AN5870K PANASONIC | Alldatasheet

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Wide bandwidth analog switch IC n Overview The AN5870K is a wide bandwidth analog switch IC of 300 MHz operation. It is usable for RGB signal and horizontal/vertical synchronizing signals, and it has a built-in 75 W driver for video signal. In addition, it has also realized a high speed operation by the adoption of CMOS process for its sync. signal processing circuit. It is usable in a broad range from a popular type monitor to a high definition monitor. n Features

  • 2-input 1-output circuit (DC switch type)
  • Built-in 6 dB amplifier for RGB signal (1.5 dB for 75 W termination)
  • Built-in sync. separation circuit (Supporting sync. on green and power save)
  • Higher speed horizontal / vertical sync. signal circuit (tdelay = 20 ns) n Applications
  • Monitors SDIP030-P-0400 Unit: mm 3° to 15° 26.7–0.3 0.5–0.1 1.0–0.25 3.3–0.254.7–0.25 0.35-0.05 +0.1 8.6–0.3 0.9–0.25 10.16–0.25 1.778

V CC1 (5 V) V CC1 (5 V) GND (B) V CC1 (5 V) G-in1 B-in1 B-in2 G-in2 GND (R) GND (G) V CC2 (12 V) R-out V CC2 G-out GND (R, G, B) G sync. B-out SW Sync. in H-out V-out GND (HV , HSEP, SW) V-in2 GND (R, G, B) 6 dB 6 dB 6 dB Sync. sepSw select bias Hsync detect sw H Pdet.

Pin No. Description

1 R input 1

2 GND (R)

3 R input 2

4V CC1 5 V (G sync.)

5 G input 1

6 GND (G)

7 G input 2

8V CC1 5 V (RGB)

9 B input 1

10 GND (B)

11 B input 2

12 V CC1 5 V (HV, HSEP, SW)

13 H input 1

14 H input 2

15 V input 1

Pin No. Description

16 V input 2

17 GND (HV, HSEP, SW)

18 V output

19 H output

20 H detect

21 Sync. input 22 SW

23 B output

24 GND (RGB)

25 G sync. output

26 GND (RGB)

27 G output

28 V CC2 12 V (RGB)

29 R output

30 V CC2 12 V (RGB)

Parameter Symbol Rating Unit Supply voltage V CC1 (pin 4, pin 8, pin 12) 5.5 V V CC2 (pin 28, pin 30) 12.9 Supply current I CC1 (pin 4, pin 8, pin 12) 22.5 mA ICC2 (pin 28, pin 30) 75.8 Power dissipation *2 PD 1.143 W Operating ambient temperature *1 Topr -20 to +70 °C Storage temperature *1 Tstg -55 to +150 °C n Absolute Maximum Ratings Note) For the precautions related to surge and latch-up, refer to "n Usage Notes". *1: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C. *2: The power dissipation shown is for the independent IC package without a heat sink in free air at Ta = 70°C n Recommended Operating Range Parameter Symbol Range Unit Supply voltage V CC1 4.5 to 5.25 V V CC2 10.5 to 12.6

Parameter Symbol Conditions Min Typ Max Unit Power supply Supply current (1) I CC1 Current at V4, V8, V12 = 5 V 13.0 16.0 19.0 mA Supply current (2) I CC2 Current at V28, V30 = 12 V 46.0 60.0 70.0 mA Signal processing system Input DC voltage 1 V I1 Pin 22: 0 V, pins 1, 5, 9: DC 2.6 2.9 3.2 V Input DC voltage 2 V I2 Pin 22: 5 V, pins 3, 7, 11: DC 2.6 2.9 3.2 V Output DC voltage 1 V O1 Pin 22: 0 V, pins 23, 27, 29: DC 5.7 6.2 6.7 V Output DC voltage 2 V O2 Pin 22: 5 V, pins 23, 27, 29: DC 5.7 6.2 6.7 V Output DC voltage 3 V O3 Pin 25: DC 1.9 2.3 2.7 V Input impedance (1) R I1 Pin 22: 0 V, pins 1, 5, 9: Measurement85 100 115 k W Input impedance (2) R I2 Pin 22: 5 V, pins 3, 7, 11: Measurement85 100 115 k W Output impedance (1) R O1 Pin 23, 27, 29: Measurement 60 70 80 W Output impedance (2) R O2 Pin 25: Measurement 50 70 90 W Gain (1) G V1 Pin 22: 0 V, pins 1, 5, 9: SG1 signal, 0.5 1.5 2.5 dB pins 23, 27, 29: Measurement Relative gain (1) DG V1 Relative difference to GV1 - 0.4 0.0 0.4 dB Gain (2) G V2 Pin 22: 5 V, pin 3, 7, 11: SG1 signal, 0.5 1.5 2.5 dB pins 23, 27, 29: Measurement Relative gain (2) DG V2 Relative difference to GV2 - 0.4 0.0 0.4 dB Gain (3) G V3 Pin 22: 0 V or 5 V, pin 5 or 7: SG1 signal,-2.0 - 0.5 0.5 dB pins 23, 27, 29: Measurement Frequency characteristics 1 f C1 Pin 22: 0 V, difference from GV1 , -1.3 - 0.3 0.7 dB (100 MHz) pins 1, 5, 9: SG4 signal, pins 23, 27, 29: Measurement Relative frequency DfC1 Relative difference to fC1 - 0.5 0.0 0.5 dB characteristics 1 (100 MHz) Relative frequency f C2 Pin 22: 5 V, difference from GV2 , -1.3 - 0.3 0.7 dB characteristics 2 pins 3, 7, 11: SG4 signal, (100 MHz) pins 23, 27, 29: Measurement Relative frequency DfC2 Relative difference to fC2 - 0.5 0.0 0.5 dB characteristics 2 (100 MHz) Crosstalk between RGB 1 CTC 1 Pin 22: 0 V, pin 1 or 5 or 9: SG2 signal,¾- 50 -45 dB (10 MHz) pins 23, 27, 29: Measurement Crosstalk between RGB 2 CTC 2 Pin 22: 5 V, pin 3 or 7 or 11: SG2 signal,¾- 50 -45 dB (10 MHz) pins 23, 27, 29: Measurement Crosstalk between 2 inputs (1) CTI1 Pin 22: 5 V, pin 1 or 5 or 9: SG2 signal,¾- 60 -50 dB (10 MHz) pins 29, 27, 23: Measurement Crosstalk between 2 inputs (2) CTI2 Pin 22: 0 V, pin 3 or 7 or 11: SG2 signal,¾- 60 -50 dB (10 MHz) pins 29, 27, 23: Measurement n Electrical Characteristics at Ta = 25°C

Parameter Symbol Conditions Min Typ Max Unit HV circuit system High level output voltage (1) VOH(H) Pin 20: 2.5 V, pin 19: Measurement, 4.5¾ 5.0 V pin 13 or 14: 5 V, pin 22: 0 V or 5 V High level output voltage (2) VOH(V) Pin 18: Measurement, 4.5 ¾ 5.0 V pin 15 or 16: 5 V, pin 22: 0 V or 5 V Low level output voltage (1) VOL(H) Pin 20 2.5 V, pin 19: Measurement, 0.0¾ 0.5 V pin 13 or 14: 0 V, pin 22: 0 or 5 V Low level output voltage (2) VOL(V) Pin 18: Measurement, 0.0 ¾ 0.5 V pin 15 or 16: 0 V, pin 22: 0 V or 5 V Input threshold voltage (1) VITH(H) Pin 20: 2.5 V, pin 19: Measurement, 1.2 1.5 1.8 V pin 13 or 14: 0 to 5 input, pin 22: 0 V or 5 V Input threshold voltage (2) VITH(V) Pin 18: Measurement, 1.2 1.5 1.8 V pin 15 or 16: 0 to 5 input, pin 22: 0 V or 5 V HDET voltage V O(DET) Pin 22: 0 V, pin 13: SG6 signal, 2.2 2.5 2.8 V pin 20: DC measurement Sync. separation circuit system Input clamp voltage V C1 Pin 21: DC measurement 1.0 1.35 1.7 V Minimum sync. separation level VSmin Pin 21: SG8 signal, ¾¾ 100 mV pin 19: Sync. level measurement SW System Switch threshold voltage V ITH(SW) Measurement when pin 15: DC 5 V, 1.2 1.7 2.2 V pin 16: DC 0 V, pin 22: 0 V to 2.5 V and pin 18: Becomes 0 V Signal processing system Input dynamic range (1) V DI1 Pin 22: 0 V, pins 1, 5, 9: Input sweep, 2.5 3.0¾ V pins 23, 27, 29: Measurement Input dynamic range (2) V DI2 Pin 22: 5 V, Pin 3, 7, 11: Input sweep, 2.5 3.0 ¾ V pins 23, 27, 29: Measurement G-sync. dynamic range V D0 Pin 22: 0 V or 5 V, pin 5 or 7: 2.5 3.0 ¾ V Input sweep, pin 25: Measurement fluctuation (1) like G V1 , GV2 , difference from typ. fluctuation (2) like G V1 , GV2 , difference from typ. Frequency characteristics 3 f C3 Pin 22: 0 V, difference form value -3.5 -2.0 - 0.5 dB (300 MHz) at 1MHz, pins 1, 5, 9: SG5 signal, pins 23, 27, 29: Measurement Relative frequency DfC3 Relative difference to fC3 -1.5 0.0 +1.5 dB characteristics 3 (300 MHz) Frequency characteristics 4 f C4 Pin 22: 5 V, difference form value -3.5 -2.0 - 0.5 dB (300 MHz) at 1 MHz, pins 3, 7, 11: SG5 signal, pins 23, 27, 29: Measurement n Electrical Characteristics at Ta = 25°C (continued)

Parameter Symbol Conditions Min Typ Max Unit Signal processing system (continued) Relative frequency DfC4 Relative difference to fC4 -1.5 0.0 +1.5 dB characteristics 4 (300 MHz) G-sync. frequency characteristics fCGS Pin 22: 0 V or 5 V, pin 5 or 7: SG3-4.0 -2.5 -1.0 dB (35 MHz) signal, pin 25: Measurement Relative gain between 2 inputsDG VCH1 Relative difference at 1 MHz between- 0.5 0.0 +0.5 dB same channel of GV1 and GV2 Relative frequency characteristicsDfC1 Relative difference at 100 MHz between- 0.5 0.0 +0.5 dB between 2 inputs (1) the same channels of f C1 and fC2 Relative frequency characteristicsDfC2 Relative difference at 300MHz between-1.0 0.0 +1.0 dB between 2 inputs (2) the same channels of f C3 and fC4 Crosstalk between RGB 3 CTC 3 Pin 22: 0 V, pin 1 or 5 or 9: SG4 signal,¾- 40 -30 dB (100 MHz) pins 23, 27, 29: Measurement Crosstalk between RGB 4 CTC 4 Pin 22: 5 V, pin 3 or 7 or 11: SG4 signal,¾- 40 -30 dB (100 MHz) pins 23, 27, 29: Measurement Crosstalk between 2 inputs (3) CTI3 Pin 22: 5 V, pin 1 or 5 or 9: SG4 signal,¾- 50 -40 dB (100 MHz) pins 29, 27, 23: Measurement Crosstalk between 2 inputs (4) CTI4 Pin 22: 0 V, pin 3 or 7 or 11: SG4 signal,¾- 50 -40 dB (100 MHz) pins 29, 27, 23: Measurement Crosstalk between RGB 5 CTC 5 Pin 22: 0 V, pin 1 or 5 or 9: SG5 signal,¾- 25 ¾ dB (300 MHz) pins 23, 27, 29: Measurement Crosstalk between RGB 6 CTC 6 Pin 22: 5 V, pin 3 or 7 or 11: SG5 signal,¾- 25 ¾ dB (300 MHz) pins 23, 27, 29: Measurement Crosstalk between 2 inputs 5 CTI5 Pin 22: 5 V, pin 1 or 5 or 9: SG5 signal,¾- 30 ¾ dB (300 MHz) pins 23, 27, 29: Measurement Crosstalk between 2 inputs 6 CTI6 Pin 22: 0 V, pin 3 or 7or 11: SG5 signal, ¾- 30 ¾ dB (300 MHz) pins 23, 27, 29: Measurement Rise time (1) t r1 Pin 22: 0 V, pin 1 or 5 or 9: SG9 signal,¾ 1.2 ¾ ns pins 23, 27, 29: Measurement Rise time (2) t r2 Pin 22: 5 V, pin 3 or 7or 11: SG9 signal,¾ 1.2 ¾ ns pins 23, 27, 29: Measurement Fall time (1) t f1 Pin 22: 0 V, pin 1 or 5 or 9: SG9 signal,¾ 1.2 ¾ ns pins 23, 27, 29: Measurement Fall time (2) t f2 Pin 22: 5 V, pin 3 or 7or 11: SG9 signal,¾ 1.2 ¾ ns pins 23, 27, 29: Measurement Output VSWR/75 WG o Pin 23 or 27 or 29: SG5 signal, ¾ 1.6 ¾ voltage standing ratio measurement n Electrical Characteristics at Ta = 25°C (continued)

Parameter Symbol Conditions Min Typ Max Unit HV circuit system Rise time (1) t r(H) Pin 19: Measurement, pin 13 or 14:¾ 2 ¾ ns SG6 signal, pin 22: 0 V or 5 V Rise time (2) t r(V) Pin 18: Measurement, pin 13 or 14:¾ 2 ¾ ns SG6 signal, pin 22: 0 V or 5 V Fall time (1) t f(H) Pin 19: Measurement, pin 13 or 14:¾ 2 ¾ ns SG6 signal, pin 22: 0 V or 5 V Fall time (2) t f(V) Pin 18: Measurement, pin 13 or 14:¾ 2 ¾ ns SG6 signal, pin 22: 0 V or 5 V Rise delay time (1) t rD(H) Pin 19: Measurement, pin 13 or 14:¾ 20 50 ns SG6 signal, pin 22: 0 V or 5 V Rise delay time (2) t rD(V) Pin 18: Measurement, pin 13 or 14:¾ 10 40 ns SG6 signal, pin 22: 0 V or 5 V Fall delay time (1) t fD(H) Pin 19: Measurement, pin 13 or 14:¾ 15 45 ns SG6 signal, pin 22: 0 V or 5 V Fall delay time (2) t fD(V) Pin 18: Measurement, pin 13 or 14:¾ 10 40 ns SG6 signal, pin 22: 0 V or 5 V Output impedance (3) R O3 Pin 18 or 19: Measurement ¾ 70 ¾W Sync. separation circuit system Rise time t r(SY) Pin 21: SG7 signal, ¾ 2 ¾ ns pin 19: Measurement Fall time t f(SY) Pin 21: SG7 signal, ¾ 2 ¾ ns pin 19: Measurement Rise delay time t rD(SY) Pin 21: SG7 signal, ¾ 2 ¾ ns pin 19: Measurement Fall delay time t fD(SY) Pin 21: SG7 signal, ¾ 2 ¾ ns pin 19: Measurement Slice level I S1 Pin 21: 2 V, pin 21 sink current value 4.2 5.6 7.0 mA measurement n Electrical Characteristics at Ta = 25°C (continued)

n Electrical Characteristic (continued)

  • Input signal for testing Name Input signal Sine wave (f = 1 MHz, amplitude 1 V[p-p]) SG1 SG2 Sine wave (f = 10 MHz, amplitude 1 V[p-p]) SG3 Sine wave (f = 35 MHz, amplitude 1 V[p-p]) SG4 Sine wave (f = 100 MHz, amplitude 1 V[p-p]) SG5 Sine wave (f = 300 MHz, amplitude 1 V[p-p]) Square wave (f = 62.5 kHz, amplitude 5 VOP , duty cycle 50%) SG6 Square wave (f = 62.5 kHz, amplitude 1 V[p-p], low period 1 ms) SG7 SG8 Square wave (f = 62.5 kHz, amplitude 0.1 V[p-p], low period 1 ms) SG9 Square wave (f = 62.5 kHz, amplitude 0.7 V[p-p], low period 1 ms)

1 V[p-p]

n Terminal Equivalent Circuits Pin No. Equivalent circuit Description Pin voltage (V) 1 R signal input pin 1: Input with sync. signal Input through a capacitor (typ.)

1.0 V[p-p]

DC 2.9 V 2 ¾ GND pin for 5 V: For R signal circuit GND 3 R signal input pin 2: Input with sync. signal Input through a capacitor (typ.) DC 2.9 V 4 ¾ Power supply pin for 5 V: 5 V For G sync. circuit output

5 Refer to pin 1 G signal input pin 1: Refer to pin 1

6 ¾ GND pin for 5 V: For G signal circuit GND

7 Refer to pin 3 G signal input pin 2: Refer to pin 3

8 ¾ Power supply pin for 5V: 5 V For RGB signal circuit

9 Refer to pin 1 B signal input pin 1: Refer to pin 1

10 ¾ GND pin for 5 V: For B signal circuit GND

11 Refer to pin 3 B signal input pin 2: Refer to pin3

12 ¾ Power supply pin for 5 V: 5 V HV • Sync. separation

  • For SW circuit Pins 1,5,9

5 V (pin 8)

2.9 V 140 mA 1 mF 75 W Pins 3,7,11 2.9 V 140 mA 1 mF 75 W

Pin No. Equivalent circuit Description Pin voltage (V) 13 H. sync. signal input pin 1: (typ.) High-level: 5 V Low-level: 0 V threshold voltage: 1.5 V 14 H. sync. signal input pin 2: (typ.) High-level: 5 V Low-level: 0 V threshold voltage: 1.5 V 15 Refer to pin 13 V sync. signal output pin 1: Refer to pin 13 16 Refer to pin 14 V sync. signal output pin 2: Refer to pin 14 17 ¾ GND pin for 5 V: GND HV • Sync. separation

  • For SW circuit 18 V sync. signal output pin: (typ.) High-level: 5 V Low-level: 0 V 19 H. sync. signal output pin: n Terminal Equivalent Circuits (continued) Pins 13,15

5 V (pin 12)

Pins 14,16 Pins 18,19

Pin No. Equivalent circuit Description Pin voltage (V) 20 H. sync. signal detection pin: When detecting high-level

  • Pin 20 gives priority to high-level signal signal output (typ.) H. sync. signal present: 2.5 V H. sync. signal output H. sync. not present: Sync. separation circuit output 21 Sync. separation circuit input pin: Sync. signal
  • Sync. slice level is determined by (typ.) the external resistor R. Referring to0.3 V[p-p] the following equation, adjust sliceDC 1.35 V level according to equipment set; Slice level = R · 5.6 (mA) Input frequency · Sync. width
  • Open when the pin is unused. 22 Input changeover signal input pin: (typ.)
  • When input is high: Input pin 2 High-level: 5 V is selected (pins 3, 7, 11, 14, 16) Low-level: 0 V When input is low: Input pin 1 threshold voltage: is selected (pins 1, 5, 9, 13, 15) 1.7 V 23 B signal output pin: (typ.)
  • Be sure to connect a capacitor to DC 6.2 V output pin. If the pin is not used with a 75 W terminating resistor, do not allow a 20 mA or more output current flow. n Terminal Equivalent Circuits (continued) 100 mA 100 mA 2.5 V

0.1 mA 20 mA 50 mA 200 W 200 W 30 kW 1 kW R 0.15 mF 50 W 200 W 3.4 kW 5.6 mA 2.0 V 2.25 V

12 V (pin 28)

75 W 220 mF

0.01 mF 75 W 7.8 mA Pins 23,27,29

Pin No. Equivalent circuit Description Input resistance or pin voltage 24 ¾ GND pin for 12 V GND 25 Sync. on green signal Output pin: (typ.)

  • If terminating with a resistor, do DC 2.3 V not allow 10 mA or more output current flow. 26 ¾ • For RGB signal circuit GND For G sync. output

27 Refer to pin 23 G signal output pin: Refer to pin 23

  • Be sure to connect a capacitor to output pin. If the pin is not used with a 75 W terminating resistor, do not allow a 20 mA or more out- put current flow. 28 ¾ Power supply pin for 12 V: 12 V
  • For RGB signal circuit

29 Refer to pin 23 R signal output pin: Refer to pin 23

  • Be sure to connect a capacitor to output pin. If the pin is not used with a 75 W terminating resistor, do not allow a 20 mA or more output current to flow. 30 ¾ Power supply pin for 12 V: 12 V
  • For RGB signal circuit n Terminal Equivalent Circuits (continued)

5 V (pin 4)

2.1 mA

  • Operational explanation 1. SW block Switches over R, G, B, H, V signal of 2 systems. SW pin (pin 22) Selected pins In low-level R in 1 (pin 1), G in 1 (pin 5), B in 1 (pin 9), H in 1 (pin 13), V in 1 (pin 15) In high-level R in 2 (Pin 3), G in 2 (pin 7), B in 2 (pin 11), H in 2 (pin 14), V in 2 (pin 16) Input signal Output signal Sync.-in pin (pin 21) H-in pin (pin 13 · pin 14) H-out pin (pin 19) ll H-in signal l Sync.in signal l H-in signal DC (state of sync.-in pin) 2. High-level signal detection block Sync.-in pin (pin 21) is a pin for inputting the sync.-on green signal and it is separated into the composite sync. signal (composite sync.) inside. H-in 1 and 2 pins (pin 13 or pin 14) are input pins for the video signal and the separated horizontal signal. The high-level signal detection block discriminates the presence of H-in signal which is selected in SW block and provides the output to H-out pin (pin 19) in the following manner. H signal detection pin (pin 20) voltage becomes under 1 V or over 4 V if H. sync. signal is not inputted. The output signal for the H. sync. signal detection pin voltage becomes as follows and it has hysteresis characteristics. It is possible to adjust the H. sync. signal detection time by means of an external capacitor. 2V1V0V 1V 2.5V 4V 3V 5V When rising from 0 V (Detection voltage change) When detecting H. sync. signal (Sync.-in signal is selected when lowed under 1 V) When decreasing from 5 V Sync-in signal selection (Detection voltage change) (H-in signal is selected when lowed under 3 V) H. sync. signal detection pin voltage (H-in signal is selected if 2 V is exceeded) (Detection voltage change) H-in signal selection H. sync. signal detection pin voltage (Sync.-in signal is selected when 4 V is exceeded) (Detection voltage change) H. sync. signal detection pin voltageSync.-in signal selection
  1. About C22 0.01 mF capacitor (refer to n Application Circuit Example) In the case of evaluation board for this IC without heat sink, a resonance phenomena takes place at approx. 400 MHz between pin 23 B-out pin and pin 22 SW pin and affects the frequency characteristic of B-out pin. To solve the above problem, the correction can be made by attaching C22 0.01 mF capacitor between pin 22 SW pin and GND at a place as close to the IC as possible. In the case of using this IC, study if the correction is necessary. 2. About latch-up In our latch-up testing, a voltage charged to 200 pF capacitor is applied to the IC pin, in the state of providing only a voltage to the power supply pin of the IC, and we confirm that the latch-up does not occur up to 200 V. It is confirmed that this IC does not cause latch-up up to 200 V under a condition including the peripheral components. (Refer to n Application Circuit Example). Be careful to pin 20, pin 21, pin 28 and pin 30 which are especially weak. In the case of using this IC, the peripheral components to be attached externally should be placed as close to the IC as possible. n Application Circuit Example H-in1 H-in2 V-in1 R-in1 R-in2 V CC1 (5 V) G-in1 B-in1 B-in2 G-in2 R-out V CC2 (12 V) G-out G sync. B-out SW C22 Sync. in H-out V-out V-in2 V CC1 V CC2 1 mF 75 W –1% 75 W –1%V CC11 mF 75 W –1% V CC11 mF 75 W –1% V CC11 mF 75 W –1% V CC11 mF 75 W –1% V CC11 mF 75 W –1% 220 mF 0.01 mF V CC2 75 W –1% 220 mF 0.01 mF V CC2 75 W –1% 220 mF 0.01 mF 0.15 mF 0.1 mF 200 W 10 W 10 W 10 W 10 W 6 dB 6 dB 6 dB Sync. sepSw select bias Hsync detect sw