APA2020R-TYL

APA2020 ANPEC | Alldatasheet

Document overview

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Technical content

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G31 /G41/G4E/G50/G45/G43/G20/G72/G65/G73/G65/G72/G76/G65/G73/G20/G74/G68/G65/G20/G72/G69/G67/G68/G74/G20/G74/G6F/G20/G6D/G61/G6B/G65/G20/G63/G68/G61/G6E/G67/G65/G73/G20/G74/G6F/G20/G69/G6D/G70/G72/G6F/G76/G65/G20/G72/G65/G6C/G69/G61/G62/G69/G6C/G69/G74/G79/G20/G6F/G72/G20/G6D/G61/G6E/G75/G66/G61/G63/G74/G75/G72/G61/G62/G69/G6C/G69/G74/G79/G20/G77/G69/G74/G68/G6F/G75/G74/G20/G6E/G6F/G74/G69/G63/G65/G2C/G20/G61/G6E/G64/G20/G61/G64/G76/G69/G73/G65 /G63/G75/G73/G74/G6F/G6D/G65/G72/G73/G20/G74/G6F/G20/G6F/G62/G74/G61/G69/G6E/G20/G74/G68/G65/G20/G6C/G61/G74/G65/G73/G74/G20/G76/G65/G72/G73/G69/G6F/G6E/G20/G6F/G66/G20/G72/G65/G6C/G65/G76/G61/G6E/G74/G20/G69/G6E/G66/G6F/G72/G6D/G61/G74/G69/G6F/G6E/G20/G74/G6F/G20/G76/G65/G72/G69/G66/G79/G20/G62/G65/G66/G6F/G72/G65/G20/G70/G6C/G61/G63/G69/G6E/G67/G20/G6F/G72/G64/G65/G72/G73/G2E /G53/G74/G65/G72/G65/G6F/G20/G32/G2D/G57/G20/G41/G75/G64/G69/G6F/G20/G50/G6F/G77/G65/G72/G20/G41/G6D/G70/G6C/G69/G66/G69/G65/G72 The APA2020 also served well in low-voltage applications , which provides 800-mW per channel into 4Ω loads with a 3.3V supply voltage. Both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA2020 , that reduces pops and clicks noise during power up and when using the shutdown or mute modes and protects the chip from being destroyed by over-temperature failure. To simplify the audio system design in notebook computer applications , the APA2020 combines a stereo bridge-tied loads (BTL) mode for speaker drive and a stereo single-end (SE) mode for headphone drive into a single chip , where both modes are easily switched by the SE/BTL input control pin signal. For power sensitive applications , the APA2020 also features a shutdown function which keeps the supply current only 0.5 µA (typ). /G46/G65/G61/G74/G75/G72/G65/G73

• •••• Depop Circuitry Integrated
• •••• Thermal Shutdown Circuitry Integrated
• •••• Output Power at 1% THD+N, VDD =5V - 1.8 W/Ch (typ) into a 4 Ω Load - 1.2 W/Ch (typ) into a 8 Ω Load
• •••• Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation
• •••• Various 24-Pin Power Packages Available SOP, TSSOP-P
• •••• Shutdown Control Mode , IDD = 0.5µA /G41/G70/G70/G6C/G69/G63/G61/G74/G69/G6F/G6E/G73
• •••• Stereo Audio Power Amplifier for Notebook Computer /G47/G65/G6E/G65/G72/G61/G6C/G20/G44/G65/G73/G63/G72/G69/G70/G74/G69/G6F/G6E /G4F/G72/G64/G65/G72/G69/G6E/G67/G20/G61/G6E/G64/G20/G4D/G61/G72/G6B/G69/G6E/G67/G20/G49/G6E/G66/G6F/G72/G6D/G61/G74/G69/G6F/G6E APA2020 Handl i ng Code Temp. Range Package Code Package Code K : SOP R : TSSOP-P * Temp. Range I : - 40 to 85 C Handling Code TU : Tube TR : Tape & Reel TY : Tray Lead Free Code L : Lead Free Device Blank : O riginal Device APA2020 K : APA2020 XXXXX XXXXX - Date Code APA2020 R : APA2020 XXXXX XXXXX - Date Code Lead Free Code * TSSOP-P is a standard TSSOP package with a thermal pad exposure on the bottom of the package. The APA2020 is a stereo bridge-tied audio power am- plifier in various 24-pin power packages , including SOP , TSSOP-P. When connecting to a 5V voltage supply , the APA2020 is capable of delivering 1.8W/ 1.2W of continuous RMS power per channel into 4Ω/ 8Ω loads with less than 1% THD+N , respectively. The APA2020 simplifies design and frees up board space for other features.

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G32 /G42/G6C/G6F/G63/G6B/G20/G44/G69/G61/G67/G72/G61/G6D MUX MUX MUX SE/BTL (Over operating free-air temperature range unless otherwise noted.) Symbol Parameter Rating Unit V CC Supply Voltage 6 V TA Operating Ambient Temperature Range -40 to 85 °C TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -65 to +150 °C TS Soldering Temperature,10 seconds 300 °C V ESD Electrostatic Discharge -3000 to 3000 *1 -200 to 200 *2 V /G41/G62/G73/G6F/G6C/G75/G74/G65/G20/G4D/G61/G78/G69/G6D/G75/G6D/G20/G52/G61/G74/G69/G6E/G67/G73 Note: 1. Human body model : C=100pF , R=1500Ω , 3 positive pulses plus 3 negative pulses 2. Machine model : C=200pF , L=0.5mH , R=0Ω , 3 positive pulses plus 3 negative pulses

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G33 /G52/G65/G63/G6F/G6D/G6D/G65/G6E/G64/G65/G64/G20/G4F/G70/G65/G72/G61/G74/G69/G6E/G67/G20/G43/G6F/G6E/G64/G69/G74/G69/G6F/G6E/G73 Min. Typ. Max. Unit Supply Voltage, VDD 35 5 . 5 V V DD = 5 V , 4 -Ω stereo BTL drive, 250mW/Ch average power, with proper PCB d e s i g n -20 85Operating free-air temperature, TA V DD = 5 V , 3 -Ω stereo BTL drive,

2 W/Ch average power, with proper PCB design

f o r c e d - a i r c o o l i n g -20 85 V DD =5 V 1.25 4.5Common mode input voltage, VICM V DD =3.3V 1.25 2.7 V AC Operating Characteristics , VDD = 5V , TA= 25°C , RL= 4Ω (unless otherwise noted) APA2020Symbol Parameter Test Condition Min. Typ . Max. Unit THD = 10% , BTL , RL=4Ω RL=8Ω 2.3 1.5 THD = 1% , BTL , RL=4Ω RL=8Ω 1.8 1.2 W THD = 10% , SE , RL=4Ω RL=8Ω 650 400 P(out) Output power (each channel ) see Note 1 THD = 1% , SE , RL=4Ω RL=8Ω THD = 0.5% , SE , RL=32 Ω 500 320 mW PO = 1.6W , BTL , RL=4Ω PO = 1W , BTL , RL=8Ω PO = 78mW , SE ,RL=32Ω 300 150 THD + N Total harmonic distortion plus noise V1 = 1V , RL=4Ω , G = 1 10 BOM Maximum output power bandwidth G = 10 , THD < 1% >20 KHz R L = 4Ω , BTL 72 R L = 4Ω , Open Load 71 Phase margin R L = 4Ω , SE 52 Notes 1 : Output power is meaured at the output teminals of the IC at 1 KHz. /G45/G6C/G65/G63/G74/G72/G69/G63/G61/G6C/G20/G43/G68/G61/G72/G61/G63/G74/G65/G72/G69/G73/G74/G69/G63/G73/G20/G28/G43/G6F/G6E/G74/G2E/G29

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G34 /G45/G6C/G65/G63/G74/G72/G69/G63/G61/G6C/G20/G43/G68/G61/G72/G61/G63/G74/G65/G72/G69/G73/G74/G69/G63/G73/G20/G28/G43/G6F/G6E/G74/G2E/G29 AC Operating Characteristics , VDD = 5V , TA= 25°C , RL= 4Ω (unless otherwise noted) APA2020Symbol Parameter Test Condition Min. Typ . Max. Unit PSRR Power supply ripple rejection f =100 Hz 80 dB Mute attenuation 85 dB Channel-to-channel output separation 85 dB Line HP input separation 75 dB BTL attenuation in SE mode 80 dB ZI Input impedance 2M W Signal-to-noise ratio Po = 500 mW , BTL 90 dB Vn Output noise voltage 80 /GEC/G56 /G28rms) Notes 1 : Output power is meaured at the output teminals of the IC at 1 KHz. /G45/G6C/G65/G63/G74/G72/G69/G63/G61/G6C/G20/G43/G68/G61/G72/G61/G63/G74/G65/G72/G69/G73/G74/G69/G63/G73/G20/G28/G43/G6F/G6E/G74/G2E/G29 APA2020Symbol Parameter Test Condition Min. Typ . Max. Unit THD = 10% , BTL , RL=4Ω RL=8Ω 0.6 THD = 1% , BTL , RL=4Ω RL=8Ω 0.8 0.5 W THD = 10% , SE , RL=4Ω RL=8Ω 290 180 P(out) Output power (each channel ) see Note 2 THD = 1% , SE , RL=4Ω RL=8Ω THD = 0.5% , SE , RL=32 Ω 230 140 mW PO = 1.6W , BTL , RL=4Ω PO = 1W , BTL , RL=8Ω PO = 78mW , SE ,RL=32Ω 270 150 THD + N Total harmonic distortion plus noise V1 = 1V , RL=4Ω , G = 1 10 BOM Maximum output power bandwidth G = 10 , THD < 1% >20 KHz R L = 4Ω , BTL 92 R L = 4Ω , Open Load 70 Phase margin R L = 4Ω , SE 57 Notes 2 : Output power is meaured at the output teminals of the IC at 1 KHz. AC Operating Characteristics , VDD = 3.3V , TA= 25°C , RL= 4Ω (unless otherwise noted)

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G35 /G45/G6C/G65/G63/G74/G72/G69/G63/G61/G6C/G20/G43/G68/G61/G72/G61/G63/G74/G65/G72/G69/G73/G74/G69/G63/G73/G20/G28/G43/G6F/G6E/G74/G2E/G29 AC Operating Characteristics , VDD = 3.3V , TA= 25°C , RL= 4Ω (unless otherwise noted) APA2020Symbol Parameter Test Condition Min. Typ . Max. Unit PSRR Power supply ripple rejection f =100 Hz 70 dB Mute attenuation 85 dB Channel-to-channel output separation f =1 KHz 85 dB Line HP input separation 75 dB BTL attenuation in SE mode 80 dB ZI Input impedance 2M W Signal-to-noise ratio Po = 500 mW , BTL 90 dB Vn Output noise voltage 50 /GEC/G56 /G28rms) Notes 2 : Output power is meaured at the output teminals of the IC at 1 KHz. APA2020Symbol Parameter Test Conditions Typ. Max. Unit Stereo BTL 8 11 mAV DD = 5V Stereo SE 4 6.5 mA Stereo BTL 7 9 mA IDD Supply Current V DD = 3.3 V Stereo SE 3.5 5.6 mA V O (DIFF) DC Differential Output Voltage V DD =5V, Gain = 2, see Note3 5 25 mV IDD(MUTE) Supply Current in Mute Mode V DD = 5V 8 11 mA ISD IDD in Shutdown V DD = 5V 0.5 5 µA Note 3 : at 3V<VDD <5V , the DC output voltage is approximately VDD / 2.

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G36 /G50/G69/G6E/G20/G44/G65/G73/G63/G72/G69/G70/G74/G69/G6F/G6E MUTE OUT LBYPASS SHUTDOWN GND/HS T J LOUT+ LLINEIN LHPIN LOUT- LV DD GND/HS MUTE IN GND/HS NC ROUT+ RLINEIN RHPIN ROUT- RV DD GND/HS SE/BTL RBYPASS NC HP/LINE Top View Bottom View Thermal Pad For SOP and TSSOP-P For TSSOP-P Only Pin Name No I/O

Description

GND/HS 1,12, 13,24 Ground connection for circuitry, directly connected to thermal pad (only in TSSOP-P package). TJ 2 O Shutdown mode control signal input, sources a current proportional to the junction temperature. This pin should be left unconnected during normal operation. For more information, see the junction temperature measurement section of this document. LOUT + 3 O Left channel + output in BTL mode, + output in SE mode. L LINE IN 4 I Left channel line input, selected when HP/LINE pin (16) is held low. LHP IN 5I Left channel headphone input, selected when HP/LINE pin (16) is held high. LBYPASS 6 Connect to voltage divider for left channel internal mid-supply bias. LV DD 7 I Supply voltage input for left channel and for primary bias circuits. SHUTDOWN 8 I Shutdown mode control signal input, places entire IC in shutdown mode when held high, IDD = 0.5µ A. MUTE OUT 9 O Follows MUTE in pin (11), provides buffered output. LOUT - 10 O Left channel - output in BTL mode, high-impedance state in SE mode. MUTE IN 11 I Mute control signal input, hold low for normal operation, hold high to mute. SE/BTL 14 I Mode control signal input, hold low for BTL mode, hold high for SE mode. ROUT- 15 O Right channel - output in BTL mode, high impedance state in SE mode. HP/ LINE 16 I MUX control input, hold high to select headphone inputs (5,20), hold low to select line inputs (4,21).

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G32/G31 SO – 300mil ( Reference JEDEC Registration MS-013) Millimeters Variations- D Inches Variations- D D See variations SO-24 15.20 15.60 D See variations SO-24 0.599 0.614 H 10 10.65 H 0.394 0.419 L 0.40 1.27 L 0.016 0.050 N See variations N See variations φ 10 ° 8°φ 10 ° 8° N 12 3 EH D L GAUGE PLANE e B A1 A /G50/G61/G63/G6B/G61/G67/G69/G6E/G67/G20/G49/G6E/G66/G6F/G72/G6D/G61/G74/G69/G6F/G6E

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G32/G32 /G20 TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153) Millimeters Inches Dim Min. Max. Min. Max. A 1.2 0.047 A1 0.00 0.15 0.000 0.006 A2 0.80 1.05 0.031 0.041 D 6.4 (N=20PIN) 7.7 (N=24PIN) 9.6 (N=28PIN) 6.6 (N=20PIN) 7.9 (N=24PIN) 9.8 (N=28PIN) 0.252 (N=20PIN) 0.303 (N=24PIN) 0.378 (N=28PIN) 0.260 (N=20PIN) 0.311 (N=24PIN) 0.386 (N=28PIN)

4.2 BSC (N=20PIN)

4.7 BSC (N=24PIN)

3.8 BSC (N=28PIN)

0.165 BSC (N=20PIN)

0.188 BSC (N=24PIN)

0.150 BSC (N=28PIN)

e 0.65 BSC 0.026 BSC E 6.40 BSC 0.252 BSC E1 4.30 4.50 0.169 0.177

3.0 BSC (N=20PIN)

3.2 BSC (N=24PIN)

2.8 BSC (N=28PIN)

0.118 BSC (N=20PIN)

0.127 BSC (N=24PIN)

0.110 BSC (N=28PIN)

L 0.45 0.75 0.018 0.030 L1 1.0 REF 0.039REF R 0.09 0.004 R1 0.09 0.004 S 0.2 0.008 φ1 0 ° 8 ° 0 ° 8 ° φ2 12 ° REF 12 ° REF φ3 12 ° REF 12 ° REF BOTTOM VIEW (THERMALLY ENHANCED VARIATIONDS ONLY) b A D e 2 x E / 2 E1 E e/2 N 12 3 EXPOSED THERMAL PAD ZONE L (L1) (3 ) S (2 ) 0.25 GAUGE PLANE /G50/G61/G63/G6B/G61/G67/G69/G6E/G67/G20/G49/G6E/G66/G6F/G72/G6D/G61/G74/G69/G6F/G6E

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G32/G33 /G50/G68/G79/G73/G69/G63/G61/G6C/G20/G20/G53/G70/G65/G63/G69/G66/G69/G63/G61/G74/G69/G6F/G6E/G73 t 25 C to Peak tp Ramp-up tL Ramp-down ts Preheat Tsmax Tsmin T L T P Temperature Time Critical Zone T L to TP °/G20 Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Packaging 1000 devices per reel /G20/G52/G65/G66/G6C/G6F/G77/G20/G43/G6F/G6E/G64/G69/G74/G69/G6F/G6E/G20(IR/Convection or VPR Reflow) /G43/G6C/G61/G73/G73/G69/G66/G69/G63/G61/G74/G69/G6E/G20/G52/G65/G66/G6C/G6F/G77/G20/G50/G72/G6F/G66/G69/G6C/G65/G73 Sn-Pb Eutectic Assembly Pb-Free Assembly Profile Feature Large Body Small Body Large Body Small Body Average ramp-up rate (TL to TP) 3°C/second max. 3 °C/second max. Preheat /G2D/G20Temperature Min (Tsmin) /G2D/G20Temperature Mix (Tsmax) /G2D/G20Time (min to max)(ts) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Tsmax to TL - Ramp-up Rate 3°C/second max Tsmax to TL /G2D/G20Temperature(TL) /G2D/G20Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(Tp) 225 +0/-5°C 240 +0/-5 °C 245 +0/-5 °C 250 +0/-5 °C Time within 5°C of actual Peak Temperature(tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds Ramp-down Rate 6°C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G32/G34 /G43/G61/G72/G72/G69/G65/G72/G20/G54/G61/G70/G65/G20/G26/G20/G52/G65/G65/G6C/G20/G44/G69/G6D/G65/G6E/G73/G69/G6F/G6E/G73 t Ao E W Po P Ko Bo D F A J B C Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100% RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150 °C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1 tr > 100mA /G20 /G52/G65/G6C/G69/G61/G62/G69/G6C/G69/G74/G79/G20/G54/G65/G73/G74/G20/G50/G72/G6F/G67/G72/G61/G6D Application A B C J T1 T2 W P E 330±16 2 ±1.5 12.75 ± F D D1 Po P1 Ao Bo Ko tSOP- 24 Application A B C J T1 T2 W P E F D D1 Po P1 Ao Bo Ko tTSSOP- 24 (mm)

/G43/G6F/G70/G79/G72/G69/G67/G68/G74/G20 /G41/G4E/G50/G45/G43/G20/G45/G6C/G65/G63/G74/G72/G6F/G6E/G69/G63/G73/G20/G43/G6F/G72/G70/G2E /G52/G65/G76/G2E/G20/G41/G2E/G38/G20/G2D/G20/G4E/G6F/G76/G2E/G2C/G20/G32/G30/G30/G32 /G41/G50/G41/G32/G30/G32/G30 /G77/G77/G77/G2E/G61/G6E/G70/G65/G63/G2E/G63/G6F/G6D/G2E/G74/G77/G32/G35 /G43/G6F/G76/G65/G72/G20/G54/G61/G70/G65/G20/G44/G69/G6D/G65/G6E/G73/G69/G6F/G6E/G73 Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 /G43/G75/G73/G74/G6F/G6D/G65/G72/G20/G53/G65/G72/G76/G69/G63/G65 Application Carrier Width Cover Tape Width Devices Per Reel SOP- 24 24 21.3 1000 TSSOP- 24 16 21.3 2000