ACE24AC08CUA8UH

ACE24AC08C ACE | Alldatasheet

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Technical content

Features

⚫ Low voltage and low power operations: ACE24AC08C: VCC = 1.8V to 5.5V, Industrial temperature range (-40℃ to 85℃). ⚫ Maximum Standby current < 1µA ⚫ 16 bytes page write mode. ⚫ Partial page write operation allowed. ⚫ Internally organized: 1,024 × 8 (8K). ⚫ Standard 2-wire bi-directional serial interface. ⚫ Schmitt trigger, filtered inputs for noise protection. ⚫ Self-timed programming cycle (5ms maximum). ⚫ 1 MHz (2.5-5V), 400 kHz (1.8V) Compatibility. ⚫ Automatic erase before write operation. ⚫ Write protect pin for hardware data protection. ⚫ High reliability: typically, 1,000,000 cycles endurance. ⚫ 100 years data retention. ⚫ Standard 8-pin DIP/SOP/MSOP/TSSOP/USON and 5-pin SOT-23/TSOT-23 Pb-free packages. Absolute Maximum Ratings Industrial operating temperature -40℃ to 85℃ Storage temperature -50℃ to 125℃ Input voltage on any pin relative to ground -0.3V to VCC + 0.3V Maximum voltage 8V ESD protection on all pins >4000V *Notice: Stresses exceed those listed under “Absolute Maximum Rating” may cause permanent damage to the device. Functional operation of the device at conditions beyond those listed in the specification is not guaranteed. Prolonged exposure to extreme conditions may affect device reliability or functionality.

VER 1. 1 2 Packaging Type DIP-8 SOP-8 TSSOP-8 MSOP-8 USON3*2-8 SOT-23-5 TSOT-23-5 Pin Configurations Pin Name Function A2 Device Address Inputs SDA Serial Data Input / Open Drain Output SCL Serial Clock Input WP Write Protect VCC Power Supply GND Ground NC No-Connect

Ordering Information

U：Tube T：T ape and Reel OM：MSOP8 DP：DIP-8 FM：SOP-8 TM：TSSOP-8 UA8：USON3*2-8 BN：SOT23-5 BNS：TSOT23-5 Halogen - free

VER 1. 1 3 Block Diagram Pin Description A. SERIAL CLOCK (SCL) The rising edge of this SCL input is to latch data into the EEPROM device while the falling edge of this clock is to clock data out of the EEPROM device. B. SERIAL DATA LINE (SDA) SDA data line is a bi-directional signal for the serial devices. It is an open drain output signal and can be wired- OR with other open-drain output devices. C. DEVICE / CHIP SELECT ADDRESSES (A2) This is the chip select input signal for the serial EEPROM devices. Typically, this signal is hardwired to either VIH or VIL. If left unconnected, it is internally recognized as VIL. However, due to capacitive coupling that may appear in customer applications, ACE recommends always connecting the address pin to a known state. When u sing a pull-up or pull-down resistor, ACE recommends using 10kΩ or less. D. WRITE PROTECT (WP) The ACE24AC08C devices have a WP pin to protect the whole EEPROM array from programming. Programming operations are allowed if WP pin is left un -connected or input to VIL. Conversely all programming functions are disabled if WP pin is connected to V IH or VCC. Read operations is not affected by the WP pin’s input level. If left unconnected, it is internally recognized as VIL. However, due to capacitive coupling that ma y appear in cu stomer applications, ACE recommends always connecting the WP pin to a known state. When using a pull -up or pull - down resistor, ACE recommends using 10kΩ or less.

VER 1. 1 4 Memory Organization The ACE24AC08C devices have 64 pages. Since each page has 16 bytes, random word addressing to ACE24AC08C will require 10 bits data word addresses. Device Operation (A) SERIAL CLOCK AND DATA TRANSITIONS The SDA pin is typically pulled to high by an external resistor. Data is allowed to change only when Serial clock SCL is at V IL. Any SDA signal transition may interpret as either a START or STOP condition as described below. (B) START CONDITION With SCL ≥ VIH, a S DA transition from high to low is interpreted as a START condition. All valid commands must begin with a START condition. (C) STOP CONDITION With SCL ≥ VIH, a SDA transition from low to high is interpreted as a STOP condition. All valid read or write commands end with a STOP condition. The device goes into the STANDBY mode if it is after a read command. A STOP condition after page or byte write command will trigger the chip into the STANDBY mode after the self- timed internal programming finish. (D) ACKNOWLEDGE The 2-wire protocol transmits address and data to and from the EEPROM in 8 bit words. The EEPROM acknowledges the data or address by outputting a "0" after receiving each word. The ACKNOWLEDGE signal occurs on the 9th serial clock after each word. (E) STANDBY MODE The EEPROM goes into low power STANDBY mode after a fresh power up, after receiving a STOP bit in read mode, or after completing a self-time internal programming operation (F) SOFT RESET After an interruption in protocol power loss or system reset, any two-wire part can be reset by following these steps: 1. Creat a START condition, 2. Clock eighteen data bits “1”, 3. Creat a start condition as SDA is high.

VER 1. 1 6 Write Operations A. BYTE WRITE A byte write operation starts when a micro -controller sends a START bit condition, follows by a proper EEPROM device address and then a write command. If the device address bits match the chip select address, the EEPROM device will acknowledge at the 9 th clock cycle. The micro-controller will then send the res t of the lower 8 bits word address. At the 18 th cycle, the EEPROM will acknowledge the 8 -bit address word. The micro controller will then transmit the 8 bit data. Following an ACKNOWLDEGE signal from the EEPROM at the 27 th clock cycle, the micro-controller w ill issue a STOP bit. After receiving the STOP bit, the EEPROM will go into a self-timed programming mode during which all external inputs will be disabled. After a programming time of TWC, the byte programming will finish and the EEPROM device will ret urn to the STANDBY mode. B. PAGE WRITE A page write is similar to a byte write with the exception that one to sixteen bytes can be programmed along the same page or memory row. All ACE24AC08C are organized to have 16 bytes per memory row or page. With the same write command as the byte write, the micro-controller does not issue a STOP bit after sending the 1st byte data and receiving the ACKNOWLEDGE signal from the EEPROM on the 27th clock cycle. Instead, it sends out a second 8-bit data word, with the EEPROM acknowledging at the 36th cycle. This data sending and EEPROM acknowledging cycle repeats until the micro-controller sends a STOP bit after the n × 9th clock cycle. After which the EEPROM device will go into a self -timed partial or full-page programming mode. After the page programming completes after a time of TWC, the devices will return to the STANDBY mode. The least significant 4 bits of the word address (column address) increments internally by one after receiving each data word. The rest of the word address bits (row address) do not change internally, but pointing to a specific memory row or page to be programmed. The first page write data word can be of any column address. Up to 16 data words can be loaded into a page. If more th an 16 data words are loaded, the 17th data word will be loaded to the 1st data word column address. The 18th data word will be loaded to the 2 nd data word column address and so on. In other word, data word address (column address) will “roll” over the previously loaded data. C. ACKNOWLEDGE POLLING ACKNOWLEDGE polling may be used to poll the programming status during a self -timed internal programming. By issuing a valid read or write address command, the EEPROM will not acknowledge at the 9 th clock cycle if the device is still in the self-timed programming mode. However, if the programming completes and the chip has returned to the STANDBY mode, the device will return a valid ACKNOWLEDGE signal at the 9th clock cycle.

VER 1. 1 7 Read Operations The read command is similar to the write command except the 8th read/write bit in address word is set to “1”. The three read operation modes are described as follows: A. CURRENT ADDRESS READ The EEPROM internal address word counter maintains the last read or write address plus one if the power supply to the de vice has not been cut off. T o initiate a current address read operation, the microcontroller issues a START bit and a valid device address word with the read/write bit (8th) set to “1”. The EEPROM will response with an ACKNOWLEDGE signal on the 9th serial clock cycle. An 8-bit data word will then be serially clocked out. The internal address word counter will then automatically increase by one. For current address read the micro -controller will not issue an ACKNOWLEDGE signal on the 18th clock cycle. The micro-controller issues a valid STOP bit after the 18th clock cycle to terminate the read operation. The device then returns to STANDBY mode. B. SEQUENTIAL READ The sequential read is very similar to current address read. The micro-controller issues a START bit and a valid device address word with read/write bit (8th) set to “1”. The EEPROM will response with an ACKNOWLEDGE signal on the 9 th serial clock cycle. An 8 -bit data word will then be serially clocked out. Meanwhile the internally address word counter will then automatically increase by one. Unlike current address read, the micro-controller sends an ACKNOWLEDGE signal on the 18th clock cycle signaling the EEPROM device that it wants another byte of data. Upon receiving the ACKNOWLEDGE signal, the EEPROM w ill serially clocked out an 8 -bit data word based on the incremented internal address counter. If the micro -controller needs another data, it sends out an ACKNOWLEDGE signal on the 27th clock cycle. Another 8-bit data word will then be serially clocked out. This sequential read continues as long as the micr o-controller sends an ACKNOWLEDGE signal after receiving a new data word. When the internal address counter reaches its maximum valid address, it rolls over to the beginning of the memory array address. Similar to current address read, the micro-controller can terminate the sequential read by not acknowledging the last data word received, but sending a STOP bit afterwards instead. C. RANDOM READ Random read is a two-steps process. The first step is to initialize the internal address counter with a target read address using a “dummy write” instruction. The second step is a current address read. To initialize the internal address counter with a target read address, the micro -controller issues a START bit first, follows by a valid device address with the read/write bit (8th) set to “0”. The EEPROM will then acknowledge. The micro-controller will then send the address word. Again the EEPROM will acknowledge. Instead of sending a valid written data to the EEPROM, the micro-controller performs a current address read instruction to read the data. Note that once a START bit is issued, the EEPROM will reset the internal programming process and continue to execute the new instruction - which is to read the current address.

VER 1. 1 10 Electrical Specifications A. Power-Up Requirements During a power-up sequence, the VCC supplied to the device should monotonically rise from GND to the minimum VCC level, with a slew rate no faster than 0.05 V/μs and no slower th an 0.1 V/ms. A decoupling cap should be connected to the VCC PAD which is no smaller than 10nF . B. Device Reset To prevent inadvertent write operations or any other spurious events from occurring during a power-up sequence, this device includes a Power -on Reset (POR) circuit. Upon power -up, the device will not respond to any commands until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of Reset and into Standby mode. The system designer must ensure the instructions are not sent to the device until the VCC supply has reached a stable value greater than or equal to the minimum VCC level. Figure 9: Power on and Power down If an event occurs in the system where the VCC level supplied to the device drops below the maximum VPOR level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to GND, waiting at least the minimum tPOFF time and then performing a new power-up sequence in compliance with the requirements defined in this section.

VER 1. 1 11 AC Characteristics Symbol Parameter 1.8V 2.5V-5.0V Units Min Max Min Max fSCL Clock Frequency, SCL 400 1000 kHz TLOW Clock Pulse Width Low 1.3 0.4 µs THIGH Clock Pulse Width High 0.6 0.4 µs TI Noise suppression time(1) 50 50 ns TAA Clock Low to Data Out Valid 0.2 0.9 0.2 0.55 µs TBUF Time the bus must be free before a new transmission can start 1.3 0.5 µs THD.STA Start Hold Time 0.6 0.25 µs TSU.STA Start Set-up Time 0.6 0.25 µs THD.DAT Data In Hold Time 0 0 µs TSU.DAT Data In Set-up Time 100 100 ns TR Inputs Rise Time 0.3 0.3 µs TF Inputs Fall Time 300 100 ns TSU.STO Stop Setup Time 0.6 0.25 µs TDH Data Out Hold Time 50 50 ns tPWR,R (1) Vcc slew rate at power up 0.1 50 0.1 50 V/ms tPUP (1) Time required after VCC is stable before the device can accept commands 100 100 µs tPOFF (1) Minimum time at Vcc=0V between power cycles 500 500 ms TWR Write Cycle Time 5 5 ms Endurance(1) 25℃, Page Mode,3.3V 1,000,000 Write Cycles Notes： 1. This Parameter is expected by characterization but is not fully screened by test. 2. AC Measurement conditions: RL (Connects to Vcc): 1.3KΩ Input Pulse Voltages: 0.3Vcc to 0.7Vcc Input and output timing reference Voltages: 0.5Vcc

VER 1. 1 12 DC Characteristics Symbol Parameter Test Condition Min Typ Max Unit s VCC1 Power supply VCC 1.8 5.5 V ICC Supply Current VCC @5.0V, Read = 400kHZ 0.5 1.0 mA ICC Supply Current VCC@ 5.0V, Write = 400kHZ 2.0 3.0 mA ISB1 Standby Current VCC @1.8V, VIN = VCC or VSS 1.0 µA ISB2 Standby Current VCC @2.5V, VIN = VCC or VSS 1.0 µA ISB3 Standby Current VCC @5.0V, VIN = VCC or VSS 1.0 µA ILI Input Leakage Current VIN = VCC or VSS 3.0 µA ILO Output Leakage Current VIN = VCC or VSS 3.0 µA VIL Input Low Level -0.6 VCC*0.3 V VIH Input High Level VCC*0.7 VCC+0.5 V VOL1 Output Low Level VCC @1.8V, IOL =0.15 mA 0.2 V VOL2 Output Low Level VCC @3.0V, IOL = 2.1 mA 0.4 V

VER 1. 1 13 Packaging information DIP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 3.710 4.310 0.146 0.170 A1 0.510 0.020 A2 3.200 3.600 0.126 0.142 B 0.380 0.570 0.015 0.022 B1 1.524（BSC） 0.060（BSC） C 0.204 0.360 0.008 0.014 D 9.000 9.400 0.354 0.370 E 6.200 6.600 0.244 0.260 E1 7.320 7.920 0.288 0.312 e 2.540 (BSC) 0.100（BSC） L 3.000 3.600 0.118 0.142 E2 8.400 9.000 0.331 0.354

VER 1. 1 14 Packaging information SOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.270 (BSC) 0.050 (BSC) L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8°

VER 1. 1 15 Packaging information TSSOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max D 2.900 3.100 0.114 0.122 E 4.300 4.500 0.169 0.177 b 0.190 0.300 0.007 0.012 c 0.090 0.200 0.004 0.008 E1 6.250 6.550 0.246 0.258 A 1.100 0.043 A2 0.800 1.000 0.031 0.039 A1 0.020 0.150 0.001 0.006 e 0.65 (BSC) 0.026 (BSC) L 0.500 0.700 0.020 0.028 H 0.25 (TYP) 0.01 (TYP) θ 1° 7° 1° 7°

VER 1. 1 16 Packaging information MSOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.820 1.100 0.320 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.250 0.380 0.010 0.015 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 e 0.65 (BSC) 0.026 (BSC) E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6°

VER 1. 1 17 Packaging information USON3*2-8 Symbol Dimensions In Millimeters Min Nom Max A 0.70 0.75 0.80 A1 0.02 0.05 b 0.18 0.25 0.03 c 0.18 0.20 0.25 D 1.90 2.00 2.10 D2 1.50REF e 0.50BSC Nd 1.50BSC E 2.90 3.00 3.10 E2 1.60REF L 0.30 0.40 0.50 h 0.20 0.25 0.30

VER 1. 1 18 Packaging information SOT23-5 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 0° 8° 0° 6°

VER 1. 1 19 Packaging information TSOT23-5 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.700 0.900 0.028 0.035 A1 0.000 0.100 0.000 0.004 A2 0.700 0.800 0.028 0.031 b 0.350 0.500 0.014 0.020 c 0.080 0.200 0.003 0.008 D 2.820 3.020 0.111 0.119 E 1.600 1.700 0.063 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.90 (BSC) 0.075 (BSC) L 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8°

VER 1. 1 20 Notes ACE does not assume any responsibility for use as critical components in life support devices or systems without the express written approval of the president and general counsel of ACE Technology Co., LTD. As sued herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and shoes failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ACE Technology Co., LTD. http://www.ace-ele.com/