5mm Ground plane for ThermalPAD ThermalVia diameter 12mil X 5 2.5mm 0.65mm 0.4mm MSOP-8P Land Pattern Recommendation 2.0mm 3mm Ground plane for ThermalPADThermalVia diameter 12mil X 15 1.27mm 0.7mm 0.25mm 5mm SOP-8P Land Pattern Recommendation

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw14 APA3010/1

Package Information

A A1 A2 L VIEW A 0.25 SEATING PLANE GAUGE PLANE Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. S Y M B O L MIN. MAX. 1.75 0.10 0.17 0.25 0.25 A c D E e h L MILLIMETERS b 0.31 0.51 SOP-8 0.25 0.50 0.40 1.27 MIN. MAX. INCHES 0.069 0.004 0.012 0.020 0.007 0.010 0.010 0.020 0.016 0.050 0.010 1.27 BSC 0.050 BSC A2 1.25 0.049 0° 8 ° 0° 8 ° 3.80 5.80 4.80 4.00 6.20 5.00 0.189 0.197 0.228 0.244 0.150 0.157 D e E SEE VIEW A cb h X 45° SEATING PLANE < 4 mils-T-

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw15 APA3010/1 D E e b A VIEW A L 0.25 GAUGE PLANE SEATING PLANE θ Note : 1. Followed from JEDEC MS-012 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. 0.020 0.010 0.020 0.050 0.006 0.063 MAX. 0.40L θ 0oC E e h 0.25 D c b 0.17 0.31 0.0161.27 8oC 0oC 8oC 0.50

1.27 BSC

0.51 0.25

0.050 BSC

0.010 0.012 0.007 MILLIMETERS MIN. SYMBOL A 0.00 1.25 SOP-8P MAX. 0.15 1.60 MIN. 0.000 0.049 INCHES D1 2.50 0.098 2.00 0.079E2 3.50 3.00 0.138 0.118 4.80 5.00 0.189 0.197 3.80 4.00 0.150 0.157 5.80 6.20 0.228 0.244 h X 45o c SEE VIEW A -T- SEATING PLANE < 4 mils

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw16 APA3010/1 A VIEW A 0.25 SEATING PLANE GAUGE PLANE D e SEE VIEW A E b c E2EXPOSED PAD S YMB OL MIN. MAX. 1.10 0.00 0.22 0.38 0.08 0.23 0.15 A b c D E e L MILLIMETERS A2 0.75 0.95

0.65 BSC

0.40 0.80

0.026 BSC

MIN. MAX. INCHES 0.043 0.000 0.030 0.037 0.009 0.015 0.003 0.009 0.016 0.031 0.006 1.50 2.50 0.059 0.098 1.50 2.50 0.059 0.098 0° 8° 0° 8° 2.90 3.10 2.90 3.10 4.70 5.10 0.114 0.122 0.185 0.201 0.114 0.122 Note: 1. Follow JEDEC MO-187 AA-T 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not flash or protrusions. 3. Dimension “E1” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 6 mil per side.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw17 APA3010/1 Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8(P) Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 MSOP-8P Carrier Tape & Reel Dimensions Devices Per Unit (mm) Package Type Unit Quantity SOP-8(P) Tape & Reel 2500 MSOP-8P Tape & Reel 3000 H A d A AB W F T P0OD0 B SECTION B-B SECTION A-A OD1

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw18 APA3010/1 Taping Direction Information SOP-8(P) MSOP-8P USER DIRECTION OF FEED USER DIRECTION OF FEED

Copyright  ANPEC Electronics Corp. Rev. A.7 - Dec., 2010 www.anpec.com.tw19 APA3010/1 Classification Profile Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) Time at liquidous (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body Temperature (Tp)* See Classification Temp in table 1 See Classification Temp in table 2 Time (tP) within 5°C of the specified classification temperature (Tc) 20 seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Copyright  ANPEC Electronics Corp. Table 2. Pb-free Process – Classification Temperatures (Tc) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)