AA3527ASESK-J3-50MAV TO-GRACE | Alldatasheet

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© 20 17 Kingbright. All Rights Reserved. Spec No: DSAN6311 / 1201008526 Rev No: V.2A Date: 06/20/2017 Page 1 / 4 DESCRIP TIONS z T he Hyper Red device is based on light emitting diode chip made from AlGaInP z Electrostatic discharge and power surge could damage the LEDs z It is recommend ed to use a wrist band or anti-electrostatic glove when handling the LEDs z All d evices, equipments and machineries must be electrically grounded

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ble for all SMD assembly and solder process z Avai lable on tape and reel z Idea l for backlighting z Packa ge: 2000 pcs / reel z Moistur e sensitivity level: 3 z Ro HS compliant APPLIC ATIONS z Backlight z Status in dicator z Hom e and smart appliances z W earable and portable devices z He althcare applications ATTE NTION Ob serve precautions for handling electrostatic discharge sensitive devices PACKAGE DI MENSIONS SELECTION GUIDE Notes: θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. * Luminous intensity value is traceable to CIE127-2007 standards. AA3527ASESK/J3-50MAV 3.5 x 2.7 mm Surface Mount LED Lamp RECOMMENDED SOLDERING PATTERN (units : mm ; tolerance : ± 0.1) Part Number Emitti ng Color (Material) Lens T ype I v (mcd) @ 50mA [ 2] Vie wing Angle [1 Min. Ty p. 2θ1/2 AA3527ASESK/J3-50MAV ■ H yper Red (AlGaInP) Water Clear 3600 4200 *1000 *1500 120° Notes: All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. 香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦，贴片LED灯等 进口原装，现货供应，价格优势，技术支持 电话：0755-83464948 传真：0755-83464076 A ll data sheet.com

© 2017 Kingbright. All Rights Reserved. Spec No: DSAN6311 / 1201008526 Rev No: V.2A Date: 06/20/2017 Page 2 / 4 ABSOLUTE MAXIMUM RATINGS at TA=25°C ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C AA3527ASESK/J3-50MAV Parameter Symbol Emitting Color Value Unit Typ. Max. Wavelength at Peak Emission IF = 50mA λpeak Hyper Red 640 - nm Dominant Wavelength IF = 50mA λdom [1] Hyper Red 625 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 50mA Δλ Hyper Red 20 - nm Capacitance C Hyper Red 27 - pF Forward Voltage IF = 50mA VF [2] Hyper Red 2.5 3.2 V Reverse Current (VR = 5V) IR Hyper Red - 10 uA Temperature Coefficient of λpeak IF = 50mA, -10°C ≤ T ≤ 85°C TCλpeak Hyper Red 0.13 - nm/°C Temperature Coefficient of λdom IF = 50mA, -10°C ≤ T ≤ 85°C TCλdom Hyper Red 0.06 - nm/°C Temperature Coefficient of VF IF = 50mA, -10°C ≤ T ≤ 85°C TCV Hyper Red -2.0 - mV/°C Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. R th JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. Parameter Symbol Unit Power Dissipation PD 160 mW Reverse Voltage VR 5 V Junction Temperature Tj 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF 50 mA Peak Forward Current IFM [1] 150 mA Thermal Resistance (Junction / Ambient) Rth JA [2] 220 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 140 °C/W Value Electrostatic Discharge Threshold (HBM) - 3000 V A ll data sheet.com

© 2017 Kingbright. All Rights Reserved. Spec No: DSAN6311 / 1201008526 Rev No: V.2A Date: 06/20/2017 Page 3 / 4 0.5 0.50.0 -90° -75° -60° -45° -30° -15° 75° 60° 45° 30° 0° 15° 90° 1.0 1.0 Ta = 25 °C TECHNICAL DATA 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 T a = 25 °C Red Wavelength (nm) Relative Intensity (a. u.) RELATIVE INTENSITY vs. WAVELENGTH HYPER RED TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS SPATIAL DISTRIBUTION AA3527ASESK/J3-50MAV Ta = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.2 0.4 0.6 0.8 1.0 0 1 02 03 04 05 0 T a = 25 °C Forward current (mA) Luminous intensity normalised at 50 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. A ll data sheet.com

© 2017 Kingbright. All Rights Reserved. Spec No: DSAN6311 / 1201008526 Rev No: V.2A Date: 06/20/2017 Page 4 / 4 PACKING & LABEL SPECIFICATIONS PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes AA3527ASESK/J3-50MAV HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H 2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. A ll data sheet.com