ACPM-7821 AVAGO | Alldatasheet
Document overview
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Technical content
Features
- Excellent linearity
- High efficiency
- 10-pin surface mounting package (4 mm x 4 mm x 1.1 mm)
- Low quiescent current
- Internal 50Ω matching networks for both RF input and output
- CDMA 95A/B, CDMA2000-1X/EVDO
Applications
- Digital Cellular (J-CDMA) Functional Block Diagram Output Match Input Match Inter Stage Match DA PA Bias Circuit & Control Logic RF Input (4) RF Output (8) Vcc1(5) Vcc2(6) Vref(1) Vcont(2) MODULE MMIC
Ordering Information
Part Number No. of Devices Container ACPM-7821-TR1 1000 7" Tape and Reel ACPM-7821-BLK 100 Bulk
Table 1. Absolute Maximum Ratings[1] Table 2. Recommended Operating Conditions Table 3. Power Range Truth T able
- No damage assuming only one parameter is set at limit at a time with all other parameters set at or
Table 4. Electrical Characteristics for CDMA Mode (Vcc=3.4V, Vref=2.85V, T=25 °C)
1.98 MHz offset ACPR2_low Pout = 17 dBm -68 -57 dBc
- Control current when series 6.2kohm is used.
- Characterized with IS-95 modulated signal
Figure 6. Evaluation Board Schematic. Figure 7. Evaluation Board Assembly Diagram.
1 Vref
2 Vcont
3 GND
4 RF In
5 Vcc1
Figure 8. Package Dimensional Drawing and Pin Descriptions.
Figure 9. Marking Specifications.
Figure 10. Peripheral Circuit.
- Place C1 near to Vref pin.
- π-type circuit topology is good to use for matching circuit between PA and Duplexer.
Figure 17. T ape and Reel Format – 4 mm x 4mm.
Figure 18. Plastic Reel Format – 13"/4".
in a factory environment at each manufacturing site. Table 5. ESD Classification
- PA module products should be considered extremely ESD sensitive.
jected to three consecutive simulated reflows. IPC/JEDEC J-STD-020A and J-STD-033. reel, de-taped and then re-bake. temperature of 250°C +0/-5°C. Table 6. Moisture Classification Level and Floor Life
1 Unlimited at ≤30oC/85% RH
- The MSL Level is marked on the MSL Label on each shipping bag.
Figure 19. T ypical SMT Reflow Profile for Maximum Temperature = 250 +0/-5°C. Table 7. Typical SMT Reflow Profile for Maximum Temperature = 250+0/-5°C Time 25°C to Peak T emperature 6 min max. 8 min max.
Packages described in this document must be stored in sealed moisture barrier, anti-static bags. Shelf life in a sealed moisture barrier bag is 12 months at <40°C and 90% relative humidity (RH) J-STD-033 p.7. Out-of-Bag Time Duration After unpacking the device must be soldered to the PCB within 168 hours as listed in the J-STD-020B p.11 with factory conditions <30 oC and 60% RH. Baking It is not necessary to re-bake the part if both condi- tions (storage conditions and out-of-bag condition) have been satisfied. Baking must be done if at least one of the conditions above have not been satisfied. The baking conditions are 125 for 24 hours J-STD-033 p.8. CAUTION: Tape and reel materials typically cannot be baked at the temperature described above. If out-of-bag exposure time is exceeded, parts must be baked for a longer time at low temperatures, or the parts must be re-reeled, de-taped, re-baked and then put back on tape and reel. (See moisture sensi- tive warning label on each shipping bag for informa- tion of baking) Board Rework Component Removal, Rework and Remount If a component is to be removed from the board, it is recommended that localized heating be used and the maximum body temperatures of any surface mount component on the board not exceed 200 °C. This method will minimize moisture related component damage. If any component temperature exceeds 200°C, the board must be baked dry per 4-2 prior to rework and/or component removal. Component tem- peratures shall be measured at the top center of the package body. Any SMD packages that have not ex- ceeded their floor life can be exposed to a maximum body temperature as high as their specified maximum reflow temperature. Removal for Failure Analysis Not following the requirements of 4-1 may cause moisture/reflow damage that could hinder or com- pletely prevent the determination of the original fail- ure mechanism. Baking of Populated Boards Some SMD packages and board materials are not able to withstand long duration bakes at 125°C. Examples of this are some FR-4 materials, which cannot with- stand a 24 hr bake at 125 °C. Batteries and electro- lytic capacitors are also temperature sensitive. With component and board temperature restrictions in mind, choose a bake temperature from Table 4-1 in J-STD 033; then determine the appropriate bake duration based on the component to be removed. For additional considerations see IPC-7711 and IPC-7721. Derating due to Factory Environmental Conditions Factory floor life exposures for SMD packages removed from the dry bags will be a function of the ambient environmental conditions. A safe, yet con- servative, handling approach is to expose the SMD packages only up to the maximum time limits for each moisture sensitivity level as shown in Table 6. This approach, however, does not work if the factory hu- midity or temperature are greater than the testing conditions of 30°C/60% RH. A solution for address- ing this problem is to derate the exposure times based on the knowledge of moisture diffusion in the com- ponent packaging materials (ref. JESD22-A120). Rec- ommended equivalent total floor life exposures can be estimated for a range of humidity’s and tempera- tures based on the nominal plastic thickness for each device. Table 8 lists equivalent derated floor lives for humidity’s ranging from 20 – 90% RH for three tem- peratures, 20°C, 25°C, and 30°C. This table is appli- cable to SMDs molded with novolac, biphenyl or mul- tifunctional epoxy mold compounds. The following assumptions were used in calculating Table 8: 1. Activation Energy for diffusion = 0.35eV (smallest known value). 2. For ≤60% RH, use Diffusivity = 0.121exp (- 0.35eV/kT) mm2/s (this uses smallest known Diffusivity @ 30°C). 3. For >60% RH, use Diffusivity = 1.320exp (- 0.35eV/kT) mm2/s (this uses largest known Diffusivity @ 30°C). Handling and Storage, continued
Table 8. Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C For ICs with Novolac, Biphenyl and in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved.