ACE24AC02A3 ACE | Alldatasheet
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Technical content
Features
Low voltage and low power operations: ACE24AC02A3: VCC = 1.8V to 5.5V, Industrial temperature range (-40℃ to 85℃). ACE24AC02A3: With 3 bits device address, the devices are suitable for all application. (For use of 5 pins package, the device address A2, A1, and A0 bits must be set to zero) Maximum Standby current < 1µA 16 bytes page write mode. Partial page write operation allowed. Internally organized: 256 × 8 (2K). Standard 2-wire bi-directional serial interface. Schmitt trigger, filtered inputs for noise protection. Self-timed programming cycle (5ms maximum). 1 MHz (5V), 400 kHz (1.8V, 2.5V, 2.7V) Compatibility. Automatic erase before write operation. Write protect pin for hardware data protection. High reliability: typically 1,000,000 cycle’s endurance. 100 years data retention. Standard 8-pin DIP/SOP/MSOP/TSSOP/TDFN and SOT-23-5 Pb-free packages. Absolute Maximum Ratings Industrial operating temperature -40℃ to 85℃ Storage temperature -50℃ to 125℃ Input voltage on any pin relative to ground -0.3V to VCC + 0.3V Maximum voltage 8V ESD protection on all pins >2000V *Notice: Stresses exceed those listed under “Absolute Maximum Rating” may cause permanent damage to the device. Functional operation of the device at conditions beyond those listed in the specification is not guaranteed. Prolonged exposure to extreme conditions may affect device reliability or functionality.
VER 1. 3 2 Packaging Type SOP-8 TSSOP-8 MSOP-8 DIP -8 TDFN-8 SOT-23-5 Pin Configurations
Ordering Information
A2,A1,A0 Device Address Inputs SDA Serial Data Input / Open Drain Output SCL Serial Clock Input WP Write Protect VCC Power Supply GND Ground NC No-Connect Pb - free U：Tube T：Tape and Reel FM：SOP-8 TM：TSSOP-8 OM：MSOP-8 DP：DIP-8 DM：TDFN-8 BN：SOT-23-5 Halogen - free
VER 1. 3 3 Block Diagram Pin Description A. Serial Clock (SCL) The rising edge of this SCL input is to latch data into the EEPROM d evice while the falling edge of this clock is to clock data out of the EEPROM device. B. Serial Data Line (SDA) SDA data line is a bi-directional signal for the serial devices. It is an open drain output signal and can be wired-OR with other open-drain output devices. C. Write Protect(WP) The ACE24AC02A3 devices have a WP pin to protect the whole EEPROM array from programming. Programming operations are allowed if WP pin is left un -connected or input to V IL. Conversely all programming functions are disabled if WP pin is connected to VIH or VCC. Read operations is not affected by the WP pin’s input level. Memory Organization The ACE24AC02A3 devices have 16 pages. Since each page has 16 bytes, random word addressing to ACE24AC02A3 will require 8 bits data word addresses.
VER 1. 3 5 Device Addressing The 2-wire serial bus protocol mandates an 8 bits device address word after a start bit condition to invoke valid read or write command. The first four most significant bits of th e device address must be 1010, which is common to all serial EEPROM devices. The next three bits are device address bits. These three device address bits (5th, 6th and 7th) are not cared and could be coded from 000 (b) to 111 (b). Only one ACE24AC02A3 device can be used on the on 2 -wire bus. If a match is made, the EEPROM device outputs an acknowledge signal after the 8th read/write bit, otherwise the chip will go into standby mode. The last or 8th bit is a read/write command bit. If the 8th bit is at VIH then the chip goes into read mode. If a “0” is detected, the device enters programming mode. Write Operations A. Byte Write A byte write operation starts when a micro-controller sends a start bit condition, follows by a proper EEPROM device address and then a write command. If the device address bits match the chip select address, the EEPROM device will acknowledge at the 9th clock cycle. The micro-controller will then send the rest of the lower 8 bits word address. At the 18th cycle, the EEPROM will acknowledge the 8-bit address word. The micro -controller will then transmit the 8 bit data. Following an acknowledge signal from the EEPROM at the 27th clock cycle, the micro-controller will issue a stop bit. After receiving the stop bit, the EEPROM will go into a self-timed programming mode during which all external inputs will be disabled. After a programming time of TWC, the byte programming will finish and the EEPROM device will return to the standby mode. B. Page Write A page write is similar to a byte write with the exception that one to sixteen bytes can be programmed along the same page or memory row. All ACE24AC02A3 are organized to have 16 bytes per memory row or page. With the same write command as the byte write, the micro-controller does not issue a stop bit after sending the 1st byte data and receiving the acknowledge signal from the EEPROM on the 27th clock cycle. Instead it sends out a second 8 -bit data word, with the EEPROM acknowledging at the 36 th cycle. This data sending and EEPROM acknowledging cycle repeats until the micro-controller sends a stop bit after the n × 9th clock cycle. After which the EEPROM device will go into a self- timed partial or full page programming mode. After the page programming completes after a time of T WC, the devices will return to the standby mode. The least significant 4 bits of the word address (column address) increments internally by one after receiving each data word. The rest of the word address bits (row address) do not change internally, but pointing to a specific memory row or page to be programmed. The first page write data word can be of any column address. Up to 16 data words can be loaded into a page. If more then 16 data
VER 1. 3 6 words are loaded, the 17 th data word will be loaded to the 1 st data word column address. The 18 th data word will be loaded to the 2 nd data word column address and so on. In other word, data word address (column address) will “roll” over the previously loaded data. C. Acknowledge Polling Acknowledge polling may be used to poll the programming sta tus during a self -timed internal programming. By issuing a valid read or write address command, the EEPROM will not acknowledge at the 9 th clock cycle if the device is still in the self -timed programming mode. However, if the programming completes and the chip has returned to the standby mode, the device will return a valid acknowledge signal at the 9th clock cycle. Read Operations The read command is similar to the write command except the 8th read/write bit in address word is set to “1”. The three read operation modes are described as follows: (A) Current Address Read The EEPROM internal address word counter maintains the last read or write address plus one if the power supply to the device has not been cut off. T o initiate a current address read operation, t he micro-controller issues a start bit and a valid device address word with the read/write bit (8 th) set to“1”. The EEPROM will response with an acknowledge signal on the 9 th serial clock cycle. An 8-bit data word will then be serially clocked out. The in ternal address word counter will then automatically increase by one. For current address read the micro -controller will not issue an acknowledge signal on the 18th clock cycle. The micro -controller issues a valid stop bit after the 18th clock cycle to terminate the read operation. The device then returns to standby mode. (B) Sequential Read The sequential read is very similar to current address read. The micro -controller issues a start bit and a valid device address word with read/write bit (8th) set to “1”. The EEPROM will response with an acknowledge signal on the 9th serial clock cycle. An 8-bit data word will then be serially clocked out. Meanwhile the internally address word counter will then automatically increase by one. Unlike current address read, the micro-controller sends an acknowledge signal on the 18 th clock cycle signaling the EEPROM device that it wants another byte of data. Upon receiving the acknowledge signal, the EEPROM will serially clocked out an 8 -bit data word based on the incremented internal address counter. If the micro-controller needs another data, it sends out an acknowledge signal on the 27th clock cycle. Another 8-bit data word will then be serially clocked out. This sequential read continues as long as the micro -controller sends an acknowledge signal after receiving a new data word. When the internal address counter reaches its maximum valid address, it rolls over to the beginning of the memory array address. Similar to current ad dress read, the micro -controller can terminate the sequential read by not acknowledging the last data word received, but sending a stop bit afterwards instead.
VER 1. 3 9 AC Characteristics Symbol Parameter 1.8V-2.7V 5.0V Units Min Max Min Max fSCL Clock Frequency, SCL 400 1000 kHz TLOW Clock Pulse Width Low 1.3 0.4 µs THIGH Clock Pulse Width High 0.6 0.4 µs TI Noise suppression time(1) 180 120 ns TAA Clock Low to Data Out Valid 0.3 0.9 0.2 0.55 µs TBUF Time the bus must be free before a new transmission can Start 1.3 0.5 µs THD.STA Start Hold Time 0.6 0.25 µs TSU.STA Start Set-up Time 0.6 0.25 µs THD.DAT Data In Hold Time 0 0 µs TSU.DAT Data In Set-up Time 100 100 ns TR Inputs Rise Time 0.3 0.3 µs TF Inputs Fall Time 300 100 ns TSU.STO Stop Setup Time 0.6 0.25 µs TDH Data Out Hold Time 50 50 ns TWR Write Cycle Time 5 5 ms Endurance(1) 25℃, Page Mode,3.3V 1,000,000 Write Cycles Notes*：1.This Parameter is expected by characterization but is not fully screened by test. 2.AC Measurement conditions: RL (Connects to Vcc): 1.3KΩ Input Pulse Voltages: 0.3Vcc to 0.7Vcc Input and output timing reference Voltages: 0.5Vcc
VER 1. 3 10 DC Characteristics Symbol Parameter Test Condition Min Typ Max Unit s VCC1 Power supply VCC 1.8 5.5 V ICC Supply Current VCC @5.0V, Read = 400kHZ 0.5 1.0 mA ICC Supply Current VCC@ 5.0V, Write = 400kHZ 2.0 3.0 mA ISB1 Standby Current VCC @1.8V, VIN = VCC or VSS 1.0 µA ISB2 Standby Current VCC @2.5V, VIN = VCC or VSS 1.0 µA ISB3 Standby Current VCC @5.0V, VIN = VCC or VSS 0.07 1.0 ILI Input Leakage Current VIN = VCC or VSS 3.0 µA ILO Output Leakage Current VIN = VCC or VSS 3.0 µA VIL Input Low Level -0.6 VCC*0.3 V VIH Input High Level VCC*0.7 VCC+0.5 V VOL1 Output Low Level VCC @1.8V, IOL =0.15 mA 0.2 V VOL2 Output Low Level VCC @3.0V, IOL = 2.1 mA 0.4 V
VER 1. 3 11 Packaging information DIP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 3.710 4.310 0.146 0.170 A1 0.510 0.020 A2 3.200 3.600 0.126 0.142 B 0.380 0.570 0.015 0.022 B1 1.524（BSC） 0.060（BSC） C 0.204 0.360 0.008 0.014 D 9.000 9.400 0.354 0.370 E 6.200 6.600 0.244 0.260 E1 7.320 7.920 0.288 0.312 e 2.540 (BSC) 0.100（BSC） L 3.000 3.600 0.118 0.142 E2 8.400 9.000 0.331 0.354
VER 1. 3 12 Packaging information TSSOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max D 2.900 3.100 0.114 0.122 E 4.300 4.500 0.169 0.177 b 0.190 0.300 0.007 0.012 c 0.090 0.200 0.004 0.008 E1 6.250 6.550 0.246 0.258 A 1.100 0.043 A2 0.800 1.000 0.031 0.039 A1 0.020 0.150 0.001 0.006 e 0.65 (BSC) 0.026 (BSC) L 0.500 0.700 0.020 0.028 H 0.25 (TYP) 0.01 (TYP) θ 1° 7° 1° 7°
VER 1. 3 13 Packaging information SOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.350 1.750 0.053 0.069 A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.006 0.010 D 4.700 5.100 0.185 0.200 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 e 1.270 (BSC) 0.050 (BSC) L 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8°
VER 1. 3 14 Packaging information MSOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.820 1.100 0.320 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.250 0.380 0.010 0.015 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 e 0.65 (BSC) 0.026 (BSC) E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6°
VER 1. 3 15 Packaging information TDFN-8 Symbol Dimensions In Millimeters Min Nom Max A 0.70 0.75 0.80 A1 - 0.02 0.05 b 0.18 0.25 0.30 c 0.18 0.20 0.25 D 1.90 2.00 2.10 D2 1.50REF e 0.50BSC Nd 1.50BSC E 2.90 3.00 3.10 E2 1.60REF L 0.30 0.40 0.50 h 0.20 0.25 0.30 L/F Surface Electroplate NIPdAu (Nickel, Pd, Metal) Dimension（mil） 67*75
VER 1. 3 16 Packaging information SOT23-5 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.95 (BSC) 0.037 (BSC) e1 1.800 2.000 0.071 0.079 L 0.300 0.600 0.012 0.024 0° 8° 0° 6°
VER 1. 3 17 Notes ACE does not assume any responsibility for use as critical components in life support devices or systems without the express written approval of the president and general counsel of ACE Electronics Co., LTD. As sued herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain li fe, and shoes failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ACE T echnology Co., LTD. http://www.ace-ele.com/