900 LSTD | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 1

Technical content

global solutions: local support TM Innovative Technology for a Connected World Tpcm™ 900 Series Tpcm™ 900 is a high performance, non-electrically conductive phasechange material. At 50°C, Tpcm™ 900 begins to soften and flow,filling the microscopic irregularities of both the thermal solution andthe component’s surfaces, thereby reducing thermal resistance.It is a flexible solid at room temperature and freestandingwithout reinforcing components that reduce thermal performance. Tpcm 900 shows no performance degradation after 1,000hours @130°C, or after 500 cycles, from -25°C to 125°C. The material softens and does not fully change state, result - ing in minimal migration(pump out) at operating temperatures (see viscosity curve). Supplied in rolls with top tabbed liners for easy manual orlarge volume automatic application. Individually die cut parts can alsobe supplied. FEATURES AND BENEFITS

  • 0.03ºC-in2/watt thermal resistance
  • Naturally tacky at room temperature, no adhesive required
  • No heatsink preheating required
  • Available in 3 thicknesses, 0.005”, 0.010”and 0.020” (0.125 mm, 0.25 mm and 0.50 mm) Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal PROPERTIES Tpcm™ 905C Tpcm™ 910 Tpcm™ 920 Test Method Construction & Composition Non-reinforced boron nitride filled film Non-reinforced boron nitride filled film Non-reinforced boron nitride filled film Color Yellow Yellow Yellow Visual Density 1.31 g/cc 1.39 g/cc 1.39 g/cc Helium Pycnometer Temperature Range -25 to 125°C -25 to 125°C -25 to 125°C Phase Change Softening Temperature 50°C to 70°C 50°C to 70°C 50°C to 70°C “Burn In“ Temperature 70°C for 5 minutes 70°C for 5 minutes 70°C for 5 minutes Thermal Conductivity 0.7 W/mK 2.23 W/mK 2.23 W/mK ASTM D5470 (modified) Thermal Impedance @ 10 psi (69 KPa) @ 50 psi (345 KPa)) 0.048 °C-in2/W (0.31 °C-cm2/W) 0.029 °C-in2/W (0.19 °C-cm2/W) 0.14 °C-in2/W (0.90 °C-cm2/W) 0.083 °C-in2/W (0.53 °C-cm2/W) 0.18 °C-in2/W (1.14 °C-cm2/W) 0.095 °C-in2/W (0.61 °C-cm2/W) ASTM D5470 (modified Volume Resistivity 2 x 1013 ohm-cm 2 x 1013 ohm-cm 2 x 1013 ohm-cm ASTM D257 Dielectric Constant @1 MHz 3.1 3.1 3.1 ASTM D150 THR-DS-Tpcm-900 0910 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technolo- gies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

APPLICATIONS

  • High frequency microprocessors
  • Notebook and desktop PCs
  • Computer servers
  • DC/DC converts
  • Memory modules
  • Cache chips
  • IGBTs Consult the factory for alternate thicknesses Standard Sheet Sizes: 9” x 9” (229 mm x 229 mm) Tpcm™ 900 sheets are supplied with a white release paper and a bottom liner. Tpcm™ 900 is available in rolls with an extended tab liner or individual die cut shapes. Pressure Sensitive Adhesive: Pressure sensitive adhesive is not applicable for Tpcm™ products. Reinforcement: No reinforcement is necessary.