ADJD-S313-QR999 AVAGO | Alldatasheet
Document overview
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- PDF pages: 16
Technical content
Features
- Fully integrated RGB digital color sensor
- Digital I/O via 2-wire serial interface
- Industry’s smallest form factor – QFN 5x5x0.75mm
- Adjustable sensitivity for different levels of illumination
- Uniformly distributed RGB photodiode array
- 7 bit resolution per channel output
- Built in internal oscillator
- Sleep function when not in use
- No external components
- Low supply voltage (V DD) 2.6V
- 0°C to 70 °C operating temperature
- Lead free package
Applications
- General color detection and measurement
- Mobile appliances such as mobile phones, PDAs, MP3 players,etc.
- Consumer appliances
- Portable medical equipments
- Portable color detector/reader Feature Value Interface 100kHz serial interface Supply 2.6V digital (nominal), 2.6V analog (nominal) AVAGO TECHNOLOGIES' PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.
tVDD_RAMP VDDD / VDDA No voltage must be applied to IO's during power-up and power-down ramp time ESD Protection Diode Turn-On During Power-Up and Power-Down A particular power-up and power-down sequence must be used to prevent any ESD diode from turning on inadvertently. The figure above describes the sequence. In general, AVDD and DVDD should power-up and powerdown together to prevent ESD diodes from turning on inadvertently. During this period, no voltage should be applied to the IO’s for the same reason. Ground Connection AGND and DGND must both be set to 0V and preferably star-connected to a central power source as shown in the application diagram. A potential difference between AGND and DGND may cause the ESD diodes to turn on inadvertently.
Absolute Maximum Ratings (Notes 1 & 2) Recommended Operating Conditions Over Recommended Operating Conditions (unless otherwise specified) Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Output voltage high level (Note 5) V OH IOH = 3mA V DDD-0.8 V DDD-0.4 V Output voltage low level (Note 6) V OL IOL = 3mA 0.2 0.4 V Dynamic supply current (Note 7,8) I DD_DYN (Note 9) 9.4 14 mA Static supply current (Note 8) I DD_STATIC (Note 9) 2.7 mA Sleep-mode supply current (Note 8) I DD_SLP (Note 9) 0.2 15 uA Input leakage current I LEAK -10 10 uA Parameter Symbol Minimum Maximum Units Notes Storage temperature T STG_ABS -40 85 °C Digital supply voltage, DVDD to DVSS V DDD_ABS -0.5 3.7 V Analog supply voltage, A VDD to A VSS V DDA_ABS -0.5 3.7 V Input voltage V IN_ABS -0.5 V DDD+0.5 V All I/O pins Solder Reflow Peak temperature T L_ABS 235 °C Human Body Model ESD rating ESD HBM_ABS 2 kV All pins, human body model per JESD22-A114-B Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Internal clock frequency f CLK 16 26 38 MHz Parameter Symbol Minimum Typical Maximum Units Free air operating temperature T A 02 5 7 0 ° C Digital supply voltage, DVDD to DVSS V DDD 2.5 2.6 3.6 V Analog supply voltage, AVDD to AVSS V DDA 2.5 2.6 3.6 V Output current load high I OH 3m A Output current load low I OL 3m A Input voltage high level (Note 4) V IH 0.7 VDDD VDDD V Input voltage low level (Note 4) V IL 00 . 3 V DDD V
Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Irradiance Responsivity Re λP = 460 nm Refer Note 10 B 36 LSB / (mW/cm2) λP = 542 nm Refer Note 11 G 53 λP = 645 nm Refer Note 12 R 82 Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Irradiance Responsivity Re λP = 460 nm Refer Note 10 B 1250 LSB / (mW/cm2) λP = 542 nm Refer Note 11 G 1750 λP = 645 nm Refer Note 12 R 2490 Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Saturation Irradiance (note 13) λP = 460 nm Refer Note 10 B 4.17 mW/ cm2 λP = 542 nm Refer Note 11 G 2.83 λP = 645 nm Refer Note 12 R 1.83 Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Saturation Irradiance (note 13) λP = 460 nm Refer Note 10 B 0.12 mW/ cm2 λP = 542 nm Refer Note 11 G 0.09 λP = 645 nm Refer Note 12 R 0.06 Minimum sensitivity Optical Specification *code is from dark code to (dark code + 128LSB) Parameter Symbol Conditions Minimum Typical (Note 3) Maximum Units Dark offset* V D Ee = 0 65 LSB
color channels are set at equal. Figure 1. Serial Interface Bus Timing Waveforms
- The “Absolute Maximum Ratings” are those values beyond which
table will define the conditions for actual device operation.
- Unless otherwise specified, all voltages are referenced to ground.
- Specified at room temperature (25
- Applies to all DO pins. SDASLV go tri-state when output logic
OH depends on the pull-up resistor value.
- Applies to all DO and DIO pins.
- Dynamic testing is performed with the IC operating in a mode
representative of typical operation.
- Refers to total device current consumption.
- Output and bidirectional pins are not loaded.
- Test condition is blue light of peak wavelength ( λ
spectral half width ( ∆λ½) 25 nm.
- Test condition is green light of peak wavelength ( λP) 542 nm and
- Test condition is red light of peak wavelength ( λP) 645 nm and
- Saturation irradiance = (MSB)/(Irradiance responsivity)
The sensor needs to be configured before it can be used. The gain selection needs to be set for optimum performance depending on light levels. The flowcharts below describe the different procedures required. Sensor gain optimization flowchart Sensor operation flowchart SENSOR GAIN OPTIMIZATION Step 1 Hardware Reset Step 2 Device Initialization Step 3 - 4 Select sensor gain settings Step 5 Acquire ADC readings ADC readings optimum? STOP YES NO SENSOR OPERATION Step 1 Hardware Reset Step 2 Device Initialization Step 3 - 4 Select sensor gain settings Step 5 Acquire dark offset and store current offset values Step 6 Acquire ADC readings Step 7 Compute sensor values STOP * Please refer to application note for more detailed information.
A hardware reset (by asserting XRST) should be performed before starting any operation. The user controls and configures the device by programming a set of internal registers through a serial interface. At the start of application, the following setup data must be written to the setup registers: Address (Hex) Register Setup Data (Hex)
03 SETUP0 01
04 SETUP1 01
The sensor gain can be adjusted by varying the photodiode size and integration time of the sensor manually through the following registers. Sensor Sensitivity ~ Photodiode Size x Integration Time Slot Setup Value for Photodiode Size The following value can be written to each of the photodiode size registers to adjust the gain of the sensor. The default value after reset for these registers is 07H. Setup Value for Integration Time The following value can be written to each of the integration time registers to adjust the gain of the sensor. The default value after reset for these registers is 07H. Sensor ADC Output Registers To obtain sensor ADC value, ‘02’ Hex must be written to ACQ register before reading the Sensor ADC Output Registers. Address (Hex) Register Description
02 ACQ Acquire sensor analog to digital
converter (ADC) values when 02H is written. Reset to 00H when sensor acquisition is completed
44 ADCR Sensor Red channel ADC value
43 ADCG Sensor Green channel ADC value
42 ADCB Sensor Blue channel ADC value
Value (Hex) Photodiode Size 01 ¼ 03 ½ 07 ¾ 0F Full Value (Hex) Integration Time Slot 00 1 01 2 02 3 03 4 04 5 05 6 06 7 07 8 08 9 09 10 0A 11 0B 12 0C 13 0D 14 0E 15 0F 16 Address (Hex) Register Description 0B PDASR Red Channel Photodiode Size 0A PDASG Green Channel Photodiode Size
09 PDASB Blue Channel Photodiode Size
11 TINTR Red Channel Integration Time
10 TINTG Green Channel Integration Time
0F TINTB Blue Channel Integration Time
the master-transmitter after the START condition. The slave address on ADJD-S313 is 0x58 (7-bits). or not acknowledge SCL clock pulse. Figure 7. Slave Addressing
AGND and DGND must both be set to 0V and preferably star-connected to a central power source as shown in the application diagram. A potential difference between AGND and DGND may cause the ESD diodes to turn on inadvertently. Pin Information AVDD DGND DVDDAGND XRST SDASLV SCLSLV Voltage Regulator Voltage Regulator HOST SYSTEM XRST SDA SCL 19 8, 16, 17, 18 5, 6 7 Star-connected ground SLEEP 10k HOST SYSTEM 10k 10k 10k DVDD PIN NAME TYPE DESCRIPTION 1 NC No connect No connect. Leave floating. 2 NC No connect No connect. Leave floating. 3 NC No connect No connect. Leave floating. 4 NC No connect No connect. Leave floating. 5 DGND Ground Tie to digital ground. 6 DGND Ground Tie to digital ground. 7 DVDD Power Digital power pin. 8 AGND Ground Tie to analog ground. 9 NC No connect No connect. Leave floating. 10 XRST Input Global, asynchronous, active-low system reset. When asserted low, XRST resets all registers. Minimum reset pulse low is 10 µs and must be provided by external circuitry. 11 SCLSLV Input SDASLV and SCLSLV are the serial interface communications pins. SDASLV is the bidirectional data pin and SCLSLV is the interface clock. A pull-up resistor should be tied to SDASLV because it goes tri-state to output logic 1.12 SDASLV Input/Output (tri-state high) 13 NC No connect No connect. Leave floating. 14 NC No connect No connect. Leave floating. 15 SLEEP Input When SLEEP=1, the device goes into sleep mode. In sleep mode, all analog circuits are powered down and the clock signal is gated away from the core logic resulting in very low current consumption. 16 AGND Ground Tie to analog ground. 17 AGND Ground Tie to analog ground. 18 AGND Ground Tie to analog ground. 19 AVDD Power Analog power pin. 20 NC No connect No connect. Leave floating. Application Diagrams
NOTE: DIMENSIONS ARE IN MILIMETERS (MM)
Recommended Reflow Profile It is recommended that Henkel Pb-free solder paste LF310 be used for soldering ADJD-S313. Below is the recommended soldering profile.
20 Lead QFN Recommended Stencil Design
A stencil thickness of 2.18mm (6 mils) for this QFN package is recommended. 3.19 mm 3.19 mm 0.8 mm 0.4 mm5.5 mm 5.5 mm 3.9 mm 2.18mm 0.8 mm0.4 mm
20 Lead QFN Recommended PCB Land Pad Design
IPC-SM-782 is used as the standard for the PCB land pad design. Recommended PCB finishing is gold plated. DELTA-FLUX = 2 °C/sec. max. DELTA-COOLING = 2 °C/sec. max. T-min. T-max. T-reflow T-peak t-reflowt-pre 40-60 sec. max. 20-40 sec. max. 120 °C 160 °C 218 °C 230 ± 5 °C TIME TEMPERATURE DELTA-RAMP = 1 °C/sec. max.
Package Tape and Reel Dimensions Carrier Tape Dimensions Recommendations for Handling and Storage of ADJD-S313 This product is qualified as Moisture Sensitive Level 3 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling Of Moisture Sensitive Surface Mount Devices for details. A. Storage before use
- Unopened moisture barrier bag (MBB) can be stored at 30°C and 90%RH or less for maximum 1 year
- It is not recommended to open the MBB prior to assembly (e.g. for IQC)
- It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride) to indicate the moisture within the bag B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB
- The components must be kept at <30°C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 168hrs C. Control for unfinished reel
- For any unused components, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH D. Control of assembled boards
- If the PCB soldered with the components is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no components have exceeded their floor life of 168hrs E. Baking is required if:
- “10%” or “15%” HIC indicator turns pink
- The components are exposed to condition of >30°C/ 60%RH at any time.
- The components floor life exceeded 168hrs
- Recommended baking condition (in component form): 125°C for 24hrs Ko Bo SECTION B-B SECTION A-A Ao 0.30 ± 0.05 B B AA 1.75 ± 0.10 5.50 ± 0.05 12.00 ± 0.10 R 0.50 TYP. 1.55 ± 0.05 4.00 ± 0.10 SEE NOTE #2 2.00 ± 0.05 SEE NOTE #2 Ao: Bo: Ko: PITCH: WIDTH: 5.30 5.30 2.20 8.00 12.00 NOTES: 1. Ao AND Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET. 2. 10 PITCHES CUMULATIVE TOLERANCE IS ± 0.2 mm. 3. DIMENSIONS ARE IN MILLIMETERS (mm).
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countrie s. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0470EN AV01-0688EN - January 4, 2007 Reel Dimensions 18.0 MAX.* 178.0 ± 0.5 12.445 R10.65 R5.2 +1.5* - 0.0 55.0 ± 0.5 176.0 512EMBOSSED RIBS RAISED: 0.25 mm WIDTH: 1.25 mm BACK VIEW NOTES: 1. *MEASURED AT HUB AREA. 2. ALL FLANGE EDGES TO BE ROUNDED.AVAGO TECHNOLOGIES' PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO TECHNOLOGIES OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. ESD WARNING: Standard CMOS handling precautions should be observed to avoid static discharge.