AA3021P3S TO-GRACE | Alldatasheet
Document overview
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Technical content
Features
z Mechanically and spectrally matched to the infrared emitting LED lamp. z Package : 2000pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant.
Description
Made with NPN silicon phototransistor chips. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. 香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦,贴片LED灯等 进口原装,现货供应,价格优势,技术支持 电话:0755-83464948 传真:0755-83464076
SPEC NO: DSAM1638 REV NO: V.4 DATE: SEP/29/2016 PAGE: 2 OF 5 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1201007031 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAM1638 REV NO: V.4 DATE: SEP/29/2016 PAGE: 3 OF 5 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1201007031 Electrical / Optical Characteristics at TA=25°C Absolute Maximum Ratings at TA=25°C Symbol Parameter Min. Typ. Max. Units Test Conditions VBR CEO Collector-to-Emitter Breakdown Voltage 30 V IC=100uA Ee=0mW/cm2 VBR ECO Emitter-to-Collector Breakdown Voltage 5 V IE=100uA Ee=0mW/cm2 VCE (SAT) Collector-to-Emitter Saturation Voltage 0.8 V IC=2mA Ee=20mW/cm2 I CEO Collector Dark Current 100 nA VCE=10V Ee=0mW/cm2 TR Rise Time (10% to 90% ) 15 us VCE = 5V IC=1mA RL=1000Ω TF Fall Time (90% to 10% ) 15 us I (ON) On State Collector Current 0.2 0.35 mA VCE = 5V Ee=1mW/cm2 λ=940nm λ0.1 Range of spectral bandwidth 420 1120 nm λp Wavelength of peak sensitivity 940 nm 2θ1/2 Angle of half sensitivity 120 deg Parameter Max.Ratings Collector-to-Emitter Voltage 30V Emitter-to-Collector Voltage 5V Power Dissipation at (or below) 25°C Free Air Temperature 100mW Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
SPEC NO: DSAM1638 REV NO: V.4 DATE: SEP/29/2016 PAGE: 4 OF 5 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1201007031 AA3021P3S Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Tape Specifications (Units : mm)
SPEC NO: DSAM1638 REV NO: V.4 DATE: SEP/29/2016 PAGE: 5 OF 5 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1201007031 PACKING & LABEL SPECIFICATIONS AA3021P3S Terms and conditions for the usage of this document 1. The information included in this docum ent reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the dat asheet. If customer usage exceeds the spec ified limits, Kingbright will not be respon sible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applicati ons. If customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes