ALM-11236 AVAGO | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Features

  • Very Low Noise Figure
  • Low Bypass IL
  • Good Return Loss
  • Fail-safe Bypass mode
  • High linearity performance
  • High isolation @LNA mode
  • Flat gain
  • GaAs E-pHEMT Technology
  • Single 5 V power supply
  • Compact MCOB package 7.0 x 10.0 x 1.5 mm3
  • MSL2a Specifications

1785 MHz; 5 V, 99 mA (Typical)

  • 15.9 dB Gain
  • ≥ 18 dB RL
  • 0.67 dB Noise Figure
  • 17.3 dBm IIP3
  • 3.5 dBm Input Power at 1dB gain compression
  • 0.75 dB Bypass IL
  • ≥ 18 dB Bypass RL
  • ≥ 50 dB isolation @LNA mode

Applications

  • Tower Mount Amplifier (TMA)
  • Cellular Infrastructure Note: Package marking provides orientation and identification “11236” = Device Part Number “WWYY” = Work week and Year of manufacture “XXXX” = Last 4 digit of Lot number Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model = 300 V ESD Human Body Model = 2000 V Refer to Avago Application Note A004R: Electrostatic Discharge, Damage and Control. Pin Connection

4 RF_IN

23 RF_OUT

28 EXT_P2

30 EXT_P1

33 Vdd

Absolute Maximum Rating [1] TA = 25° C Symbol Parameter Units Absolute Max. Vdd Device Voltage, RF output to ground V 5.5 Pin,max CW RF Input Power (Vdd = 5.0 V, Idd = 100 mA) dBm +15 Pdiss Total Power Dissipation [3] W 0.715 Tj Junction Temperature °C 150 TSTG Storage Temperature °C -65 to 150 Thermal Resistance [2] (Vdd = 5.0 V, Idd = 100 mA) θjc = 56.2 °C/W Notes: 1. Operation of this device in excess of any of these limits may cause permanent damage. 2. Thermal resistance measured using Infra-Red Measurement Technique. 3. Power dissipation with unit turned on. Board temperature Tc is 25° C. Derate at 17.8 mW/°C for Tc > 109.8 ° C. Electrical Specifications [1, 4] RF performance at TA = 25° C, Vdd = 5 V, 1785 MHz, measured on demo board in Figure 1 with component listed in Table1 for DC bypass. Symbol Parameter and Test Condition Frequency (MHz) Units Min. Typ. Max. Idd Drain Current mA 81 99 117 Gain Gain 1710 1785 dB – 14.5 15.9 17.5 IRL Input Return Loss, 50 Ω source dB – 30 – ORL Output Return Loss, 50 Ω load dB – 28 – NF [2] Noise Figure 1710 1785 dB – 0.75 0.67 0.85 IIP3 [3] Input Third Order Intercept Point dBm 14 17.3 – IP1dB Input Power at 1 dB Gain Compression dBm 2.55 3.5 – Bypass IL Bypass Insertion Loss, 50 Ω load Vdd = 0 V 1785 dB – 0.75 1.1 Bypass IRL Input Return Loss, 50 Ω source Vdd = 0 V dB – 19 – Bypass ORL Output Return Loss, 50 Ω load Vdd = 0 V dB – 23 – ISOL Bypass Isolation @LNA ON Vdd = 5 V dB – 56 – Notes: 1. Measurements at 1785 MHz obtained using demo board described in Figure 1. 2. For NF data, board losses of the input have not been de-embedded. 3. IIP3 test condition: FRF1 = 1785 MHz, FRF2 = 1786 MHz with input power of -15 dBm per tone. 4. Use proper bias, heatsink and derating to ensure maximum channel temperature is not exceeded. See absolute maximum ratings and application note for more details.

Figure 7. Demo Board Layout Diagram – Recommended PCB material is 10 mils Rogers RO4350. – Suggested component values may vary according to layout and PCB material. – Copper trace between the 2 pads is removed before Z2 0(ohm) is placed.

Figure 8. Demo Board Schematic Diagram Table 1. DC component list for 1710-1850 MHz C1 is a DC bypass capacitor. Z2 is a 0 Ω resistor if an external function block is not used.

Typical Scattering Parameters, Vdd = 5 V, Idd = 99 mA LNA SPAR (100 MHz – 20 GHz) Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

Part Number Ordering Information Part Number No. of Devices Container ALM-11236-TR1G 1000 13” Reel ALM-11236-BLKG 100 antistatic bag PCB Layout and Stencil Design Note : 1. Recommended Land Pattern & Stencil Opening. 2. Stencil thickness is 0.1 mm (4 mils) 3. All dimension are in MM unless otherwise speci/f_ied Metal Soldermask Open Stencil OpeningLand Pattern Combination of Land Pattern and Stencil Opening 9.765 0.845 (pitch) 3.65 4.50 0.47 0.47 0.20 9.795 8.10 5.20 0.845 (pitch) 6.80 0.50 0.50 0.845 (pitch) Pin 1 0.845 0.845 (pitch) Pin 1 1.0375 1.0375 0.845 (pitch)1.0375 6.770 Pin 1

MCOB 7 x 10 Package Dimensions Device Orientation USER FEED DIRECTION TOP VIEW END VIEWUSER FEED DIRECTION COVER TAPE CARRIER TAPE REEL AVAGO 11236 WWYY XXXX AVAGO 11236 WWYY XXXX AVAGO 11236 WWYY XXXX Notes: 1. All dimensions are in milimeters 2. Dimensions are inclusive of plating 3. Dimensions are exclusive of mold flash and metal burr Top View Side View Bottom View AVAGO 12236 WWYY XXXX 10.00±0.10 7.00±0.10 1.50±0.10 1.12 Pin1 Identi/f_ication Bottom SM Bottom Metal R0.15 0.50 0.50 0.845 (pitch) (SM to metal gap) 1.0375 8.10 5.20 0.10 0.05 0.845 (pitch) Pin 1

12.00 ± 0.10 4.00 ± 0.10 Ø 1.50 + 0.10 2.00 ± 0.10 1.75 ± 0.10 11.50 ± 0.10 24.00 + 0.30 − 0.10 Ø 1.50 + 0.25 7.32 ± 0.10 8° MAX 0.318 ± 0.02 2.06 ± 0.10 10.49 ± 0.10 K. B. 5° MAX

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. AV02-2848EN - June 18, 2013 Reel Dimensions - 13” Reel Detail ‘X’ Recycle Symbol See Detail ‘X’ Embossed Line X2 90.0mm Length Lines 147.0mm away from center point ESD Label (See Below) FRONT BACK Detail ‘Y’ (Slot Hole) FRONT VIEW BACK VIEW Recycle Symbol Embossed ‘M’ 5.0mm Height Slot 10.0±0.5(2x) Slot 5.0±0.5***(1x) Detail ‘Y’ 30.4* Max Ø100.0±0.5 Ø331.5 Max 1.0 4.0 Detail ‘X’ +0.5 2.2±0.5 Ø20.2 (Min) Ø13.1 -0.2 25.4±1.0* 25.65±1.75**