DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

1.25GBd Ethernet, 1310nm, 1000Base-LX SFP Transceiver Reliability Data Sheet Introduction Avago Technologies Quality System includes an on-going Reliability Monitoring program to generate a database from which this reliability datasheet is published.

Description

The AFCT-5725PZ optical transceiver is compliant with the specifi cations set forth in both the IEEE802.3 (1000BASE- LX), and the Small Form-Factor Pluggable (SFP) Multi- Source Agreement (MSA). Its primary application is ser- vicing Gigabit Ethernet links between optical networking equipment. It off ers system cost, upgrade, and reliability benefi ts by virtue of being hot-pluggable. Furthermore, it incorporates the latest 3.3 VDC compatible transceiver technology including a 1310nm FP laser transmitter as well as a convenient LC-Duplex optical interface. FIT Rate Summary The FIT rate for AFCT-5725PZ is calculated to be 127.4. The details of this calculation are included on page 2 of this report. Reliability prediction follows the parts count method of Telcordia-SR-332 Issue 3. Random Failure Rate (FIT) Calculation Failure in time rate, or FIT, is defi ned as the number of failures per billion device hours. In the product useful life region, the random failure rate is considered as a constant failure rate. In this region MTTF, Mean Time to Failure, is defi ned as MTTF = 1/FIT. FIT Prediction Based on Telcordia SR-332 Parts Count Procedure The Telcordia parts count method assumes that the mod- ule failure rate is equal to the sum of the device compo- nent failure rates. Modifi ers are included to take into con- sideration variations in module operation environments, device quality requirements, temperature, and stress. The table that follow show the FIT for the components used in the modules and the total FIT which have been calculated for an operating ambient temperature of 40C

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. AV02-3650EN - July 9, 2012 Table 1a. FIT rate for AFCT-5725PZ Reliability Prediction Based On Telecordia SR-332 Issue 3 - Parts Count Method Temperature Factor @ 40°C 1 Stress Factor at 50% 1 Enviromental Factor 1 Component Telecordia Information Data Source" Quantity Component Base Rate (FITs) Quality Factor Total Component Failure Rate (FITs) Laser Avago Data 1 4 0.8 3.2 Monitor diode Telcordia 1 7.7 0.8 6.16 Photodiode Telcordia 1 7.7 0.8 6.16 TIA Telcordia 1 23 1 23 Micro-controller Supplier Data 1 8 1 8 Digital IC Telcordia 1 7.02 1 7.02 Transceiver IC Telcordia 1 23 1 23 Laser driver IC Telcordia 1 23 1 23 CMOS IC Telcordia 1 2.04 1 2.04 Inductor Telcordia 1 2.04 1 2.04 EEPROM Supplier Data 1 1.3 1 1.3 Crystal Telcordia 1 3.2 1 3.2 Resistors Telcordia 14 0.51 1 7.14 Capacitors Telcordia 30 0.2 1 6 Ferrite Supplier Data 7 0.5 1 3.5 Edge connector Telcordia 20 0.13 1 2.6 SFCT-5725PZ Module Failure @ 40°C (Total FITs) 127.4 MTTF @ 40°C (Hours) 7.85E+06 Note: Component Base Rate (FITs) is obtained from SR-332 Issue 3 table. FITs at other temperatures can be derived following the procedure of Telcordia SR-332, assuming activation energy, Ea, of 0.35eV to determine the component temperature factor πT. The following table shows FITs at diff erent temperature for the transceiver. Table 1b. FIT rates at diff erent operating ambient temperatures, following Telcordia Parts Count Method Tcase (C) AFCT-5725PZ (FITs) 40 127.4 45 152.8 50 191.0 55 229.2 60 280.2 65 331.1 85 649.5 The limitations of the FIT prediction based on the Parts Count method include the fact that the piece part failure rates are mostly obtained from Telcordia database, which may not be exhaustive for state-of-the-art piece parts, and that the results are independent of true module en- vironmental stress tests. Nevertheless, the information obtained from the Parts Count method is a useful refer- ence during design-in and evaluation. Whenever possible, Avago will substitutes internal data for the FIT rates of in- dividual components, and predictions will be updated as more current data becomes available.