AN30180A

AN30180A PANASONIC | Alldatasheet

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Ver. AEB z Wide output voltage range : 1.15V to 2.80V z Input voltage range : 2.5V to 5.5V z Up to 1200mA Output Current z Load transient response is fast z Output current limit control of 1.8A to prevent Excessive current flows z High efficiency over a wide load current area by DCM (discontinuous conductive mode) operation at light loads, CCM (continuous conductive mode) operation in heavy loads those two modes can be automatically switched z Switching frequency of 2.6MHz during CCM. z 100% duty operation when input voltage goes down to output voltage. z 9 pin Wafer level chip size package (WLCSP Type) Size : 1.46 × 1.46 mm ( 0.5 mm pitch) High Current Distributed Power Systems such as power amplifier in cellular phone etc. SIMPLIFIED APPLICATION

APPLICATIONS

VIN = 2.5V to 5.5V 1.2A Synchronous DC-DC Step Down Regulator AN30180A is a synchronous DC-DC Step Down Regulator and employs the hysteretic control system. By this system, when load current charges suddenly, it responds at high speed and minimizes the changes of output voltage. Since it is possible to use capacitors with small capacitance and it is unnecessary to add external parts for system phase compensation, this IC realizes downsizing of set and reducing in the number of external parts. CNT1 CNT2 FB LX PGND PVIN VOUT VIN AN30180A AVIN AGND EN 0 100 1 10 100 1000 Load Current[mA] Efficiency[%] VIN=2.50V VIN=3.70V VIN=5.50V Notes) This application circuit is an example. The operation of mass production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment. 4.7 μF x 2 1.0 μH 4.7 μF EFFICIENCY CURVE Publication date: October 2012

Ver. AEB ABSOLUTE MAXIMUM RATINGS *3V– 0.3 to (VIN + 0.3)LXOutput Voltage Range *3V– 0.3 to (VIN + 0.3)FB,EN,CTL1,CTL2Input Voltage Range -kV2HBM (Human Body Model) *2°C– 40 to + 150TjOperating junction temperature ESD *2°C– 55 to + 150TstgStorage temperature NotesUnitRatingSymbolParameter *2°C– 30 to + 85ToprOperating free-air temperature *3V6.0VINSupply voltage Notes) Do not apply external currents and voltages to any pin not specifically mentioned. This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating. This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected. *1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2:Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25 °C. *3:V IN is voltage for AVIN, PVIN. AVIN = PVIN,(V IN + 0.3) V must not be exceeded 6 V. POWER DISSIPATION RATING Notes 0.148 W0.286 W436 °C /W9pin Wafer level chip size package (WLCSP Type) PD(Ta=85°C)PD(Ta=25°C)θJAPACKAGE Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power s upply voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not exceed the allowable value. *1:Glass Epoxy Substrate(4 Layers) [Glass-Epoxy: 50 X 50 X 0.8t(mm)] Die Pad Exposed , Soldered. CAUTION Although this has limited built-in ESD protection circuit, but permanent damage may occur on it. Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates

Ver. AEB RECOMMENDED OPERATING CONDITIONS Input Voltage Range Output Voltage Range *3VVIN + 0.3—–0 . 3LX *3VVIN + 0.3—–0 . 3CNT2 *3VVIN + 0.3—–0 . 3CNT1 *3VVIN + 0.3—–0 . 3EN *3VVIN + 0.3—–0 . 3FB 3.7 Typ. 5.5 Max. NotesUnitMin.SymbolParameter *2V2.5VINSupply voltage range Note) Do not apply external currents and voltages to any pin not specifically mentioned. Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for AGND, PGND. AGND = PGND Vin is voltage for AVIN, PVIN. AVIN = PVIN *1 : Please set the rising time of power input pin to the following range. In addition, please input the voltage with the rising time which has margin enough in consideration of the variation in external parts. *2 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *3 : (V IN + 0.3) V must not be exceeded 6 V. 0 V 100 μs < Tr < 1.5 ms (Tr is the rise time from 0 V to the setup voltage of V IN.)

Ver. AEB [DCDC Characteristics] (DCDC step down regulator) —μs120—— Load resistance = 12 Ω Settling time to reach 90 % of setting voltage from EN rising edge TSTURising Time MHz3.22.62.0IOUT = 600 mA ( CCM )FSWSW Frequency —Ω0.40.2—RONNNch-MOS ON Resistance —Ω0.40.2—RONPPch-MOS ON Resistance IOUT = 10 μA to 1200 mAREGLDLoad Regulation —% / V0.750.25— VIN = 2.5 V to 5.5 V, VOUT = 1.15 V IOUT = 600m A REGINLine Regulation —V2.8852.8002.715CNT1 = H , CNT2 = H IOUT = 600 mAVOUT4Output Voltage Setting 4 —V1.8551.8001.745CNT1 = L , CNT2 = H IOUT = 600 mAVOUT3Output Voltage Setting 3 —V1.3401.3001.260CNT1 = H , CNT2 = L IOUT = 600 mAVOUT2Output Voltage Setting 2 —V1.1851.1501.115CNT1 = L , CNT2 = L IOUT = 600 mAVOUT1Output Voltage Setting 1 [Current Consumption] (DCDC step down regulator) —μA10—EN = LISTBOFF Current Consumption —Ω2010—EN = LRDISOutput discharge resistance —μA8040—IOUT = 0A,VOUT = 1.15 V,IINQCurrent Consumption Limits Typ Unit Max Notes Min ConditionsSymbolParameter

ELECTRICAL CHARACTERISTICS

Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15 V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 °C ± 2 °C unless otherwise noted.

Ver. AEB —V——1.5VENTHEN Control Voltage H —μA10–1VIN = VEN = 5.5 VIENLEN Leak Current —V0.3——VCNT1 LCNT1 Control Voltage L —V——VIN – 0.3 VCNT1 HCNT1 Control Voltage H —μA10–1VIN = VCNT1 = 5.5 VICNT1LCNT1 Leak Current —V0.3——VCNT2 LCNT2 Control Voltage L —V——VIN – 0.3 VCNT2 HCNT2 Control Voltage H [Under Voltage Lock out] (DCDC step down regulator) —mV1257525VUHYUVLO Hysteresis Voltage —V2.52.42.3VIN rising to Start OperationVUONUVLO Detection Voltage [Logic Pin Characteristics] (DCDC step down regulator) —μA10–1VIN = VCNT2 = 5.5 VICNT2LCNT2 Leak Current —V0.3——VENTLEN Control Voltage L Limits Typ Unit Max Notes Min ConditionsSymbolParameter ELECRTRICAL CHARACTERISTICS (Continued) Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 °C ± 2 °C unless otherwise noted.

Ver. AEB *1μA—0—VIN = 5.5 V,SHUTDOWN, VLX = 0 V or 5.5 VILXLLX leak current *1%—82—VOUT = 1.3 V, IOUT = 200mAEF1Efficiency 1 *1mV[p-p]—5—VOUT = 1.15 V, IOUT=600mAVRPL1Output ripple voltage 1 *1mV[p-p]—20—VOUT = 1.15 V, IOUT = 10 μAVRPL2Output ripple voltage 2 *1mV—25— C = 4.7 μF, VOUT = 1.15 V, IOUT = 10 μA to 400 mA , Δ t = 1 μs VLSUOutput voltage fluctuation during load increase *1mV—50— C = 4.7 μF, VOUT = 1.15 V, IOUT = 400 mA to 10 μA, Δ t = 1 μs VLSDOutput voltage fluctuation during load decrease *1μs—5— VOUT = 1.15 V, IOUT = 10 μA to 400 mA, Δ t = 1 μs TLSUStabilization time when increased load current [DCDC] (DCDC step down regulator) *1A—1.8— at VOUT drops from 1.15 V to 1.035 V CNT1 = L , CNT2 = L ILMTOutput current limit Reference values Typ Unit Max Notes Min ConditionsSymbolParameter ELECRTRICAL CHARACTERISTICS (Continued) Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15V , VIN = AVIN = PVIN = 3.7 V, Ta = 25 °C ± 2 °C unless otherwise noted. *1 : Typical Value checked by design.

Ver. AEB PIN FUNCTION Power supply pinPower supplyAVINA1 Feed Back voltage pinInputFBA2 Ground pinGroundAGNDA3 Power supply pin for internal Power MOSPower supplyPVINB1 ON / OFF Control pinInputENB2 Output voltage control 2 pinInputCNT2B3 LX Terminal OutputOutputLXC1 Power GroundGroundPGNDC2 Output voltage control 1 pinInputCNT1C3 DescriptionTypePin namePin No. PIN CONFIGURATION Top View A1 A2 A3 B1 B2 B3 C1 C2 C3 Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section.

Ver. AEB FUNCTIONAL BLOCK DIAGRAM Notes) This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified. AGND AVIN FB LX CNT1 Control Logic Driver EN PGND PVIN CNT2 Timer Generator DAC BGR VREG 2.4V UVLO OSP OCP 1.24V ENC ON/OFF A1B2 A3 C2

Ver. AEB (1) Output ripple voltage VIN = 3.7 V, Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH Iout = 600 mA Iout = 1200 mA LX Vout LX Vout (2) Load transient response VIN = 3.7 V ,Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH Iout = 10 μA to 400 mA, Δ t = 1 μsec LX Vout Iout Iout = 400 mA to 10 μA, Δ t = 1 μsec LX Vout Iout TYPICAL CHARACTERISTICS CURVES

Ver. AEB (3) Efficiency 100 1 10 100 1000 Load Current[mA] Efficiency[%] VIN=2.50V VIN=3.70V VIN=5.50V (4) Load regulation 1.05 1.1 1.15 1.2 1.25 1.3 1.35 1.4 0 200 400 600 800 1000 1200 Load Current [mA] Output Voltage [V] VIN=2.50V VIN=3.70V VIN=5.50V TYPICAL CHARACTERISTICS CURVES (Continued)

Ver. AEB ON HighLow OFFON/OFF Control For DC-DCB2 Remarks Pin Voltage DescriptionPin No. CNT2CNT1Pin name

1.15 VLowLow

Pin Voltage (*1)

1.30 VLowHigh

1.80 VHighLow

2.80 VHighHigh

B3C3Pin No. OPERATION 1. Pin Setting

Ver. AEB OPERATION (Continued) 1. Power ON / OFF sequence VIN UVLO VOUT BGR (1)(2) (3) (5) DCDC_ON EN SS (4) 25 μs (1) When the EN pin is set to “High” after the VIN settles, the BGR start-up. (2) When the BGR exceeds its threshold value, the UVLO is released and the SS(SOFT START) sequence is enabled. During soft start the current limit of DC-DC Step Down Regulator is set to be lower than Normal current limit for preventing rush current. Internal circuit power supply is turned on and wait for the time determined by internal timer. (3) DCDC_ON is turned on then DC-DC Step Down Regulator is enabled. VOUT is risen up to reaches the set voltage. (4) After a Soft start timer current limit is set to be Normal current limit. (5) When the EN pin is set to “Low”, the BGR and UVLO stop operation. The VOUT pin voltage starts to drop by output discharge resister and load resistance. 2. Protection Output Over-Current Protection (OCP) function and Short-Circuit Protection (OSP) function (1) The Over-Current Protection is activated at about 1.8 A (Typ.). During the OCP, the output voltage continues to drop at the specified current. (2) The Short-Circuit Protection function is implemented when the output voltage decreases and the VFB pin reaches to about 70 % of the output voltage setting. (3) The OSP operates intermittently at 2ms-ON, 16ms-OFF intervals. Figure : OCP and OSP Operation Output current [A] Pendency characteristics (Ground short protection detection - about 70 % of Vout ) Intermittent operation area Over Current Protection (typ:1.8 A) Ground short protection hysteresis Output Voltage [V] about 150 mA (1) (2) (3) VOUT DCDC_ON OSP (3) IOUT (1) (2) 16 ms 2 ms 16 ms 2 ms SS (2) 1.3 to 2.3 A Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

Ver. AEB APPLICATIONS INFORMATION CNT1 CNT2 FB LX PGND PVIN VOUT VIN AN30180A AVIN AGND EN Cin1 Lout Cout —GRM21BB31E475KA75BMurata4.7 μF1Cin2 Note 1.0 μH 4.7 μF 4.7 μF Value QTY MIPSZ2012D1R0FDKLout GRM21BB31E475KA75BMurataCin1 GRM21BB31E475KA75BMurataCout Part NumberManufacturerReference Designator Figure Top Layer with silk screen ( Top View ) with Evaluation board Figure Bottom Layer with silk screen ( Bottom View ) with Evaluation board 1. Application circuit 2. Recommended component 3. Evaluation board layout Cin2 Notes) This application circuit and layout is an example. The opera tion of mass production set is not guaranteed. You should perform enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the above application circuit and information in the design of your equipment.

Ver. AEB PACKAGE INFORMATION (Reference Data) Bump : SnAgCu Reroute Material : Cu Body Material : Br/Sb Free Epoxy Resin Unit:mm Outline Drawing

Ver. AEB IMPORTANT NOTICE 1.The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. 2.When using the LSI for new models, verify the safety including the long-term reliability for each product. 3.When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. 4.The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. 5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 6.This LSI is intended to be used for general electronic equipment. Consult our sales staff in advance for information on the following applications: Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the LSI described in this book for any special application, unless our company agrees to your using the LSI in this book for any special application. 7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific product is designated by our company as compliant with the ISO/TS 16949 requirements. Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in this book for such application. 8.If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. 9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage incurred as a result of your using the LSI not complying with the applicable laws and regulations.

Ver. AEB USAGE NOTES 1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above- mentioned damage and smoke emission will depend on the current capability of the power supply. 7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work during normal operation. Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the LSI might be damaged before the thermal protection circuit could operate. 8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven. 9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO 10. Verify the risks which might be caused by the malfunctions of external components. 11. Connect the metallic plates on the back side of the LSI with their respective potentials (AGND, PVIN, LX). The thermal resistance and the electrical characteristics are guaranteed only when the metallic plates are connected with their respective potentials.

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202