AAAF3529VBDSEJ3ZGS TO-GRACE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

© 20 18 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.5B Date: 04/28/2018 Page 1 / 5 PACKAGE DI MENSIONS SELECTION GUIDE Notes: θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. AAAF3529VBDSEJ3ZGS 3.5 x 2.8 mm Surface Mount SMD Chip LED RECOMMENDED SOLDERING PATTERN (units : mm ; tolerance : ± 0.1) Notes: All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. DESCRIP TIONS z T he Blue source color devices are made with InGaN Light Emitting Diode z T he Hyper Red device is based on light emitting diode chip made from AlGaInP z T he Green source color devices are made with InGaN on Sapphire Light Emitting Diode z Electrostatic discharge and power surge could Damage the LEDs z It is recommend ed to use a wrist band or anti- electrostatic glove when handling the LEDs z All d evices, equipments and machineries must be electrically grounded

FEATURES

z Outstanding material efficie ncy z Lo w power consumption z Ca n produce any color in visible spectrum, including white light z Suita ble for all SMD assembly and solder process z Avai lable on tape and reel z Packa ge: 2000pcs / reel z Moistur e sensitivity level: 3 z Ro HS compliant APPLIC ATIONS z Backlight z Status in dicator z Hom e and smart appliances z W earable and portable devices z He althcare applications ATTE NTION Ob serve precautions for handling electrostatic discharge sensitive devices Part Number Emitti ng Color (Material) Lens T ype I v (mcd) @ 20mA [ 2] Vie wing Angle [1 Min. Ty p. 2θ1/2 AAAF3529VBDS EJ3ZGS ■ B lue (InGaN) Water Clear 200 300 ■ Hy per Red (AlGaInP) 400 560 ■ Green (I nGaN) 400 580 130° Bl ue Red Gree n 香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦，贴片LED灯等 进口原装，现货供应，价格优势，技术支持 电话：0755-83464948 传真：0755-83464076 A ll data sheet.com

© 2018 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.5B Date: 04/28/2018 Page 2 / 5 ABSOLUTE MAXIMUM RATINGS at TA=25°C ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C AAAF3529VBDSEJ3ZGS Parameter Symbol Emitting Color Value Unit Typ. Max. Wavelength at Peak Emission IF = 20mA λpeak Blue Hyper Red Green 465 640 515 - nm Dominant Wavelength IF = 20mA λdom [1] Blue Hyper Red Green 470 625 525 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Δλ Blue Hyper Red Green - nm Capacitance C Blue Hyper Red Green 100 - pF Forward Voltage IF = 20mA VF [2] Blue Hyper Red Green 3.3 2.2 3.3 4.0 2.8 4.1 V Reverse Current (VR = 5V) IR Blue Hyper Red Green uA Temperature Coefficient of λpeak IF = 20mA, -10°C ≤ T ≤ 85°C TCλpeak Blue Hyper Red Green 0.04 0.13 0.05 - nm/°C Temperature Coefficient of λdom IF = 20mA, -10°C ≤ T ≤ 85°C TCλdom Blue Hyper Red Green 0.03 0.06 0.03 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 85°C TCV Blue Hyper Red Green -2.9 -2.0 -2.9 - mV/°C Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Parameter Symbol Value Unit Blue Hyper Red Green Power Dissipation PD mW Reverse Voltage VR 5 5 5 V Junction Temperature Tj 115 115 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 30 50 30 mA Peak Forward Current IFM [1] 100 150 150 mA Electrostatic Discharge Threshold (HBM) - 250 3000 450 V Thermal Resistance (Junction / Ambient) Rth JA [2] 220 210 280 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 125 115 170 °C/W 120 140 123 Notes: 1. 1/10 Duty Cycle , 0.1ms Pulse Width . 2. Rth JA, Rth JS Results from mounting on PC board FR4 (pad size ≥16 mm 2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. A ll data sheet.com

© 2018 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.5B Date: 04/28/2018 Page 3 / 5 AAAF3529VBDSEJ3ZGS TECHNICAL DATA 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 T a = 25 °C Red Wavelength (nm) Relative Intensity (a. u.) Blue Green RELATIVE INTENSITY vs. WAVELENGTH 0.5 0.50.0 -90° -75° -60° -45° -30° -15° 75° 60° 45° 30° 0° 15° 90° 1.0 1.0 Ta = 25 °C SPATIAL DISTRIBUTION GREEN Ta = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 1 02 03 04 05 0 T a = 25 °C Forward current (mA) Luminous intensity normalised at 20 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature HYPER RED T a = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 1 02 03 04 05 0 T a = 25 °C Forward current (mA) Luminous intensity normalised at 20 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature BLUE T a = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 1 02 03 04 05 0 T a = 25 °C Forward current (mA) Luminous intensity normalised at 20 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature A ll data sheet.com

© 2018 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.5B Date: 04/28/2018 Page 4 / 5 AAAF3529VBDSEJ3ZGS TECHNICAL DATA TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. PACKING & LABEL SPECIFICATIONS A ll data sheet.com

© 2018 Kingbright. All Rights Reserved. Spec No: DSAM7148 / 1201008462 Rev No: V.5B Date: 04/28/2018 Page 5 / 5 AAAF3529VBDSEJ3ZGS HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H 2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes A ll data sheet.com