AN41400A PANASONIC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 19
Technical content
Datasheet sections
1Publication date: July 2010 SDL00016AEB DATA SHEET Part No. Package Code No. AN41400A UBGA019-W-2025AEB
Overview The AN41400A is a 1-ch motor drive IC. This IC features a low ON Resistance and a wide Operating Supply Voltage Range of power supply for motor drive. Adopting an Wafer Level Chip Size Package makes it possible to shrink the mounting area. Features y1-ch Motor drive IC yForward reverse drive is possible yIt is possible to drive not only a motor but also an actuator yLow ON Resistance : 0.19 Ω (Upper and Lower) yOperating Supply Voltage Range : Supply voltage range for control 2.7 V to 5.5 V ， Supply voltage range for drive 2.0 V to 13.8 V yDownsizing by adopting an Wafer Level Chip Size Package yAdditional features : Built-in Stand-by function Thermal shutdown circuit Low voltage detection circuit Applications yFor shutter, mirror, and lens of camera Package y19 pin Wafer Level Chip Size Package (WLCSP) (Size : 2.41 mm × 1.91 mm, 0.5 mm Pitch) Type y Bi-CDMOS IC
Application Circuit Example (Block Diagram) VPUMP
5 V 47 μF
8 V47 μF
0.1 μF (Strength voltage ≥ VM + 6 V） Output Error Detection Notes) y This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified. y This application circuit is shown as an example but does not guarantee the design for mass production set. 0.01 μF (Strength voltage ≥ VM + 6 V） 0.01 μF (Strength voltage ≥ VM + 6 V）
Pin Descriptions Ground 1 for motor driveGroundPG1D5 Ground 2 for motor driveGroundPG2D4 Power supply 1 for motor drivePower supplyVM1D3 Ground 3 for motor driveGroundPG3D1 Inverting output 1OutputRO1C5 Inverting output 2OutputRO2C4 Power supply 2 for motor drivePower supplyVM2C3 Non-inverting output 1OutputFO1C2 Non-inverting output 2OutputFO2C1 Non-inverting inputInputINAB5 Inverting inputInputINBB4 Total shutdown inputInputSTBYB3 Charge pump capacitor connection 2OutputBC2B2 Charge pump capacitor connection 1OutputBC1B1 Ground for control circuitGroundGNDA5 Power supply for control circuitPower supplyVDDA4 Charge pump capacitor connection 4OutputBC4A2 Charge pump outputOutputVPUMPA3 Charge pump capacitor connection 3OutputBC3A1 DescriptionTypePin namePin No. Pin Configuration (Bottom View) A 23 45 B C D PG3 VM1 PG2 PG1 FO2 VM2 RO2 RO1FO1 BC1 STBY INB INABC2 BC3 V PUMP VDD GNDBC4
Absolute Maximum Ratings Operating Supply Voltage Range mA±2 000 (100 ms)I(p) peak3 mA±3 500 (10 ms)I(p) peak2 mA±6 000 (1 ms)I(p) peak1 Notes n = B3, B4, B5VGND to V DDV(n)Control signal input voltage8 m = C1, C2, C4, C5V14.7V(m)Drive output voltage7 p = C1, C2, C4, C5 mA±1 200 (DC)I(p) DC Drive output current6 1 200IM 14.0VM —mA 100IDD Supply current2 Appropriate Pin No.A No.RatingSymbolParameterA No. —°C–55 to +150TstgStorage temperature5 —°C–30 to +85ToprOperating ambient temperature4 —mW92PDPower dissipation3 6.0VDD Supply voltage1 13.8 Max 7.4 Typ 5.53.3 2.0VM NotesUnitMinSymbolParameter V 2.7VDD Supply voltage range Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Notes) *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. The voltage of the charge pump circuit voltage will exceed the supply voltage. The limit voltage of the charge pump is shown on page 8. *2: The power dissipation shown is the value at T a = 85°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to the • PD-Ta diagram in the Technical Data and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3: Except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for Ta = 25°C. *4: Design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the time conditions which the drive output current ±6 000 mA is allowed within 1 ms and ±3 500 mA is allowed within 10 ms and ±2 000 mA is allowed within 100 ms. However, the output frequency f requires that f ≤ 5 Hz. *5: Do not apply voltage or current from outside to these pin. The setting not exceeding the rating, even transiently, is required. For the circuit currents, '+' denotes current flowing into the IC, and '−' denotes current flowing out of the IC.
*1V−1.0 to 14.7FO1C2 *1V−1.0 to 14.7RO2C4 *1V−1.0 to 14.7RO1C5 *1V−1.0 to 14.7FO2C1 —VGND to VDDINAB5 —VGND to VDDINBB4 —VGND to VDDSTBYB3 *1VGND to 19.5BC2B2 *1VGND to VMBC1B1 *1VGND to 19.5BC4A2 GND to VMBC3 NoteUnitRatingPin namePin No. *1VGND to 19VPUMPA3 *1VA1 Allowable Current and Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for GND, PG1, PG2 and PG3. GND = PG1 = PG2 = PG3 y VDD is voltage for VDD. y VM is voltage for VM1 and VM2. VM = VM1 = VM2 y Do not apply external currents or voltages to any pin not specifically mentioned. y For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC. Note) *1 : Do not apply external voltage to this pin. The se tting not exceeding the rating, even transiently, is required.
—μs0.20.1——TFFall time15 —μs1.00.4——TPLHTurn on time16 —μs0.50.2——TPHLTurn off time17 —μA3316.58.3INA = INB = 3.3 VIINHINA, INB high level input current11 —μA——–1.0—IINLINA, INB low level input current12 —Ω0.240.19—Iout = ±500 mARON Output ON resistance (Upper and Lower)13 —μs0.20.1——TRRise time14 —V13.411.410.4IPUMP = –500 μAVPUMPLCharge pump current capability8 *1V0.5———VSBLSTBY low level input voltage5 —V13.412.411.4IPUMP = 0 AVPUMPCharge pump voltage7 *1V0.5———VINLINA, INB low level input voltage10 *1V——2.2—VINHINA, INB high level input voltage9 Driver Block COMMON BLOCK Supply Current mA2.01.4—INA = INB = LowIDDA Control power supply current under no input3 μA50——STBY = LowIVM Drive power supply current in standby mode1 μA10——STBY = LowIDDS Control power supply current in standby mode2 Standby Operation —kΩ300200100—RSTBYSTBY pull-down resistance6 *1V―—2.2—VSBHSTBY high level input voltage4 Charge Pump Circuit Limits Typ Unit Max Notes Min ConditionsSymbolParameterB No. Electrical Characteristics at VDD = 3.3 V, VM = 7.4 V, STBY = 3.3 V Note) T a = 25°C±2°C unless otherwise specified. Nots) *1 : Refer to page 10 for the mode setting.
—V—0.2——ΔVLVDHysteresis width —V—2.4——VLVD Operating voltage of low voltage detection Operation of low voltage detection —kHz300———fmaxInput signal frequency18 —°C—35——ΔTTSD Thermal shutdown hysteresis temperature22 —°C—160——TTSD Thermal shutdown operating temperature21 Thermal Shutdown Reference values Typ Unit Max Notes Min ConditionsSymbolParameterB No. Electrical Characteristics (Reference values for design) at VDD = 3.3 V, VM = 7.4 V, STBY = 3.3 V Notes) T a = 25°C±2°C unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns.
≥ 160°C ≤ 2.4 V Low LowLow HighLow LowHigh Output StateInput Logic < 160°C Temp. > 2.4 V > 2.4 V VDD High STBY Standby Thermal shutdown BrakeLowLow Reverse rotationHighLow Low voltage detection Mute Z *Z * Normal rotationLowHigh RO HighHigh Mode FOINBINA Note) * : Z means that output is Hi-Z. Control Pin Mode Table
Charge pump capacitor connection 1——B1 Charge pump capacitor connection 4——A2 Charge pump output—DC approx. 12.4 VA3 Power supply for control circuit—DC (Typ. 3.3 V)A4 A5 : Ground for control circuit D1 : Ground 3 for motor drive D4 : Ground 2 for motor drive D5 : Ground 1 for motor drive —DC 0 V A5, D1, D4, Charge pump capacitor connection 3——A1 Impedance DescriptionInternal circuitWaveform and voltage Pin No. 20 A1 VM (7.4 V) 20 B1 VM (7.4 V) 25k 20 A3 25k VM (7.4 V) 300k Technical Data y I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
Total shutdown input200 kΩ—B3 B4 : Inverting input B5 : Non-inverting input200 kΩ—B4, C1 : Non-inverting output 2 C2 : Non-inverting output 1 C4 : Inverting output 2 C5 : Inverting output 1 C1, C2, C4, C3 : Power supply 2 for motor drive D3 : Power supply 1 for motor drive—DC (Typ. 7.4 V) C3, Charge pump capacitor connection 2——B2 Impedance DescriptionInternal circuitWaveform and voltage Pin No. 152k 48k 142k 58k PinB4 VM (7.4 V) 25k Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
-30 -20 -10 1.5 2 2.5 3 3.5 4 VM [V] -40 -30 -20 -10 2.5 3 3.5 4 4.5 5 VDD [V] Ron changing rate －VDD Characteristics Ron changing rate －VM Characteristics –30°C 25°C 85°C –30°C 25°C 85°C Technical Data (continued) y Reference data Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. Ron changing rate [%]Ron changing rate [%]
Technical Data (continued) yPD ⎯ Ta diagram
y Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [For shutter, mirror, and lens of camera]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- V CC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safe ty including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 9. Due to unshielded structure of this IC, under exposure of li ght, function and characteristic of the product cannot be guaranteed. During normal operation or even under testing condition, please ensure that IC is not exposed to light. 10. Basically, chip surface is ground potential. Please design to ensure no contact between chip surface and metal shielding. Usage Notes
Usage Notes (continued) y Notes of Power LSI 1. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the LSI might be damaged before the thermal protection circuit could operate. 2. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 3. The product which has specified ASO (Area of Safe Operation) should be operated in ASO. 4. Verify the risks which might be caused by the malfunctions of external components.
- Make sure to power on, off, and sw itching under the standby mode (STBY = Low). 2. Apply voltage from a low-impedance source to VDD and VM. Connect a bypass capacitor to each as near the IC as possible. 3. In case of that the output is changed into Hi-Z (INA = INB = Low) in the rotation of motor, due to the motor current to flow back into a power source, the supply voltage might rise. 4. If the error detection circuit is active, all outputs are fixed in Hi-Z during the specified time (470 μs ±30%). The function is for safety improvements and is not guaranteed nondestructive control. 5. Check the characteristics carefully before using this IC. Preserve sufficient margin in consideration of dispersion of external components and our ICs including not only static characteristics but transition characteristics when using this IC changing external circuit constants. 6. Prohibit mounting with solder dippin g and mounting to a flexible cable. 7. The heat thermal resistance is variable due to the mounted status of this IC. To reduce the heat thermal resistance, it is recommended that the power supply and GND pins are connected to a wide metal layer as short as possible. Refer to the following figure shown an example of a wiring pattern. <Reference value> The heat thermal resistance value (for simulation) in case of the following wiring pattern example Rth(j-a) = 97°C/ W Condition : Glass-epoxy PWB, 50×50×0.8t (mm), 4-ply Example of a wiring pattern …Via … Wiring A 2345 B C D FO2 RO2 RO1FO1 BC1 STBY INB INABC2 BC3 V PUMP VDDBC4 PG3 VM1 PG2 PG1 VM2 GND IC (Top View) Usage Notes (continued)
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202