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Technical content
Features
/g120 Dual-Band PA (Band1 and Band8) /g120 Small Size (4x5mm) /g120 Thin Package (1.0mm typ) /g120 Excellent Linearity /g120 3-mode power control Bypass / Mid Power Mode / High Power Mode /g120 High Efficiency at max output power /g120 14-pin surface mounting package /g120 Internal 50ohm matching networks for both RF input and output /g120 Lead-free, RoHS compliant, Green
Applications
/g120 UMTS Band1 and Band8
Ordering Information
ACPM-7357-TR1 1000 178mm (7”) Tape/Reel ACPM-7357-BLK 100 Bulk RFin_LB RFin_HB RFout_LB RFout_HB Bias Circuit & Control Logic Bypass Circuit Bypass Circuit Impedance Transformer Impedance Transformer Output Match Output Match Vcc1 Vcc2 Vmode Vbp Ven_LB Ven_HB Input Match & Power Divider Input Match & Power Divider
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below typical value. Operation of any single parameter outside these conditions with the remaining parameters set at or below typical values may result in permanent damage Description Min T yp Max Unit Associated Pins RF Input Power (high power mode) Output power (bypass mode) Output power (mid power mode) 01 0 dBm RFIn_Hi, RFIn_Low RFOut_Hi, RFOut_Low RFOut_Hi, RFOut_Low DC Supply Voltage 0 3.4 5.0 V Vcc1, Vcc2 Enable Voltage 0 2.6 3.3 V Ven_Low, Ven_Hi Mode Control Voltage 0 2.6 3.3 V Vmode Bypass Control 0 2.6 3.3 V Vbp Storage Temperature -55 25 +125 °C Recommended Operating Condition Description Min T yp Max Unit DC Supply Voltage 3.2 3.4 4.2 V Enable Voltage (Ven_Low, Ven_Hi) LOW HIGH 1.35 2.6 0.5 3.1 V V Mode Control Voltage (Vmode) LOW HIGH 1.35 2.6 0.5 3.1 V V Bypass Control Voltage (Vbp) LOW HIGH 1.35 2.6 0.5 3.1 V V Operating Frequency Band8 Band1 890 1920 915 1980 MHz MHz Ambient Temperature -30 25 85 °C Operating Logic Table Power Mode Ven_Low, Ven_Hi Vbp Vmode Pout ( Rel99) Pout (HSDPA, HSUPA MP R=0dB) High Power Mode HIGH LOW LOW ~27.0dBm (Band1) ~27.5dBm(Band8) ~26.0dBm (Band1) ~ 26.5dBm (Band8) Mid Power Mode HIGH LOW HIGH ~17dBm ~16dBm Bypass Mode HIGH HIGH HIGH ~8dBm ~7dBm Shut Down Mode LOW LOW LOW – –
Electrical Characteristics in Band1 – Conditions: Vcc=3.4V, Ven_Hi=2.6V, T=25°C, Zin/Zout=50ohm – Signal Configuration: 3GPP (DPCCH+1DPDCH) Up-Link unless specified otherwise Characteristics Condition Min T yp Max Unit Operating Frequency Range 1920 – 1980 MHz Gain High Power Mode, Pout=27dBm 24 27.3 dB Mid Power Mode, Pout=17dBm 15 20.8 dB Bypass Power Mode, Pout=8dBm 10 14.0 dB Total Supply Current High Power Mode, Pout=27dBm 400 450 mA Mid Power Mode, Pout=17dBm 69 100 mA Bypass Power Mode, Pout=8dBm 14 20 mA Quiescent Current High Power Mode 75 100 125 mA Mid Power Mode 15 25 35 mA Bypass Mode 1.5 3 4.5 mA Enable Current High Power Mode 10 /g80A Mid Power Mode 10 /g80A Bypass Mode 10 /g80A Mode Control Current Mid Power Mode 5 /g80A Bypass Mode 5 /g80A Bypass Control Current 100 uA Total Current in Power-down mode Ven_Hi=0V, Vmode=0V, Vbp=0V 0.2 5 /g80A Adjacent Channel Leakage Ratio
5 MHz offset
10 MHz offset
High Power Mode, Pout=27dBm -36 -46 dBc dBc High Power Mode, Pout=26dBm (HSDPA, HSUPA MPR=0dB) -35 -46 dBc dBc Mid Power Mode, Pout=17dBm -36 -46 dBc dBc Mid Power Mode, Pout=16dBm (HSDPA, HSUPA MPR=0dB) -36 -46 dBc dBc Bypass Mode, Pout=8dBm -36 -46 dBc dBc Bypass Mode, Pout=7dBm (HSDPA, HSUPA MPR=0dB) -36 -46 dBc dBc Harmonic Suppression Second Third High Power Mode, Pout=27dBm -30 -40 dBc dBc Input VSWR 2:1 2.5:1 Stability (Spurious Output) In-Band Load VSWR <= 5:1, All Phase Out of Band Load VSWR <= 10:1, All Phase Forwarded power fixed -60 dBc Rx Band Noise Power -140 -136 dBm/Hz GPS Band Noise -141 -137 dBm/Hz ISM Band Noise -144 -140 dBm/Hz Phase Discontinuity mid power mode high power mode, at Pout=17dBm low power mode mid power mode, at Pout=8dBm deg deg Ruggedness No Damage Pout<27dBm, Pin<10dBm, All phase High Power Mode 10:1 VSWR
Electrical Characteristics in Band8 – Conditions: Vcc=3.4V, Ven_Low=2.6V, T=25°C, Zin/Zout=50ohm – Signal Configuration: 3GPP (DPCCH+1DPDCH) Up-Link unless specified otherwise Characteristics Condition Min. T yp. Max. Unit Operating Frequency Range 890 – 915 MHz Gain High Power Mode, Pout=27.5dBm 24 27.2 dB Mid Power Mode, Pout=17dBm 13.5 17.5 dB Bypass Power Mode, Pout=8dBm 10 14.4 dB Total Supply Current High Power Mode, Pout=27.5dBm 429 485 mA Mid Power Mode, Pout=17dBm 74 105 mA Bypass Power Mode, Pout=8dBm 14 20 mA Quiescent Current High Power Mode 70 95 120 mA Mid Power Mode 10 21 30 mA Bypass Mode 2 3.5 5 mA Enable Current High Power Mode 10 /g80A Mid Power Mode 10 /g80A Bypass Mode 10 /g80A Mode Control Current Mid Power Mode 5 /g80A Bypass Mode 5 /g80A Bypass Control Current 100 uA Total Current in Power-down mode Ven_Low=0V, Vmode=0V, Vbp=0V 0.2 5 /g80A Adjacent Channel Leakage Ratio High Power Mode, Pout=27.5dBm -36 -46 dBc dBc High Power Mode, Pout=26.5dBm (HSDPA, HSUPA MPR=0dB) -35 -46 dBc dBc Mid Power Mode, Pout=17dBm -36 -46 dBc dBc Mid Power Mode, Pout=16dBm (HSDPA, HSUPA MPR=0dB) -36 -46 dBc dBc Bypass Mode, Pout=8dBm -36 -46 dBc dBc Bypass Mode, Pout=7dBm (HSDPA, HSUPA MPR=0dB) -36 -46 dBc dBc Harmonic Suppression Second Third High Power Mode, Pout=27.5 dBm -30 -40 dBc dBc Input VSWR 2:1 2.5:1 Stability (Spurious Output) In-Band Load VSWR <= 5:1, All Phase Out of Band Load VSWR <= 10:1, All Phase Forwarded power fixed -60 dBc Rx Band Noise Power -135.5 -133 dBm/Hz GPS Band Noise -150 -145 dBm/Hz ISM Band Noise -160 -155 dBm/Hz Phase Discontinuity mid power mode high power mode, at Pout=17dBm low power mode mid power mode, at Pout=8dBm deg deg Ruggedness No Damage Pout<27.5dBm, Pin<10dBm, All phase High Power Mode 10:1 VSWR
HSDPA Signal configuration used: 3GPP TS 34.121-1 Annex C (normative e): Measurement channels C.10.1 UL reference measurement channel for HSDPA tests Table C.10.1.4: /g69 values for transmitter characteristics tests with HS-DPCCH Sub-test 2 (CM=1.0, MPR=0.0) HSUPA signal configuration used: 3GPP TS 34.121-1 Annex C (normative): Measurement channels C.11.1 UL reference measurement channel for E-DCH tests Table C.11.1.3: /g69 values for transmitter characteristics tests with HS-DPCCH and E-DCH Sub-test 1 (CM=1.0, MPR=0.0)
Characteristics Data of Band1 (Vcc=3.4V, Ven_Hi=2.6, Vbp, Vmode= 0V or 2.6V, T=25°C, Zin/Zout=50ohm, Rel99) Total Current vs. Output Power Gain vs. Output Po wer Adjacent Channel Leakage Ratio 1 vs. Output Power Adjacent Channel Leakage Ratio 2 vs. Output Power Power Added Efficiency vs. Output Power 100 150 200 250 300 350 400 450 500 -5 0 5 10 15 20 253 0 Pout (dBm) Current (mA) -60 -55 -50 -45 -40 -35 -30 -5 0 5 10 15 20 253 0 Pout (dBm) ACLR1 (dBc) -5 0 5 10 15 20 253 0 Pout (dBm) PAE(%) -5 0 5 10 15 20 253 0 Pout (dBm) Gain (dB) -70 -65 -60 -55 -50 -45 -40 -5 0 5 10 15 20 253 0 Pout (dBm) ACLR2 (dBc) 1920MHz, 3.4V 1950MHz, 3.4V 1980MHz, 3.4V 1920MHz, 3.4V 1950MHz, 3.4V 1980MHz, 3.4V 1920MHz, 3.4V 1950MHz, 3.4V 1980MHz, 3.4V 1920MHz, 3.4V 1950MHz, 3.4V 1980MHz, 3.4V 1920MHz, 3.4V 1950MHz, 3.4V 1980MHz, 3.4V
Characteristics Data of Band8 (Vcc=3.4V, Ven_Low=2.6, Vbp and Vmode= 0V or 2.6V, T=25°C, Zin/Zout=50ohm, Rel99) Total Current vs. Output Power Gain vs. Output Po wer Adjacent Channel Power Ratio 1 vs. Output Power Adjacent Channel Po wer Ratio 2 vs. Output Power Power Added Efficiency vs. Output Power 100 150 200 250 300 350 400 450 500 -5 0 5 10 15 20 253 0 Pout (dBm) Current (mA) -60 -55 -50 -45 -40 -35 -30 -5 0 5 10 15 20 253 0 Pout (dBm) ACLR1 (dBc) -5 0 5 10 15 20 253 0 Pout (dBm) PAE(%) -5 0 5 10 15 20 253 0 Pout (dBm) Gain (dB) -70 -65 -60 -55 -50 -45 -40 -5 0 5 10 15 20 253 0 Pout (dBm) ACLR2 (dBc) 880MHz, 3.4V 898MHz, 3.4V 915MHz, 3.4V 880MHz, 3.4V 898MHz, 3.4V 915MHz, 3.4V 880MHz, 3.4V 898MHz, 3.4V 915MHz, 3.4V 880MHz, 3.4V 898MHz, 3.4V 915MHz, 3.4V 880MHz, 3.4V 898MHz, 3.4V 915MHz, 3.4V
All dimensions are in millimeter PIN DESCRIPTIONS Pin # Name Description
1 RFIn_Low Band8 RF Input
2 Vmode Mode Control
3 Vbp Bypass Control
4 Vcc1 Supply Voltage
5 Ven_Low Band8 PA Enable
6 Ven_Hi Band1 PA Enable
7 RFIn_Hi Band1 RF Input
8 RFOut_Hi Band1 RF Output
9 GND Ground
10 GND Ground
11 Vcc2 Supply Voltage
12 GND Ground
13 GND Ground
14 RFOut_Low Band8 RF Output
All dimensions are in millimeter XRAY TOP VIEW 4 ± 0.1 1.0 ± 0.05 Pin 1 Mark 5 ± 0.1 0.6
output power ranges are high. on/off is controlled by Ven. This is digitally control pin. tion more, which accordingly gives extended talk time. Figure 1. PDF and Current cation of current and probability at each output power.
summarized in the below table. These pins do not require constant voltage for interface. Figure 2. Icc Comparison of CP5 to CP4 (Avago CoolPAM) of handset more compared with the CP4.
Solder Paste Stencil Aperture PCB Design Guidelines The recommended PCB land pattern is shown in figures on the left side. The substrate is coated with solder mask between the I/O and conductive paddle to protect the gold pads from short circuit that is caused by solder bleeding/bridging. Stencil Design Guidelines A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. The recommended stencil layout is shown here. Reducing the stencil opening can potentially generate more voids. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads or conductive paddle to adjacent I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use laser cut stencil composed of 0.100mm(4mils) or 0.127mm(5mils) thick stainless steel which is capable of producing the required fine stencil outline. ø 0.3 Via on 0.6 pitch 0.60 0.40 0.73 0.25 0.33 0.50 0.70 0.55 0.50 0.73 2.40 2.30 0.60 0.40 0.73 0.50 2.00 2.10
Evaluation Board Schematic Evaluation Board Description
1 RFIn_Low
2 Vmode
3 Vbp
4 Vcc1
RFOut_Low 14 GND 12 Vcc2 11 Band8 RF In Vmode Vcc2 Band1 RF Out 100pF GND 13
5 Ven_Low
6 Ven_Hi
7 RFIn_Hi
RFOut_Hi 8 GND 9 Vbp 100pFVcc1 1000pF 2.2uFVen_Band8 100pFVen_Band1 100pFBand1 RF In 2.2uF 1000pF Band8 RF Out AVAGO ACPM-7357 PYYWW AAAAA
A0 4.40±0.10 B0 5.30±0.10 K0 1.20±0.10 D0 1.55±0.05 D1 1.60±0.10 P0 4.00±0.10 P1 8.00±0.10 Dimension Millimeter P2 2.00±0.05 P10 40.00±0.20 E 1.75±0.10 F 5.50±0.05 W 12.00±0.30 T 0.30±0.05 AVAGO ACPM-7357 PYYWW AAAAA Tape and Reel Format – 4 mm x 5 mm
Plastic Reel Format (all dimensions are in millimeters) Reel Drawing NOTES: 1. Reel shall be labeled with the following information (as a minimum). a. manufacturers name or symbol b. Avago Technologies part number c. purchase order number d. date code e. quantity of units 2. A certificate of compliance (c of c) shall be issued and accompany each shipment of product. 3. Reel must not be made with or contain ozone depleting materials. 4. All dimensions in millimeters (mm) 50 min. 12.4 +2.0 -0.0 18.4 max. min wide (ref) Slot for carrier tape insertion for attachment to reel hub (2 places 180° apart) BACK VIEW FRONT VIEW 178 Shading indicates thru slots +0.4 -0.2 21.0 ± 0.8 13.0 ± 0.2 1.5 min.
ESD (Electrostatic Discharge) Electrostatic discharge occurs naturally in the environ- naturally in the environ-naturally in the environ- ment. With the increase in voltage potential, the outlet of neutralization or discharge will be sought. If the acquired discharge route is through a semiconductor device, de- through a semiconductor device, de-through a semiconductor device, de- de-de- structive damage will result. ESD countermeasure methods should be developed and used to control potential ESD damage during handling in a factory environment at each manufacturing site. MSL (Moisture Sensitivity Level) Plastic encapsulated surface mount package is sensitive to damage induced by absorbed moisture and temperature. Avago Technologies follows JEDEC Standard J-STD 020B. Each component and package type is classified for moisture sensitivity by soaking a known dry package at Moisture Classification Level and Floor Life MSL Level Floor Life (out of bag) at factory ambient =< 30°C/60% RH or as stated
1 Unlimited at =< 30°C/85% RH
6 Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label Note : 1. The MSL Level is marked on the MSL Label on each shipping bag. various temperatures and relative humidity, and times. After soak, the components are subjected to three con- subjected to three con-subjected to three con- secutive simulated reflows. The out of bag exposure time maximum limits are deter- mined by the classification test describe below which cor- responds to a MSL classification level 6 to 1 according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. ACPM-7357 is MSL3. Thus, according to the J-STD-033 p.10, the maximum Manufacturers Exposure Time (MET) for this part is 168 hours. After this time period, the part would need to be removed from the reel, de-taped and then re-baked. MSL classification reflow temperature for the ACPM-7357 is targeted at 260°C +0/-5°C. Figure and table on next page show typical SMT profile for maximum temperature of 260 +0/-5°C.
Reflow Profile Recommendations Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C Time Temperature Tp TL tp tL t 25°C to Peak Ramp-up ts Tsmin Ramp-do wn Preheat Critical Zone TL to Tp Tsmax Typical SMT Reflow Profile for Maximum Temperature = 260 +0/ -5°C Profile Feature Sn-Pb Solder Pb-Free Solder Average ramp-up rate (TL to TP) 3°C/sec max 3°C/sec max Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) 100°C 150°C 60-120 sec 150°C 200°C 60-120 sec Tsmax to TL – Ramp-up Rate 3°C/sec max Time maintained above: – Temperature (TL) – Time (TL) 183°C 60-150 sec 217°C 60-150 sec Peak temperature (Tp) 240 +0/-5°C 260 +0/-5°C Time within 5°C of actual Peak Temperature (tp) 10-30 sec 20-40 sec Ramp-down Rate 6°C/sec max 6°C/sec max Time 25°C to Peak Temperature 6 min max. 8 min max.
Packages described in this document must be stored in sealed moisture barrier, antistatic bags. Shelf life in a sealed moisture barrier bag is 12 months at <40°C and 90% relative humidity (RH) J-STD-033 p.6. Out-of-Bag Time Duration After unpacking the device must be soldered to the PCB within 168 hours with factory conditions <30°C and 60% RH as listed in the Table 5-1 on the J-STD-020D p.6. Baking It is not necessary to re-bake the part if both conditions (storage conditions and out-of bag conditions) have been satisfied. Baking must be done if at least one of the condi- Baking must be done if at least one of the condi-Baking must be done if at least one of the condi- one of the condi-one of the condi- tions above has not been satisfied. The baking conditions are listed in the Table 4-1 on the J-STD-033 p.8. CAUTION Tape and reel materials typically cannot be baked at the temperature described above. If out-of-bag exposure time is exceeded, parts must be baked for a longer time at low temperatures, or the parts must be de-reeled, de- taped, re-baked and then put back on tape and reel. (See moisture sensitive warning label on each shipping bag for information of baking). Board Rework Component Removal, Rework and Remount If a component is to be removed from the board, it is recommended that localized heating be used and the maximum body temperatures of any surface mount component on the board not exceed 200°C. This method will minimize moisture related component damage. If any component temperature exceeds 200°C, the board must be baked dry per 4-2 prior to rework and/or component removal. Component temperatures shall be measured at the top center of the package body. Any SMD packages that have not exceeded their floor life can be exposed to a maximum body temperature as high as their specified maximum reflow temperature. Removal for Failure Anal ysis Not following the above requirements may cause moisture/ reflow damage that could hinder or completely prevent the determination of the original failure mechanism. Baking of Populated Boards Some SMD packages and board materials are not able to withstand long duration bakes at 125°C. Examples of this are some FR-4 materials, which cannot withstand a 24 hr bake at 125°C. Batteries and electrolytic capacitors are also temperature sensitive. With component and board temperature restrictions in mind, choose a bake tem- mind, choose a bake tem-mind, choose a bake tem- perature from Table 4-1 in J-STD 033; then determine the appropriate bake duration based on the component to be removed. For additional considerations see IPC-7711 andIPC-7721. Derating due to Factor y Environmental Conditions Factory floor life exposures for SMD packages removed from the dry bags will be a function of the ambient envi- ronmental conditions. A safe, yet conservative, handling approach is to expose the SMD packages only up to the maximum time limits for each moisture sensitivity level as shown in table of Moisture Classification Level and Floor Life. This approach, however, does not work if the factory humidity or temperature is greater than the testing conditions of 30°C/60% RH. A solution for address- ing this problem is to derate the exposure times based on the knowledge of moisture diffusion in the component package materials ref. JESD22-A120). Recommended equivalent total floor life exposures can be estimated for a range of humidities and temperatures based on the nominal plastic thickness for each device. Table on follwoing page lists equivalent derated floor lives for humidities ranging from 20-90% RH for three tempera- ture, 20°C, 25°C, and 30°C. This table is applicable to SMDs molded with novolac, biphenyl or multifunctional epoxy mold compounds. The following assumptions were used in calculating this table: 1. Activation Energy for diffusion = 0.35eV (smallest known value). 2. For ≤60% RH, use Diffusivity = 0.121exp (-0.35eV/kT) mm2/s (this used smallest known Diffusivity @ 30°C). 3. For >60% RH, use Diffusivity = 1.320exp (-0.35eV/kT) mm2/s (this used largest known Diffusivity @ 30°C).
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-2036EN - July 30, 2009 Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C, 35°C For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reflow at same temperature at which the component was classified) Maximum Percent Relative Humidity Maximum Percent Relative Humidity Package Type and Body Thickness Moisture Sensitivity Level 5% 10% 20% 30% 40% 50% 60% 70% 80% 90% Body Thickness ≥3.1 mm Including PQFPs >84 pin, PLCCs (square) All MQFPs or All BGAs ≥1 mm Level 2a ∞ 124 167 231 103 35°C 30°C 25°C 20°C Level 3 ∞ 35°C 30°C 25°C 20°C Level 4 ∞ 35°C 30°C 25°C 20°C Level 5 ∞ 35°C 30°C 25°C 20°C Level 5a ∞ 35°C 30°C 25°C 20°C Body 2.1 mm ≤ Thickness <3.1 mm including PLCCs (rectangular) 18-32 pin SOICs (wide body) SOICs ≥20 pins, PQFPs ≤80 pins Level 2a ∞ 148 35°C 30°C 25°C 20°C Level 3 ∞ 35°C 30°C 25°C 20°C Level 4 ∞ 35°C 30°C 25°C 20°C Level 5 ∞ 35°C 30°C 25°C 20°C Level 5a ∞ 0.5 0.5 0.5 0.5 35°C 30°C 25°C 20°C Body Thickness <2.1 mm including SOICs <18 pin All TQFPs, TSOPs or All BGAs <1 mm body thickness Level 2a ∞ 0.5 0.5 35°C 30°C 25°C 20°C Level 3 ∞ 0.5 0.5 35°C 30°C 25°C 20°C Level 4 ∞ 0.5 0.5 35°C 30°C 25°C 20°C Level 5 ∞ 0.5 0.5 35°C 30°C 25°C 20°C Level 5a ∞ 0.5 0.5 0.5 35°C 30°C 25°C 20°C