ACPM-7332-TR1

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Document overview

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• PDF pages: 16

Technical content

Features

• Th Pe .9 Th Pe .9
• ee eee e
• 3-e we wh b e3-e we wh b e B / M Pwe Me / Hh Pwe Me
• Hh e weHh e we
• - e e- e e
• Ie 5h h ew bh Ie 5h h ew bh
• e-ee HS Gee

Applications

• UMTS B2UMTS B2 Block Diagram

Ordering Information

Part Number Number of Devices Container ACPM-7332-T 78 7” Te/ee ACPM-7332-BK BUK RF In(2) RF Out(8) Vcc1(1) Vbp(3) Ven(5) Vmode(4) Impedence Transformer Bypass Circuit Output Match Input Match & Power Divider Inter-Stage Match Vcc2(10) Bias Circuit & Control Logic

N e e ee e e wh he ee e bew ve. e bew ve.e bew ve. Oe e ee e hee wh he e ee e bew ve e ee e. Description Min. Typ. Max. Unit I Pwe P * B DC S e 2 3. 5. be e e 2.6 3.3 Me C e e 2.6 3.3 B C b 2.6 3.3 Se Teee T -55 25 +25 °C * Hh Pwe Me 5B B M Pwe Me Recommended Operating Condition Description Min. Typ. Max. Unit DC S e 2 3.2 3. .2 be e e w Hh .35 2.6 Me C e e w Hh .35 2.6 B C e b w Hh .35 2.6 Oe ee 85 9 MHz Abe Teee T -2 25 85 °C Operating Logic Table Power Mode Ven Vmode Vbp Pout (Rel99) Pout (HSDPA, HSUPA MPR=0dB) Hh Pwe Me Hh w w ~ 29 B ~ 28 B M Pwe Me Hh Hh w ~ 7 B ~ 6 B B Me Hh Hh Hh ~ 8 B ~ 7 B Sh Dw Me w w w

Electrical Characteristics for WCDMA Mode Characteristics Condition Min. Typ. Max. Unit Oe ee e 85 9 MHz G Hh Pwe Me P=29B 25 28 B M Pwe Me P=7B 6 2 B B Me P=8B 8 6 B GPS B G eve T G HPM G@P=-5B G@P=29B - - B B G eve T G HPM G@P=-5B G@P=29B -2 - B ISM B G eve T G HPM G@P=-5B G@P=29B -23 - B Pwe Ae e Hh Pwe Me P=29B 36.7 .6 % M Pwe Me P=7B .6 9.5 % B Me P=8B 8.5 2.7 % T S Ce Hh Pwe Me P=29B 575 635 A M Pwe Me P=7B 75 A B Me P=8B 3.5 2 A Qee Ce Hh Pwe Me 75 25 A M Pwe Me 5 25 35 A B Me 2 3 A be Ce Hh Pwe Me 25 µA M Pwe Me 25 µA B Me 25 µA Me C Ce M Pwe Me 5 25 µA B Me 5 25 µA B C Ce B 5 25 µA T Ce Pwe-w e e= e= b= 5 µA Aje Che ee

5 MHz ffe

Hh Pwe Me P=29B - -53 -37 B B Hh Pwe Me P=28B HSDPA HSUPA MP=B -52 -36 B B M Pwe Me P=7B -8 -37 B B M Pwe Me P=6B HSDPA HSUPA MP=B -37 B B B Me P=8B -2 -37 B B B Me P=7B HSDPA HSUPA MP=B -53 -37 B B

Electrical Characteristics for WCDMA Mode Characteristics Condition Min. Typ. Max. Unit H Se Se Th Hh Pwe Me P=29B -6 -63 -35 B B G H Se Th B I SW .8 2.5: Sb S O SW 5: A he -6 B Ne Pwe B =.2 Hh Pwe Me P=29B -36.5 -35 B/Hz GPS B Ne =.2 Hh Pwe Me P=29B - -38 B/Hz ISM B Ne =.2 Hh Pwe Me P=29B -5 - Phe D HPM↔MPM P=7B MPM↔BPM P=8B e e ee P<28.25B & P<5B A he Hh Pwe Me 8: SW . HSDPA - 3GPP TS 3.2- - Ue e U e efi; ee DD; P : Ce efi - Ae C ve: Meee he - C.. U eeee eee he HSDPA e - Tbe C...: β ve e he e wh HS-DPCCH - Sb-e 2 CM=.B MP=.B 2. HSUPA - 3GPP TS 3.2- - Ue e U e efi; ee DD; P : Ce efi - Ae C ve: Meee he - C.. U eeee eee he -DCH e - Tbe C...3: β ve e he e wh HS-DPCCH -DCH - Sb-e CM=.B MP=.B

Pin # Name Description DC S e 2 I 3 b B C e Me C 5 e PA be

6 GND G

7 GND G

9 GND G

2 DC S e

1.90 1.70 0.85 1.20 1.90 0.40 0.40 0.10 X-Ray Top View Package Dimensions A e e ee 4 ± 0.1 4 ± 0.1 Pin 1 Mark 0.6 0.9 ± 0.1 Marking Specification Pin 1 Mark AVAGO ACPM-7332 PYYWW AAAAA Manufacturing Part Number Lot Number P Manufacturing info YY Manufacturing Year WW Work Week AAAAA Assembly Lot Number

Figure 1. PDF and Current

Application on mobile phone board A ee be hw bew. C C5 h be e e . B C C2 C3 h be e eb 5 3 eeve. The eh -PA e h be ze ee e . Peripheral Circuits PCB layout and part placement on phone board Via hole PCB guideline on phone board Ne . T eve ve ehe b e we be Pve e he b e we be P e he b e we be Pe he b e we be Pbe PP 2. Ue v he ee ff PA e he ee ff PA e ee ff PA e e e e e bee . O he PA h be e . O he PA h be e O he PA h be e he PA h be e he PA h be e h be e he eeve . O h be e he eeve . O h be ehe eeve . O h be e. O h be e PA . Gee e 3. Ue v he e e e e he e e e e e e e e e e e e. The he he e e e he. The he he e e e he. The he he e e e heThe he he e e e hehe he e e e hehe e e e he b eee be wee. The he ve The he ve he he ve he ve ve b ew e.ew e.ew e. . PA whh h ee v he whh hh ee v he whh hh ee v hewhh hh he whh hh whh hhwhh hh he e e e.e e e.e e.e e. BB C3 L1 output matching circuit ACPM-7332 PA_ON PA_R0 PA_R1 Vcc1 IN VbpVmode Ven Vcc2 GND OUTGND GND TX filter RF In Coupler RF Out C4 C5 VBATT

0.7 0.5 0.55 0.85 2.4 1.8 Solder Paste Stencil Aperture 0.6 0.5 1.6 2.0 0.85 0.4 PCB Design Guidelines The eee PCB e hw fie he e e. The be e wh e bewee he I/O ve e e he h h e b e bee/b. Stencil Design Guidelines A e ee e ee e ee ee e e ee he PCB . The eee e hw hee. e he e e e eee e v. O he he h e e e h % w e e eve e e e b he I/O ve e je I/O . Ce he h e e he w e ffe he he e j he e e e e . .275 h e ee whh be he ee fie e e. 0.85 0.4 0.6 Ø 0.3mm on 0.6mm pitch 0.50.25

Evaluation Board Description Evaluation Board Schematic

1 Vcc1

2 RF In

3 Vbp

4 Vmode

5 Ven

2.2uF 1000pF 1000pF 2.2uF Vmode1 100pF C3 C2 C1 C4 C6 C5 C7 C5 C7 AVAGO ACPM-7332 PYYWW AAAAA

Annote Millimeter Annote Millimeter A .±. P2 2.±.5 B .±. P .±.2 K .7±. .75±. D .55±.5 5.5±.5 D .6±. W 2.±.3 P .±. T .3±.5 P 8.±. Te ee .

NOTS: . ee h be bee wh he w . e e b b. Av Tehe be . he e be . e e 2. A e e e h be e eh he 3. ee be e wh ze ee e. . A e ee 50 min. 12.4 +2.0 -0.0 18.4 max. min wide (ref) Slot for carrier tape insertion for attachment to reel hub (2 places 180° apart) BACK VIEW FRONT VIEW 178 Shading indicates thru slots +0.4 -0.2 21.0 ± 0.8 13.0 ± 0.2 1.5 min. P ee e e ee

ESD (Electrostatic Discharge) e he he e v- e. Wh he ee ve e he e ez he w be h. I he e he e hh e eve e- ve e w e. SD eee eh h be evee e e SD e h eve eh e. MSL (Moisture Sensitivity Level) P ee e e eve e e b bbe e eee. Av Tehe w JDC S J-STD 2B. h e e e fie e ev b w e v eee eve h e. Ae he e e bjee hee - eve e eflw. The b e e e e e- ee b he fi e ebe bew whh e MS fi eve 6 he JDC IPC/JDC J-STD-2B J-STD- 33. ACPM-7332 MS3. Th he J-STD-33 . he M e e Te MT h 68 h. Ae h e e he w ee be eve he ee e-e he e-be. MS fi eflw eee he ACPM-7332 ee 26°C +/-5°C. e be e e hw SMT fie eee 26 +/-5°C. Moisture Classification Level and Floor Life MS eve e b be = < 3°C/6% H e Ue = < 3°C/85% H 2 e 2 wee 3 168 hours 72 h 5 8 h 5 2 h 6 M be bee e. Ae be be eflwe wh he e efie he be Ne : . The MS eve e he MS be eh h b.

Reflow Profile Recommendations Time Temperature Tp TL tp tL t 25°C to Peak Ramp-up ts Tsmin Ramp-down Preheat Critical Zone TL to Tp Tsmax T SMT eflw Pfie M Teee = 26 +/-5°C. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C Profile Feature Sn-Pb Solder Pb-Free Solder Avee - e T TP 3°C/e 3°C/e Pehe Teee M T Teee M T Te 5°C 6-2 e 5°C 2°C 6-8 e T T - e 3°C/e Te e bve: Teee T Te T 83°C 6-5 e 27°C 6-5 e Pe eee T 2 +/-5°C 26 +/-5°C Te wh 5°C Pe Teee -3 e 2- e -w e 6°C/e 6°C/e Te 25°C Pe Teee 6 . 8 .

ee e be b . She e ee e be b 2 h <°C 9% eve h H J-STD-33 .7. Out-of-Bag Time Duratio n Ae he eve be ee he PCB wh 68 h e he J-STD-2B . wh <3°C 6% H. Baking I ee e-be he bh e - b hve bee fie. B be e e e he - bve hve bee fie. The b - e 25°C 2 h J-STD-33 .8. CAUTION Te ee e be be he eee ebe bve. I --b e e e eeee be be e e w eee he be e-eee e- e e-be he b e ee. See e eve w be eh h b Board Rework Component Removal, Rework and Remount I e be eve he b eee h ze he be e he b eee e e he b eee 2°C. Th eh w ze e ee e e. I e eee eee 2°C he b be be e -2 ew / e ev. Ce eee h be ee he ee he e b. A SMD e h hve eeee he fl e be ee b eee hh he efie eflw eee. Removal for Failure Analysis N w he bve eeee e/ e e/ e e/ eflw e h he ee eve e h he ee evee h he ee eve ee eveee eve Baking of Populated Boards Se SMD e b e e be wh be 25°C. e h e e - e whh wh 2 h be 25°C. B ee ee e eee eve. Wh e b eee e he be e- ee Tbe - J-STD 33; he eee he e be be he e be eve. e ee IPC-77 IPC-772. Derating due to Factory Environmental Conditions fl e e e SMD e eve he b w be he be ev- e . A e e evve h h ee he SMD e he e eh e ev eve hw e be. Th h hweve e w he h eee ee h he e 3°C/6% H. A e h be ee he e e e be he wee e ff he e e e e. JSD22-A2. eee ev e fl e e e be ee e he eee be he he eh eve. Tbe e e eve ee fl ve he 2-9% H hee ee- e 2°C 25°C 3°C. Tbe e e be SMD e wh v bhe e . The w wee e - h be: . Av e ff = .35e e w ve. 2. ≤6% H e Dffv = .2e -.35e/T 2/ h e e w Dffv @ 3°C. 3. >6% H e Dffv = .32e -.35e/T 2/ h e e w Dffv @ 3°C. Dffv @ 3°C.Dffv @ 3°C.

Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C, 35°C IC wh Nv Bhe M e eflw e eee whh he e w fie M Pee eve H Maximum Percent Relative Humidity Package Type and Body Thickness Moisture Sensitivity Level 5% 10% 20% 30% 40% 50% 60% 70% 80% 90% B The ≥3. I PQP >8 PCC e A MQP A BGA ≥ eve 2 ∞ 35°C 3°C 25°C 2°C eve 3 ∞ 35°C 3°C 25°C 2°C eve ∞ 35°C 3°C 25°C 2°C eve 5 ∞ 35°C 3°C 25°C 2°C eve 5 ∞ 35°C 3°C 25°C 2°C B 2. ≤ The <3. PCC e 8-32 SOIC we b SOIC ≥2 PQP ≤8 eve 2 ∞ 35°C 3°C 25°C 2°C eve 3 ∞ 35°C 3°C 25°C 2°C eve ∞ 35°C 3°C 25°C 2°C eve 5 ∞ 35°C 3°C 25°C 2°C eve 5 ∞ 35°C 3°C 25°C 2°C B The <2. SOIC <8 A TQP TSOP A BGA < b he eve 2 ∞ 35°C 3°C 25°C 2°C eve 3 ∞ 35°C 3°C 25°C 2°C eve ∞ 35°C 3°C 25°C 2°C eve 5 ∞ 35°C 3°C 25°C 2°C eve 5 ∞ 35°C 3°C 25°C 2°C

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-1946EN - May 29, 2009