AMS-01-15 AMMSEMI | Alldatasheet
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Technical content
American Microsemiconductor Inc. Page 1 of 1
133 Kings Road, Madison, NJ 07940 AS/EN/JISQ/ 9100:2009 REV C and ISO 9001:2008 Certificate No: 45325
tel. 973-377-9566 fax. 973-377-3078 http://www.americanmicrosemiconductor.com
FEATURES
VRRM Repeating Peak Reverse V oltage (kV): 15 TJMAX Max. junction temp.(°C) : 120 TSTG Storage temp. (°C): - 40 to +120 IO Avg. Forward Current (mA): 350 IFSM Forward Surge Current (A): 30
ELECTRICAL CHARACTERISTICS
IR1 Normal temp. Reverse Current ( μA) @ VR=VRRM: 2.0 max IR2 High temp. Reverse Current ( μA) @ VR=VRRM, Tamb=100°C: 50 max VF Forward Voltage Drop (V) @ IF=350mA: 10.5 TEST CONDITIONS High temp. Reverse V oltage @ 1000 hrs.: VRM=VRRM, f=50Hz, T AMB=100°C Half sine voltage with f=50Hz applied, T AMB=100°C High temp. storage @ 1000 Hrs.: TAMB=130±2°C Soldering Resistance Heat Test: Solder trough temp.: 350 ±10°C, Dip Time: 3.5s ± 0.5s High pressure smoke test @ 10 hrs.: 120°C, 2 x 10 5pa Insulation Resistance Test (1000M Ω): Between the center of the body and terminal (See Fig. 1) Insulation St rength Test @ 10KV: 1 min. between center of the body and terminal. (Fig.1 ) Lead bend test: Force 10 N to the lead, bent it to pos. and neg. 90° Lead pull test: Force 70 N of axial to the lea d for 1 min. Insulation resistance test condition: Measure between A and B by using a DC 500V Insulation resistance tester Insulation strength test condition: Apply half sine wave voltage with 10kV wave height between A and B in insulation liquid High Overload Surge Capacity Durable Epoxy Resin Package To order with quick disconnect terminals, use the partnum-TERM