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Document overview

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Technical content

Features

 Well-defined spatial radiation pattern  High brightness material  Available in Red, Amber, Green and Blue color: — Red AlInGaP 626 nm — Amber AlInGaP 590 nm — Green InGaN 525 nm — Blue InGaN 470 nm  JEDEC MSL 2A  Compatible with reflow soldering process  Tinted and diffused lens  Wide viewing angle: 40° × 100°

Applications

 Full color signs  Mono color signs ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 High Brightness SMT Oval LED Lamps Amber, Red, Green, and Blue Data Sheet

  • 2 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Package Dimensions Package Dimensions NOTE 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.20 mm unless other specified. 3. Copper lead frame. Device Selection Guide Part Number Color and Dominant Wavelength d (nm) Typa a. Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. Luminous Intensity Iv (mcd) b,c,d b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. c. The optical axis is closely aligne d with the package mechanical axis. d. Tolerance for each bin limit is ± 15%. Viewing Angle Typ - ° e e. ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. Min Max ALMD-LG36-WZ002 Red 626 1380 2900 40° × 100° ALMD-LL36-WZ002 Amber 590 1380 2900 40° × 100° ALMD-LM36-14002 Green 525 2900 6050 40° × 100° ALMD-LB36-SV002 Blue 470 660 1380 40° × 100° 3.40±0.50 2.50±0.20 5.20±0.50 1.4 (4X) 1.0 A A CC A - Anode C - Cathode Orientation (Anode Mark) 4.20±0.20 4.20±0.20 4.75±0.50
  • 3 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Part Numbering System Part Numbering System Absolute Maximum Rating, TJ = 25 °C A L M D - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description Option x1 Package type L Oval AlInGaP/InGaN x2 Color B G L M Blue Red Amber Green x3x4 Viewing angle 36 40 × 100° x5 Minimum intensity bin Refer to device selection guide x6 Maximum intensity bin Refer to device selection guide x7 Color bin selection 0 Full distribution x8x9 Packaging option 02 Tested 20mA, 13inch carrier tape Parameter Red and Amber Blue and Green Unit DC Forward Current a a. Derate linearly as shown in Figure 4 and Figure 9. 50 30 mA Peak Forward Current 100b b. Duty Factor 30%, frequency 1 kHz. 100c c. Duty Factor 10%, frequency 1 kHz. mA Power Dissipation 120 114 mW Reverse Voltage 5 (IR = 100 μA)d d. Indicates product final testing; long -term reverse bias is not recommended. 5 (IR = 10 μA)d V LED Junction Temperature 110 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +100 °C
  • 4 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Electrical/Optical Characteristics, TJ = 25 °C Electrical/Optical Characteristics, TJ = 25 °C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Red Amber Green Blue V F 1.8 1.8 2.8 2.8 2.1 2.1 3.2 3.2 2.4 2.4 3.8 3.8 VI F = 20 mA Reverse Voltage Red and Amber Green and Blue VR V IR = 100 μA IR = 10 μA Dominant Wavelengtha Red Amber Green Blue a. The dominant wavelength is derived from the Chromati city Diagram and represents the color of the lamp. 618.0 584.5 519.0 460.0 626.0 590.0 525.0 470.0 630.0 594.5 539.0 480.0 IF = 20 mA Peak Wavelength Red Amber Green Blue PEAK 634 594 516 464 nm Peak of Wavelength of Spectral Distribution at I F = 20 mA Thermal Resistance R J-PIN 130 °C/W LED Junction-to-Pin Luminous Efficacyb Red Amber Green Blueb. The radiant intensity, I e in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens/watt. 200 520 530 lm/W Emitted Luminous Power/Emitted Radiant Power Thermal coefficient of  d Red Amber Green Blue 0.059 0.103 0.028 0.024 nm/°C I F = 20 mA; +25 °C ≤ TJ ≤ +100 °C
  • 9 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Intensity Bin Limit Table (1.2:1 lv Bin Ratio) Figure 18 Unit Orientation from Reel Intensity Bin Limit Table (1.2:1 lv Bin Ratio) Tolerance for each bin limit is ± 15%. VF Bin Table (V at 20 mA) for Red and Amber Tolerance for each bin limit is ± 0.05 V. 2 anode leads lead unreeling direction Bin Intensity (mcd) at 20 mA Min Max S6 6 0 8 0 0 T8 0 0 9 6 0 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4
  • 10 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Red Color Range Red Color Range Tolerance for each bin limit is ± 0.5 nm. Amber Color Range Tolerance for each bin limit is ± 0.5 nm. Green Color Range Tolerance for each bin limit is ± 0.5 nm. Blue Color Range Tolerance for each bin limit is ± 0.5 nm. Min Dom Max Dom X min Y Min X max Y max 0.6690 0.3149 0.7080 0.2920 Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 0.5370 0.4550 0.5570 0.4420 0.5530 0.4400 0.5720 0.4270 0.5670 0.4250 0.5870 0.4130 0.5820 0.4110 0.6000 0.3990 Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 0.1200 0.7375 0.0979 0.8316 0.1450 0.7319 0.1305 0.8189 0.1711 0.7218 0.1625 0.8012 0.1967 0.7077 0.1929 0.7816 0.2210 0.6920 0.2233 0.7600 Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 0.1818 0.0904 0.1374 0.0374 0.1766 0.0966 0.1291 0.0495 0.1699 0.1062 0.1187 0.0671 0.1616 0.1209 0.1063 0.0945 0.1517 0.1423 0.0913 0.1327
  • 11 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Packing Label Packing Label (i) Mother Label (Available on MBB Bag) (ii) Baby Label (Available on Plastic Reel) For acronyms and definitions, see the next page. (1P) Item: Part Number (1T) Lot: Lot Number LPN: (9D)MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID: DeptID: OEAT01 Made In: Country of Origin (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information (9D) Date Code: Date Code STANDARD LABEL LS0002 RoHS Compliant e4 Max Temp 260C MSL 2a (1P) PART #: Part Number (1T) Lot #: Lot Number (9D)MFG Date: Manufacturing Date C/0: Country of Origin (1T) TAPE DATE: Taping Date (Q) QTY: Quantity (9D) Date Code: Date Code BABY LABEL COSBOO1B V0.0 CAT Intensity Bin BIN Refer to Below information
  • 12 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Soldering Acronyms and Definitions BIN: (i) Color bin only or VF bin only (Applicable for part numbers with color bins but without VF bin or part numbers with VF bins and no color bin) (ii) Color bin incorporated with VF bin Applicable for part numbers that have both color bin and VF bin Example: a. Color bin only or V F bin only BIN: 4 (represent color bin 4 only) BIN: VA (represent V F bin “VA” only) b. Color bin incorporate with V F bin BIN: 4 VA VA: VF bin “VA” 4: Color bin 4 only Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering (ii) Lead-free reflow soldering 240°C MAX. 20 SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. TIME TEMPERATURE 183°C100-150°C -6°C/SEC. MAX. 60-150 SEC. 3°C/SEC. MAX. 217 °C 200 °C 60 - 120 SEC. 6 °C/SEC. MAX. 3 °C/SEC. MAX. 3 °C/SEC. MAX. 150 °C 255 - 260 °C 100 SEC. MAX. 10 to 30 SEC. TIME TEMPERATURE 1. Reflow soldering must not be done more than two times. Make sure you take the necessary precautions for handling a moisture-sensitive device, as stated in the following section. 2. Recommended board reflow direction: 3. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. 4. It is preferred that you use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable but must be strictly controlled to the following conditions: — Soldering iron tip temperature = 320 °C max. — Soldering duration = 3 sec max. — Number of cycles = 1 only — Power of soldering iron = 50 W max. 5. Do not touch the LED body with a hot soldering iron except the soldering terminals as this may damage the LED. 6. For de-soldering, it is recommended that you use a double flat tip. 7. Please confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. Reflow Soldering
  • 13 - ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36 Data Sheet Precautionary Notes Precautionary Notes 1. Handling precautions For automated pick and place, Avago has tested nozzle size below made with urethane material to be working fine with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the machine, customer is recommended to verify the nozzle selected. NOTE a. Nozzle tip should touch the LED flange during pick and place. b. Outer dimensions of the nozzle should be able to fit into the carrier tape pocket. 2. Handling of moisture-sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use  An unopened moisture barrier bag (MBB) can be stored at <40 °C / 90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.  It is recommended that the MBB not be opened prior to assembly (e.g., for IQC). b. Control after opening the MBB  The humidity indicator card (HIC) shall be read immediately upon opening of MBB.  The LEDs must be kept at <30 °C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. c. Control for unfinished reel  Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. d. Control of assembled boards  If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB must be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 672 hours. e. Baking is required if:  The HIC indicator is not BROWN at 10% and is AZURE at 5%.  The LEDs are exposed to condition of >30 °C / 60% RH at any time.  The LED floor life exceeded 672 hrs. The recommended baking condition is: 60 °C ±5 ºC for 20 hrs. Baking should only be done once. f. Storage  The soldering terminals of these Avago LEDs are silver plated. If the LEDs are being exposed in ambient environment for too long, the silver plating might be oxidized and thus affecting its solderability performance. As such, unused LEDs must be kept in sealed MBB with desiccant or in desiccator at <5%RH. 3. Application precautions a. Drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. b. LEDs do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (i.e., intensity, wavelength, and forward voltage). The user is recommended to set the application current as close as possible to the test current to minimize these variations. c. The LED is not intended for reverse bias. Do use other appropriate components for such purposes. When driving the LED in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the LED. d. Avoid rapid change in ambient temperature, especially in high humidity environments, because this will cause condensation on the LED. e. If the LED is intended to be used in outdoor or harsh environments, the LED leads must be protected with suitable potting material against damages caused by rain water, oil, corrosive gases, etc. It is recommended to have louver or shade to reduce direct sunlight on the LEDs. Pick & Place nozzle LED flange >2.2mm 4.00 4.00 3.20 5.00

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. Data subject to change. Copyright © 2014–2016 Avago Technologies. All Rights Reserved. AV02-2377EN – April 15, 2016 4. Eye safety precautions LEDs may pose optical hazards when in operation. It is not advisable to view directly at operating LEDs because it may be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.