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Technical content

Features

 Miniature Size – 2.0 x 2.5 mm size – 1.05 mm Max Height – Standard 2 x 2.5 mm PCB footprint  Balanced Rx Port, 150   High Isolation enables elimination of interstage fi lter  Co-banding enables elimination of the GSM Rx fi lter  High Power Rating – 33 dBm Abs Max Tx Power  Environmental – RoHS 6 Compliant – Halogen free – TBBPA Free Specifi cations  Rx Band Performance, -20 to +85° C – Insertion Loss (UMTS): 3.6 dB Max – Rx Noise Blocking: 50 dB Min  Tx Band Performance, -20 to +85° C – Insertion Loss (UMTS): 2.8 dB Max – Tx Interferer Blocking: 55 dB Min

Applications

UMTS and NCDMA handsets or data terminals oper ating in the Band 2 frequency range. Ant Port 3 Tx Port 1 Rx Port 2 (Balanced)

Min Max Min Typ [3] Max Min Max Antenna Port to Receive Port ZRx Impedance of Rx Port, Real Part (Balanced) Ohms 150 CMR Common Mode Rejection Ratio (1930.48 – 1989.52 MHz) dB 18 18 18 S23 Insertion Loss in UMTS Receive Band [4] (1930.48 – 1989.52 MHz) dB 3.6 1.9 3.4 3.3 S23 Insertion Loss in NCDMA Receive Band [5] (1930.6 – 1989.4 MHz) dB 4.4 1.9 3.4 3.6 S23 Attenuation in Transmit Band (1850.48 – 1909.52 MHz) dB 50 50 64 50 S22 Return Loss (SWR) of Receive Port in Rx Band (1930.48 – 1989.52 MHz) Transmit Port to Antenna Port ZTx Impedance of Tx Port, Real Part Ohms 50 S31 Insertion Loss in UMTS Transmit Band [4] (1850.48 – 1909.52 MHz) S31 Insertion Loss in NCDMA Transmit Band [5] (1850.6 – 1909.4 MHz) dB 3.4 1.3 2.5 3.5 S31 Attenuation in Receive Band (1930.48 – 1989.52 MHz) dB 44 44 62 44 S31 Attenuation in GPS Band (1574.4 – 1576.4 MHz) dB 40 40 40 S31 Attenuation in Bluetooth Band (2400 – 2483.5 MHz) dB 40 40 40 S31 Attenuation in Transmit 2 nd Harmonic Band (3701 – 3819 MHz) dB 30 30 30 S31 Attenuation in Transmit 3 rd Harmonic Band (5551.5 – 5728.5 MHz) dB 10 10 10 S11 Return Loss (SWR) of Transmit Port in Tx Band (1850.48 – 1909.52 MHz) Antenna Port ZAnt Impedance of Ant Port, Real Part Ohms 50 S33 Return Loss (SWR) of Ant Port in Rx Band (1930.48 – 1989.52 MHz) S33 Return Loss (SWR) of Ant Port in Tx Band (1850.48 – 1909.52 MHz) Isolation, Tx Port to Rx Port S21 Tx-Rx Isolation in UMTS Receive Band [4] (1930.48 – 1989.52 MHz) dB 50 50 63 50 S21 Tx-Rx Isolation in NCDMA Receive Band [5] (1930.6 – 1989.4 MHz) dB 44 50 63 50 S21 Tx-Rx Isolation in UMTS Transmit Band [4] (1850.48 – 1909.52 MHz) dB 55 55 62 55 S21 Tx-Rx Isolation in NCDMA Transmit Band [5] (1850.6 – 1909.4 MHz) dB 55 55 62 54 S21 Tx-Rx Common Mode Isolation in Transmit Band, (1850.5 – 1909.5 MHz) dB 67

  1. T C is the case temperature and is defi ned as the temperature of the underside of the Duplexer where it makes contact with the circuit board.
  2. Min/Max specifi cations are guaranteed at the indicated temperature with the input power to the Tx port equal to or less than +29 dBm over all Tx

frequencies unless otherwise noted.

  1. Typical data is the average value of the parameter over the indicated band at the specifi ed temperature. Typical values may vary over time.
  2. Integrated Insertion Loss over any 3.84 MHz channel within the band.
  3. Integrated Insertion Loss over any 1.25 MHz channel within the band.
  4. The maximum Tx Insertion Loss specifi cation at T c = +85° C is guaranteed for input power ≤ +27 dBm. For Tx input power between +27 dBm
  5. Specifi cations include eff ect of 12 nH inductor added via simulation in parallel with Rx port as shown in Figure 1.

Figure 1. Rx Port Impedance Match

  1. Operation in excess of any one of these conditions may result in permanent damage to the device.
  2. The device will function over the recommended range without degradation in reliability or permanent

change in performance, but is not guaranteed to meet electrical specifi cations. contact with the circuit board. Figure 20. Product Marking and Pin Orientation

Figure 21. Package Outline Drawing Figure 22. Pad Detail

  1. Dimensions in millimeters
  2. Dimensions nominal unless otherwise noted
  3. Contact areas are gold plated

6 Ant

0.15 X 45°

Figure 23. Recommended Solder Stencil Figure 24. Solder Stencil Superposed on ACMD-4102 Foot Print

  1. Peripheral clearance of stencil aperture for center device pad is 0.05
  2. Chamfer or radius all corners 0.05 mm min

Figure 25. Recommended Solder Mask Figure 26. Solder Mask Superposed on ACMD-4102 Foot Print

  1. Mask apertures match device pads 1:1

Figure 29. SMT Reel Drawing

  1. Reel shall be labeled with the following
  2. A certificate of compliance (c of c) shall
  3. Reel must not be made with or contain
  4. All dimensions in millimeters (mm)

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. AV02-2862EN - July 27, 2011 ACMD-4102 Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260° C JESD22-A113D Level 3

Ordering Information

Part Number No. of Devices Container ACMD-4102-BLK 100 Tape Strip or Anti-static Bag ACMD-4102-TR1 3000 178 mm (7-inch) Reel Figure 30. Verifi ed SMT Solder Profi le

6 February 2003