AMMC-3041 AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • Wide Frequency Range: - RF , LO: 18 - 42 GHz - IF: DC - 5 GHz
  • Conversion Loss: 9.5 dB
  • High IIP3: +22 dBm
  • High Input P -1dB : +16 dBm
  • Up or Down Conversion

Applications

  • Point-to-Point Radio
  • LMDS
  • SATCOM Chip Size Tolerance: ±10 µm (±0.4 mils) Chip Size Tolerance: 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 75 x 75 µm (3 ± 0.4 mils) Note: These devices are ESD sensitive. The following precautions are strongly recommended: Ensure that an ESD approved carrier is used when dice are transported from one destination to another. Personal grounding is to be worn at all times when handling these devices. AMMC-3041 18 - 42 GHz Double Balanced Mixer Data Sheet Symbol Parameters/Conditions Units Min. Max. Tb Operating Backside Temp. °C -55 +140 Tstg Storage Temp. °C -65 +165 Tmax Maximum Assembly °C +300 Temp. (60 sec. max.) Note: 1. Operation in excess of any one of these conditions may result in permanent damage to this device.

AMMC-3041 RF Specifications [1] (Zo = 50 Ω, Tb = 25 °C, IF = 2 GHz, LO Input Power = +14 dBm, RF Input Power = -20 dBm, except as noted.) Symbol Parameters Test Conditions Units Minimum Typical Maximum Lc Conversion Loss [1] Down Conversion 9.5 13 Up Conversion dB 9.0 13 IIP3 Input 3 rd Order Intercept Point, f RF = 26 GHz dBm 23 Down Conversion [2] fRF = 38 GHz 22 P-1dB Input Power at 1 dB Conversion Down Conversion dBm 16 Loss Compression Up Conversion dBm 5 ISOLL-R LO - RF Isolation f LO = 26 GHz dB 44 fLO = 38 GHz 29 Notes: 1. 100% on-wafer RF test is done at RF frequency = 18, 22, 32, and 42 GHz. 2. ∆f = 2 MHz, RF Input Power = -10 dBm. Spurious Mixing Products fRF = 31 GHz, RF Input Power = -10 dBm, fLO = 32 GHz, LO Input Power = +14 dBm. n x LO m x RF 0 1 2 3 4 0- 17.9 - - - 14 3 0 6 9 - - 2- 8 8 49 95 - 3- - 115 88 115 4- - - 115 115 All values are dBc relative to the IF output power level.

Operation of the AMMC- 3041 is very straightforward. a blocking capacitor should be used. output signal taken from the RF port. to make the chip and adjacent circuit coplanar. jeopardize electrical or mechanical attachment. directly on the topside ground plane of the circuit. Figure 8. Note that all I/O ports are in a Ground-Signal- power of roughly 55 dB for a duration of 76 ± 8 mS. wire bond stage temperature is 150 ± 2 °C. Maximum Rating for assembly temperature and time.

  1. Ablebond 84-1 LM1 silver epoxy is recommended.
  2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824.