AE607 RFHIC | Alldatasheet

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Technical content

Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com All specifications may change without notice US Facility : 919-677-8780 / sales@rfhicusa.com 1 / 5 V ersion 1.1 Product Features Applications

  • 5 ~ 1000MHz
  • High Gain
  • High linearity
  • SOIC-8 SMD Type package
  • Higher productivity
  • Lower manufacturing cost
  • Low Noise Figure
  • -63dBc CSO 79 Channels @ +40dBmV/ch
  • -65dBc CTB 79 Channels @ +40dBmV/ch
  • Low Noise Amplifier for CATV , Satellite
  • Cable Modem
  • FTTH (G-PON, GE-PON)
  • Optical node

Description

AE607 is designed as low cost drive amplifiers for many applications including FTTH, CATV System. This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current draw and very low noise. The data in this spec sheet is valid only for 75ohm application. 50ohm data is in a separate spec sheet. Electrical Specifications PARAMETER UNIT MIN TYP MAX CONDITION Frequency MHz 5 - 1500 - Gain dB 10.5 12.5 - 30 ~ 1000MHz Gain Flatness dB - 0.8 - 30 ~ 1000MHz Input Return Loss dB - -15 - - Output Return Loss dB - -15 - - Output IP3 dBm 40 43 - @ 500MHz/10dBm 2tone 1dB Compression Point dBm 25 28 - @ 500MHz Noise Figure dB - 3.5 - 30 ~ 1000MHz CTB 30 ~ 1004MHz dBc - -69 -64 79 channel, +40dBmV/ch CSO dBc - -70 -65 DC Current mA - 240 - Vdd = 8.0V Note 1. Test conditions unless otherwise noted. Test Freq = 500MHz, T=25℃, Vdd=8V , 75Ω system 2. OIP3 measured with 2 tones at an output p ower of +10dBm/tone separated by 1MHz , Test Freq = 500MHz Absolute Maximum Ratings PARAMETER UNIT MIN TYP MAX Device Voltage VDC - 8 12 Operating Temperature ℃ -40 - 85 Storage Temperature ℃ -40 - 150 ESD Human Body Model - - Class 1B - Moisture Sensitivity Level - - MSL1 - Junction Temperature (Tj) ℃ - - 180 Thermal Resistance (Rth) ℃/W - 30 - Package Type : SOIC-8

Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com All specifications may change without notice US Facility : 919-677-8780 / sales@rfhicusa.com 2 / 5 V ersion 1.1 Application Circuit @ 30 ~ 1000MHz, 75ohm System, VDD=8V Typical Performance @ VDD=8V , IDS=240mA, T=25℃, 75ohm System PARAMETER Units Typical Frequency MHz 30 500 1000 Gain(S21) dB 12.3 12.9 12.2 Input Return Loss(S11) dB -10.2 -21.8 -19.7 Output Return Loss(S22) dB -9.5 -18.5 -20.3 Output IP3 dBm 41.5 43.5 39.5 1dB Compression Point dBm 26.1 28.4 26.8 Noise Figure dB 3.5 3.5 3.7 CSO* dBc -69 CTB* dBc -70 Current mA 240 S-Parameter -10 -20 -10 -30 Freq(GHz) Return Loss(dB) Gain(dB) * 79channels_Flat, +40dBmV Frequency vs. Noise Figure Frequency vs. P1dB 30 200 400 600 800 1000 NF(dB) Freq(MHz) 30 200 400 600 800 1000 P1dB(dBm) Freq(MHz) S21 S22 S11

Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com All specifications may change without notice US Facility : 919-677-8780 / sales@rfhicusa.com 3 / 5 V ersion 1.1 Frequency vs. OIP3 30 200 400 600 800 1000 OIP3(dBm) Freq(MHz) Application Circuit @ 30~1000MHz Evaluation Part List @ 30~1000MHz Location Model No. Spec. Maker Quantity C1 GRM188R71H103KA01D 10nF Murata 10 C2 GRM188R71C104KA01D 100nF Murata 2 C3 TAJA475M016RNJ, 4.7uF 4.7uF A VX 2 R1 MCR06 EZPJ102~302 1K~3KΩ ROHM 2 R2 MCR03 EZPJ271 270Ω ROHM 2 R3 MCR03 EZPJ201 200Ω ROHM 2 R4 MCR10 EZHJ100 (>0.25W) 10Ω ROHM 4 L1 LEM2520TR56K 560nH Taiyo-yuden 2 BAL_1 D60465A 2.5T LS Comm. 2

Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com All specifications may change without notice US Facility : 919-677-8780 / sales@rfhicusa.com 4 / 5 V ersion 1.1 Package Dimensions (Type: SOIC-8) * Unit: mm[inch] | Tolerance ±0.2[.008] Pin Description Pin No Function Pin No Function

1 RF IN(2) 5 RF OUT(1)

2 GND 6 GND

3 GND 7 GND

4 RF IN(1) 8 RF OUT(2)

Mounting Configuration Notes 1. Ground / thermal via holes are critical for the pro per performance of this device. 2. Add as much copper as po ssible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heat sink. Ensure that the ground / thermal via hole region contacts the heat sink. 4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heat sink. 5. RF trace width depends upon the PCB material and construction. 6. Use 1 oz. Copper minimum.

Korean Facilities : 82-31-8069-3036 / rfsales@rfhic.com All specifications may change without notice US Facility : 919-677-8780 / sales@rfhicusa.com 5 / 5 V ersion 1.1

Revision History

Part Number Release Date Version Modification Data Sheet Status AE607 2014.04.18 1.1 Thermal Resistance - AE607 2012.10.10 1.0 Document revision - RFHIC Corporation reserves the right to make changes to any products herein or to discontinue any product at any time without notice. While product specifications have been thoroughly examined for reliability, RFHIC Corporation strongly recommends buyers to verify that the information they are using is accurate before ordering. RFHIC Corporation does not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential o r incidental damages. RFHIC products are not intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC Corporation and its directors, officers, stockholders, emplo yees, representatives and distributors harmless against any and all claims arising out of such unauthorized use. Sales, inquiries and support should be directed to the local authorized geographic distributor for RFHIC Corporation. For cus tomers in the US, please contact the US Sales Team at 919- 677-8780. For all other inquiries, please contact the International Sales Team at 82-31-8069-3036.