913PG2C

913PG2C HB | Alldatasheet

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Page: 1 FLUX LED SPECIFICATION Fatures： z Single color z High bright output z High Current Operation z Low power consumption z High reliability and long life Descriptions： z Dice material：InGaN z Emitting Color：Pure Green z Device Outline：7.6mmX7.6mm z Lens Type：Water Clear 913PG2C NOTE: z All dimensions are millimetres. z Tolerance is +/-0.25mm unless otherwise note CATHODE Radiation Angle Relative Luminous Intensity 90° 30°60° Ta=25° C IF=20mA 0.5 1.0 0.5 90° 1.0 30° 60° DIRECTIVITY

Page: 2 Absolute maximum ratings（Ta = 25℃） Value Parameter Symbol Test Condition Min. Max. Unit Reverse Voltage V R I R = 30μA 5 -- V Forward Current I F ---- ---- 30 mA Power Dissipation Pd ---- ---- 75 mW Pulse Current Ipeak Duty=0.1mS ，1kHz ---- 100 mA Operating Temperature Topr ---- -40 +85 ℃ Storage Temperature Tstr ---- -40 +100 ℃ Electrical and optical characteristics （Ta = 25℃） Value Parameter Symbol Test Condition Min. Typ. Max. Unit Forward Voltage V F I F = 50mA V9~V11 Reverse Current I R V R = 5V ---- ---- 30 μA Dominate Wavelength λd I F = 50mA G11~G13 Spectral Line half-width Δλ I F = 50mA 20 nm Luminous Flux IV I F = 50mA H,J Viewing Angle 2 θ1/2 I F = 50mA 110 130 Deg.

Bin Code LM Bin Code LM Bin Code LM Bin Code LM Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm) B1 450-455 YG1 555-558 B2 455-460 YG2 558-561 B3 460-465 YG3 561-564 B4 465-470 YG4 564-567 B5 470-475 YG5 567-570 B6 475-480 YG6 570-573 G1 491-494 YG7 573-576 G2 494-497 Y1 582-585 G3 497-500 Y2 585-588 G4 500-503 Y3 588-591 G5 503-506 Y4 591-594 G6 506-509 Y5 594-597 G7 509-512 YO1 597-600 G8 512-515 YO2 600-603 G9 515-518 YO3 603-606 G10 518-521 YO4 606-609 G11 521-524 O1 609-612 G12 524-527 O2 612-615 G13 527-530 O3 615-618 G14 530-533 R1 618-621 G15 533-536 R2 621-624 G16 536-539 R3 624-627 G17 539-542 R4 627-630 G18 542-545 R5 630-633 G19 545-548 R6 633-636 Bin Code VF (V) Bin Code VF (V) Bin Code VF (V) Bin Code VF (V) FORWARD VOLTAGE (VF) BIN RED BLUE WAVELENGTH BIN PURE GREEN FLUX BIN FOR PIRANHA (UFO) LEDS YELLOW YELLOW ORANGE PURE ORANGE YELLOW GREEN BLUE GREEN Page: 3

Page: 4 FLUX LED SPECIFICATION Typical electrical/optical characteristic curves： 700600 650 100 550450 500 400 Relative Luminous Intensity Wavelength λ(nm) Radiant Luminous Intensity VS. Ambient Temperature Forward Current VS. Ambient Temperature Radiant Luminous Intensity VS. Forward Current Forward Current VS. Forward Voltage 2.4 Radiant Intensity Ambient Temperature TA ()℃ -30 -10 10 0.5 1.0 1.5 70 905030 2.0 2.5 Forward Current(mA) Radiant Luminous Intensity Relative Value at IF=70mA Forward Current(mA) Ambient Temperature TA ()℃ 400 02 0 8060 100 IF-Forward Current (mA)Forward Voltage(V) 02 0 100 2.43.60 4.0 0.5 1.0 1.5 60 80 100 100 2.0 2.5 3.22.8

METHOD SOLDERING CONDITIONS REMARK DIP SOLDERING Bath temperature: 260±5℃ Immersion time: with 5 sec y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. SOLDERING IRON Soldering iron: 30W or smaller Temperature at tip of iron: 260 or lowe r℃ Soldering time: within 5 sec. y During soldering, take care not to press the tip of iron against the lead. (To prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. Page : 5 Panel (Fig.1) Lead wries Leave a slight clearance Lead wries (Fig.2)

3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. yLED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) Page : 6 PC board ig.3）（F jig Fig.4 case pc board LED LAMP APPLICATION

2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2) Forming lead should be carried our prior to so ldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) Page : 7 Stand-off Fig.5 Fig.6 Tube2mm Fig.7 LED LAMP APPLICATION

1) Bend strength Do not bend the lead more than twice. (Fig.9) 2) Tensile strength (@ Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) yHANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. yCHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may at tack the LED surface and cause discoloration. 2) When washing is required, refer to the follo wing table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ Isopropyl Alcohol ⊙ Thinner ╳ Acetone ╳ Trichloroethylene ╳ ⊙--Usable ╳--Do not use. Page : 8 Fig.9 OK！ Fig.10 1Kg NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. LED LAMP APPLICATION

Experiment Item: Test Condition Item Lamp & IR Reference Standard OPERATION LIFE Ta： 25 ±5℃ IF= 20mA RH ：＜=60%RH ① DYNAMIC:100mA 1ms 1/10 duty ② STATIC STATE: IF＝20mA TEST TIME: 168HRS（-24HRS，+24HRS） 500HRS（-24HRS，+24HRS） 1000HRS（-24HRS，+72HRS） MIL-STD-750：1026 MIL-STD-883：1005 JIS C 7021 ：B-1 HIGH TEMPERATURE HIGH HUMIDITY STORAGE Ta： 65 ℃±5℃ RH： 90 〜95%RH TEST TIME ：240HRS±2HRS MIL-STD-202：103B JIS C 7021 ：B-1 TEMPERATURE CYCLING 30min 5min 30min 5min 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021 ：A-4 THERMAL SHOCK 1 0 m i n 1 0 m i n 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011 SOLDER RESISTANCE DWELL TIME ：10±lsec MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021 ：A-1 SOLDERABILITY DWELL TIME ：5±lsec MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021 ：A-2 Page : 9 LED LAMP PASSED TESTS Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED\`s could be found due to the Vf-If characteristics of LED.