APA2020ARI-TR

APA2020A ANPEC | Alldatasheet

Document overview

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Technical content

Features

• •••• Low Supply Current , IDD= 8mA at Stereo BTL
• Low Shutdown Current , IDD= 0.5µA
• Depop Circuitry Integrated
• Low Supply Voltage
• Thermal Shutdown Circuitry Integrated
• Output Power at 1% THD+N , VDD=5V - 1.8 W/Ch (typ) into a 4 Ω Load - 1.2 W/Ch (typ) into a 8 Ω Load
• Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation
• Various 24-Pin Power Packages Available SOP , TSSOP-P
• High Supply Voltage Ripple Rejection

Applications

Ordering Information

Temp. Range Package Code Package Code K : SOP R : TSSOP-P * Temp. Range I: - 40 to 85 C Handling Code TU : Tube TR : Tape & Reel TY : Tray * TSSOP-P is a standard TSSOP package with a thermal pad exposure on the bottom of the package. The APA2020A is a stereo bridge-tied audio power amplifier in various 24-pin power packages , includ- ing SOP , TSSOP-P. When connecting to a 5V volt- age supply , the APA2020A is capable of delivering 1.8W/1.2W of continuous RMS power per channel into 4 Ω/8Ω loads with less than 1% THD+N , respectively. The APA2020A simplifies design and frees up board space for other features .

• Stereo Audio Power Amplifier for Notebook Computer The APA2020A also served well in low-voltage applications , which provides 800-mW per channel into 4Ω loads with a 3.3V supply voltage . Both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA2020A , that reduces pops and clicks noise during power up and when using the shutdown or mute modes and protects the chip from being destroyed by over-temperature failure. To simplify the audio system design in notebook computer applications , the APA2020A combines a stereo bridge-tied loads (BTL) mode for speaker drive and a stereo single-end (SE) mode for headphone drive into a single chip , where both modes are easily switched by the SE/BTL input control pin signal . For power sensitive applications , the APA2020A also features a shutdown function which keeps the supply current only 0.5 µA (typ) .

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw2 Block Diagram MUX MUX MUX SE/BTL (Over operating free-air temperature range unless otherwise noted.) Symbol Parameter Rating Unit VCC Supply Voltage 6 V TA Operating Ambient Temperature Range -40 to 85 °C TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -65 to +150 °C TS Soldering Temperature,10 seconds 300 °C VESD Electrostatic Discharge -3000 to 3000 *1 -200 to 200 *2 V Absolute Maximum Ratings Note: 1. Human body model : C=100pF , R=1500 Ω , 3 positive pulses plus 3 negative pulses 2. Machine model : C=200pF , L=0.5mH , R=0 Ω , 3 positive pulses plus 3 negative pulses

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw3 Recommended Operating Conditions Min. Typ. Max. Unit Supply Voltage, V DD 35 5 . 5 V VDD= 5 V , 4 - Ω stereo BTL drive, 250mW/Ch average power, with proper PCB d e s i g n -20 85Operating free-air temperature, T A VDD= 5 V , 3 - Ω stereo BTL drive,

2 W/Ch average power, with proper PCB design

f o r c e d - a i r c o o l i n g -20 85 VDD=5 V 1.25 4.5Common mode input voltage, V ICM VDD=3.3V 1.25 2.7 V AC Operating Characteristics , VDD= 5V , TA= 25°C , RL= 4Ω (unless otherwise noted) APA2020ASymbol Parameter Test Condition Min. Typ . Max. Unit THD = 10% , BTL , R L=4Ω R L=8Ω 2.3 1.5 THD = 1% , BTL , R L=4Ω R L=8Ω 1.8 1.2 W THD = 10% , SE , R L=4Ω R L=8Ω 650 400 P(out) Output power (each channel ) see Note 1 THD = 1% , SE , R L=4Ω R L=8Ω THD = 0.5% , SE , R L=32 Ω 500 320 mW PO = 1.6W , BTL , R L=4Ω PO = 1W , BTL , R L=8Ω PO = 78mW , SE ,R L=32Ω 300 150 THD + N Total harmonic distortion plus noise V1 = 1V , R L=4Ω , G = 1 10 BOM Maximum output power bandwidth G = 10 , THD < 1% >20 KHz RL = 4Ω , BTL 72 RL = 4Ω , Open Load 71 Phase margin RL = 4Ω , SE 52 Electrical Characteristics (Cont.)

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw4 Electrical Characteristics (Cont.) AC Operating Characteristics , VDD= 5V , TA= 25°C , RL= 4Ω (unless otherwise noted) APA2020ASymbol Parameter Test Condition Min. Typ . Max. Unit PSRR Power supply ripple rejection f =100 Hz 80 dB Mute attenuation 85 dB Channel-to-channel output separation 85 dB Line HP input separation 75 dB BTL attenuation in SE mode 80 dB ZI Input impedance 2 MΩ Signal-to-noise ratio Po = 500 mW , BTL 90 dB Vn Output noise voltage 80 µV(rms) Notes 1 : Output power is meaured at the output teminals of the IC at 1 KHz. APA2020ASymbol Parameter Test Condition Min. Typ . Max. Unit THD = 10% , BTL , R L=4Ω R L=8Ω 0.6 THD = 1% , BTL , R L=4Ω R L=8Ω 0.8 0.5 W THD = 10% , SE , R L=4Ω R L=8Ω 290 180 P(out) Output power (each channel ) see Note 2 THD = 1% , SE , R L=4Ω R L=8Ω THD = 0.5% , SE , R L=32 Ω 230 140 mW PO = 1.6W , BTL , R L=4Ω PO = 1W , BTL , R L=8Ω PO = 78mW , SE ,R L=32Ω 270 150 THD + N Total harmonic distortion plus noise V1 = 1V , R L=4Ω , G = 1 10 BOM Maximum output power bandwidth G = 10 , THD < 1% >20 KHz RL = 4Ω , BTL 92 RL = 4Ω , Open Load 70 Phase margin RL = 4Ω , SE 57 AC Operating Characteristics , VDD= 3.3V , TA= 25°C , RL= 4Ω (unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw5 Electrical Characteristics (Cont.) AC Operating Characteristics , VDD= 3.3V , TA= 25°C , RL= 4Ω (unless otherwise noted) APA2020ASymbol Parameter Test Condition Min. Typ . Max. Unit PSRR Power supply ripple rejection f =100 Hz 70 dB Mute attenuation 85 dB Channel-to-channel output separation f =1 KHz 85 dB Line HP input separation 75 dB BTL attenuation in SE mode 80 dB ZI Input impedance 2 MΩ Signal-to-noise ratio Po = 500 mW , BTL 90 dB Vn Output noise voltage 50 µV(rms) Notes 2 : Output power is meaured at the output teminals of the IC at 1 KHz. APA2020Symbol Parameter Test Conditions Typ. Max. Unit Stereo BTL 8 11 mAV DD = 5V Stereo SE 4 6.5 mA Stereo BTL 7 9 mA IDD Supply Current V DD = 3.3 V Stereo SE 3.5 5.6 mA VO (DIFF) DC Differential Output Voltage V DD =5V, Gain = 2, see Note3 5 25 mV IDD(MUTE ) Supply Current in Mute Mode V DD = 5V 8 11 mA ISD IDD in Shutdown V DD = 5V 0.5 5 µA Note 3 : at 3V<VDD<5V , the DC output voltage is approximately VDD / 2. A

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw6 Pin Description MUTE OUT LBYPASS SHUTDOWN GND/HS T J LOUT+ LLINEIN LHPIN LOUT- LVDD GND/HS MUTE IN GND/HS NC ROUT+ RLINEIN RHPIN ROUT- RVDD GND/HS SE/BTL RBYPASS NC HP/LINE Top View Bottom View Thermal Pad For SOP and TSSOP-P For TSSOP-P Only Pin Name No I/O

Description

GND/HS 1,12, 13,24 Ground connection for circuitry, directly connected to thermal pad (only in TSSOP-P package). TJ 2 O Shutdown mode control signal input, sources a current proportional to the junction temperature. This pin should be left unconnected during normal operation. For more information, see the junction temperature measurement section of this document. LOUT + 3 O Left channel + output in BTL mode, + output in SE mode. L LINE IN 4 I Left channel line input, selected when HP/ LINE pin (16) is held low. LHP IN 5I Left channel headphone input, selected when HP/ LINE pin (16) is held high. LBYPASS 6 Connect to voltage divider for left channel internal mid-supply bias. LVDD 7 I Supply voltage input for left channel and for primary bias circuits. SHUTDOWN 8 I Shutdown mode control signal input, places entire IC in shutdown mode when held high, I DD = 0.5 µA. MUTE OUT 9 O Follows MUTE in pin (11), provides buffered output. LOUT - 10 O Left channel - output in BTL mode, high-impedance state in SE mode. MUTE IN 11 I Mute control signal input, hold low for normal operation, hold high to mute. SE/BTL 14 I Mode control signal input, hold low for BTL mode, hold high for SE mode. ROUT- 15 O Right channel - output in BTL mode, high impedance state in SE mode. HP/ LINE 16 I MUX control input, hold high to select headphone inputs (5,20), hold low to select line inputs (4,21).

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw21 SO – 300mil ( Reference JEDEC Registration MS-013) Millimeters Variations- D Inches Variations- D D See variations SO-24 15.20 15.60 D See variations SO-24 0.599 0.614 H 10 10.65 H 0.394 0.419 L 0.40 1.27 L 0.016 0.050 N See variations N See variations φ 10 ° 8°φ 10 ° 8° N 12 3 EH D L GAUGE PLANE e B A1 A Packaging Information

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw22 TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153) Millimeters Inches Dim Min. Max. Min. Max. A 1.2 0.047 A1 0.00 0.15 0.000 0.006 A2 0.80 1.05 0.031 0.041 D 6.4 (N=20PIN) 7.7 (N=24PIN) 9.6 (N=28PIN) 6.6 (N=20PIN) 7.9 (N=24PIN) 9.8 (N=28PIN) 0.252 (N=20PIN) 0.303 (N=24PIN) 0.378 (N=28PIN) 0.260 (N=20PIN) 0.311 (N=24PIN) 0.386 (N=28PIN)

4.2 BSC (N=20PIN)

4.7 BSC (N=24PIN)

3.8 BSC (N=28PIN)

0.165 BSC (N=20PIN)

0.188 BSC (N=24PIN)

0.150 BSC (N=28PIN)

e 0.65 BSC 0.026 BSC E 6.40 BSC 0.252 BSC E1 4.30 4.50 0.169 0.177

3.0 BSC (N=20PIN)

3.2 BSC (N=24PIN)

2.8 BSC (N=28PIN)

0.118 BSC (N=20PIN)

0.127 BSC (N=24PIN)

0.110 BSC (N=28PIN)

L 0.45 0.75 0.018 0.030 L1 1.0 REF 0.039REF R 0.09 0.004 R1 0.09 0.004 S 0.2 0.008 φ1 0° 8° 0° 8° φ2 12 ° REF 12 ° REF φ3 12 ° REF 12 ° REF BOTTOM VIEW (THERMALLY ENHANCED VARIATIONDS ONLY) b A D e 2 x E / 2 E1 E e/2 N 12 3 EXPOSED THERMAL PAD ZONE L (L1) (3 ) S (2 ) 0.25 GAUGE PLANE Packaging Information

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw23 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183°C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) 120 seconds max Temperature maintained above 183°C 60 – 150 seconds Time within 5°C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C 215-219 °C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw24 Application A B C J T1 T2 W P E 330±1 62 ±1.5 12.75 ± F D D1 Po P1 Ao Bo Ko tSOP- 24 ( m m ) Reliability test program Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C , 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @ 125 °C PCT JESD-22-B, A102 168 Hrs, 100 % RH , 121 °C TST MIL-STD-883D-1011.9 -65°C ~ 150 °C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms , I tr > 100mA Carrier Tape & Reel Dimensions A J B C t Ao E W Po P Ko Bo D F

Copyright  ANPEC Electronics Corp. Rev. A.5 - July., 2002 APA2020A www.anpec.com.tw25 Application Carrier Width Cover Tape Width Devices Per Reel SOP- 16 / 20 / 24 / 28 24 21.3 1000 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions