6251DS

TLE6251DS INFINEON | Alldatasheet

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Data Sheet, Rev. 3.1, Aug. 2007 TLE6251DS High Speed CAN-Transceiver with Bus wake-up Automotive Power

81726 Munich, Germany

© 2005 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

High Speed CAN-Transceiver with Bus wake-up TLE6251DS Data Sheet 3 Rev. 3.1, 2007-08-20

Features

• CAN data transmission rate up to 1 Mbaud
• Compatible to ISO/DIS 11898
• Supports 12 V and 24 V automotive applications
• Low power mode with remote wake-up via CAN bus
• Wake signaling by RxD change
• No BUS load in stand-by mode
• Wide common mode range fo r electromagnetic immunity (EMI)
• Digital inputs compatible to 3.3 and 5 V logic devices
• CAN short circuit proof to ground, battery and VCC
• Split termination to stabilize the recessive level
• TxD time- out function
• Overtemperature protection
• Protected against automotive transients
• Green Product (RoHS compliant)
• AEC Qualified

Description

The CAN-transceiver TLE6251DS is a monolithic integrated circuit in a PG-DSO-8 package for high speed differential mode data transmission (up to 1 Mbaud) and reception in automotive and industrial applications. It works as an interface between the CAN protocol controller and the physical bus lines compatible to ISO/DIS 11898. As a successor to the first generation of HS CAN (TLE6250), the TLE6251DS is designed to provide an excellent passive behavior when the transceiver is switched off (mixed networks, terminal 15/30 applications) and a remote wake-up capability via CAN bus in low power mode. This supports networks with partially un-powered nodes. The TLE6251DS has two operation modes, the normal and the stand-by mode. These modes can be chosen by the STB pin. If th e TLE6251DS is in stand-by m ode and a message on the bus is

Data Sheet 4 Rev. 3.1, 2007-08-20 TLE6251DS detected, the TLE6251DS changes the level at the RxD pin corresponding to the bus signal (wake-up flag). The TLE6251DS is also designed to withstand the severe conditions of automotive applications and to support 12 V and 24 V applications. The IC is based on the Smart Power Technology SPT® which allows bipolar and CMOS control circuitry in accordance with DMOS power devices existing on the same monolithic circuit. Pin Configuration and Definitions Figure 1 Pin Configuration (top view) Table 1 Pin Definitions and Functions Pin No. Symbol Function 1T x D CAN transmit data input; 20 kΩ pull-up, LOW in dominant state 2G N D Ground

3 VCC 5 V supply input; block to GND with 100 nF ceramic capacitor

4R x D CAN receive data output; LOW in dominant state 5S P L I T Split termination output; to support the recessive voltage level of the bus lines

6 CANL Low line input; LOW in dominant state

7 CANH High line output; HIGH in dominant state

8S T B Mode control input; internal pull-up, see Figure 3 AEP03389 .VSD 1TxD 2GND 3VCC 4RxD CANH CANL STB SPLIT TLE6251DS

Data Sheet 5 Rev. 3.1, 2007-08-20 Functional Block Diagram Figure 2 Functional Block Diagram TLE6251DS Mode Control Logic Output Stage AEB03388.VSD RxD4 Driver Temp.- Protection timeout TxD1 STBWake-Up Logic 7CANH 6CANL 3VCC MUX Receiver VCC 5SPLIT 2GND

Data Sheet 6 Rev. 3.1, 2007-08-20 TLE6251DS

Application Information

The TLE6251DS has two operation modes, the normal and the standby mode. These modes can be controlled with the STB pin (see Figure 3, Table 2). The STB pin has an implemented pull- up, so if there is no signal applied to STB or STB = HIGH, the standby mode is activated. To transfer the TLE6251DS into the normal mode, STB has to be switched to LOW. Figure 3 Mode State Diagram Normal Mode This mode is designed for the normal data transmission/reception within the HS-CAN network. Table 2 Truth Table Mode STB Event RxD BUS Termination Normal low bus dominant low VCC/2 bus recessive high Stand by high wake-up via CAN bus detected low/high 1) 1) Signal at RxD changes corresponding to the bus signal during stand by mode. See Figure 6 GND no wake-up detected high AEA03391.VSD STB = 0 Normal STB = 1 Stand-By

Data Sheet 7 Rev. 3.1, 2007-08-20 Transmission The signal from the µC is applied to the TxD input of the TLE6251DS. Now the bus driver switches the CANH/L output stages to transfer this input signal to the CAN bus lines. TxD Time-out Feature If the TxD signal is dominant for a time t > tTxD the TxD time-out function deactivates the transmission of the signal at th e bus. This is realized to pr event the bus from being blocked permanently dominant due to an error. The transmission is released again, after a rising edge at TxD has been detected. Reduced Electromagnetic Emission The bus driver has an implemented control to reduce the electromagnetic emission (EME). This is achieved by controlling the symmetry of the slope, resp. of CANH and CANL. Overtemperature The driver stages are protected against overtem perature. Exceeding the shutdown temperature results in deactivation of the driving stages at CANH/L. To avoid a bit failure after cooling down, the signals can be transmitted again only after a dominant to recessive edge at TxD. Figure 4 shows the way how the transmission stage is deactivated and activated again. First an over temperature condition causes the transmis sion stage to deacti vate. After the over temperature condition is no longer present, the transmission is only possible after the TxD signal has changed to recessive level.

Data Sheet 9 Rev. 3.1, 2007-08-20 TLE6251DS. If the dominant signal sw itches back to rece ssive level, e.g. failure removed, a wake-up via CAN bus (recessive to dominant signal detected) is possible. Figure 5 Go-To Standby Mode du ring Bus Dominant Condition Wake-up via CAN Message During standby mode, a dominant CAN message on the bus longer than the filtering time t > tWU1, leads to the activation of the wake-up. The wake -up during standby mode is signaled with the RxD output pin. A dominant signal longer t > tWU1 on the CAN bus switches the RxD level to LOW, with a following recessive signal on the CAN bus longer t > tWU2 the RxD level is switched to high, see Figure 6. The µC is able to detect this change at RxD and switch the transceiver into the normal mode. t VCC RxD STB (Mode) t RDD AET03393.VSD t VCC Normal Mode (STB = LOW) Standby Mode (STB = HIGH) tWU1 VCC BUS VDIFF (CANH-CANL) tWU2

Data Sheet 10 Rev. 3.1, 2007-08-20 TLE6251DS Figure 6 Wake-up behavior Split Circuit The split circuitry is activated during normal mode and deactivated (SPLIT pin floating) during standby mode. The SPLIT pin is used to stabiliz e the recessive common mode signal in normal mode. This is realized with a stabilized voltage of 0.5 VCC at SPLIT. A correct application of the SPLIT pin is shown in Figure 7. The split termination for the left and right node is realized with two 60 Ω resistances and one 10 nF capacitor. The center node in this example is a stub node and the recommended value for the split resistances is 1.5 kΩ. t VCC/2 t Recessive to Dominant CANH CANL VDIFF(d) VDIFF(d) tWU1 VCAN VCC BUS VDIFF (CANH-CANL) AET03395_TO1.VSD t VRxD GND VCC 0.2 x VCC 0.8 x VCC VDIFF(d) tWU2 VDIFF(d)

Data Sheet 11 Rev. 3.1, 2007-08-20 Figure 7 Application of the SPLIT Pin for Normal Nodes and one Stub Node Other Features Fail Safe If the device is supplied but there is no signal at the digital inputs, the TxD and STB have an internal pull-up path, to prevent the transceiver to switch into the normal mode or send a dominant signal on the bus. Un-supplied Node The CANH/CANL pins remain high ohmic, if the transceiver is un-supplied. AEA 03390 .VSD Split Termination TLE6251G/DS CANH CANL SPLIT nF TLE6251G/DS CANH CANL SPLIT 60 Ω 60 Ω Split Termination nF SPLIT TLE6251G/DS CANLCANH nF 1.5 kΩ1.5 kΩ CAN Bus Split Termination at Stub 60 Ω 60 Ω

Data Sheet 12 Rev. 3.1, 2007-08-20 TLE6251DS Note: Maximum ratings are absolute ratings; ex ceeding any one of th ese values may cause irreversible damage to the integrated circuit. Table 3 Absolute Maximum Ratings Parameter Symbol Limit Values Unit Remarks Min. Max. Voltages Supply voltage VCC -0.3 5.5 V – CAN bus voltage (CANH, CANL) VCANH/L -32 40 V – CAN bus differential voltage CANH, CANL, SPLIT VCAN diff -40 40 V CANH - CANL < |40 V| CANH - SPLIT < |40 V| CANL - SPLIT < |40 V| Input voltage at SPLIT VSPLIT -27 40 V – Logic voltages at STB, TxD, RxD VI -0.3 VCC V0 V < VCC < 5.5 V Electrostatic discharge voltage at CANH, CANL, SPLIT vs. GND VESD -6 6 kV human body model (100 pF via 1.5 kΩ) Electrostatic discharge voltage VESD -2 2 kV human body model (100 pF via 1.5 kΩ) Temperatures Storage temperature Tj -40 150 °C–

Data Sheet 13 Rev. 3.1, 2007-08-20 Table 4 Operating Range Parameter Symbol Limit Values Unit Remarks Min. Max. Supply voltage VCC 4.75 5.25 V – Junction temperature Tj -40 150 °C– Thermal Resistances Junction ambient Rthj-a –1 8 5 K / W 1) Thermal Shutdown (junction temperature) Thermal shutdown temperature TjsD 150 190 °C– Thermal shutdown hyst. ∆T –1 0 K – 1) Calculation of the junction temperature Tj = Tamb + P × Rthj-a

Data Sheet 14 Rev. 3.1, 2007-08-20 TLE6251DS Table 5 Electrical Characteristics 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max. Current Consumption Current consumption ICC – 6 10 mA recessive state; VTxD = VCC Current consumption ICC – 45 70 mA dominant state; VTxD = 0 V Current consumption ICC,stb –2 0 3 0 µA stand-by mode; TxD = high Receiver Output RxD HIGH level output current IRD,H –- 4 - 2 m A VRD = 0.8 × VCC –- 1 0 0 – µA stand-by mode LOW level output current IRD,L 24–m A VRD = 0.2 × VCC Short circuit current ISC,RxD –1 5 2 0 m A – Transmission Input TxD HIGH level input voltage threshold VTD,H 2.0 – – V recessive state LOW level input voltage threshold VTD,L – – 0.8 V dominant state TxD pull-up resistance RTD 10 20 40 k Ω – TxD input hysteresis VTD hys – 200 – mV – Stand By Input (pin STB) HIGH level input voltage threshold VSTB,H 2.0 – – V normal mode LOW level input voltage threshold VSTB,L – – 0.8 V receive-only mode STB pull-up resistance RSTB 10 20 40 k Ω – STB input hysteresis VSTB hys – 200 – mV –

Data Sheet 15 Rev. 3.1, 2007-08-20 Split Termination Output (pin SPLIT) Split output voltage VSPLIT 0.3 × VCC 0.5 × VCC 0.7 × VCC V normal mode; -500 µA < ISPLIT < 500 µA VSPLIT 0.45 × VCC 0.5 × VCC 0.55× VCC V normal mode; no Load Leakage current ISPLIT -5 0 5 µA standby mode; -22 V < VSPLIT < 35 V SPLIT output resistance RSPLIT – 600 – Ω – Bus Receiver Differential receiver threshold voltage, normal mode Vdiff,rdN – 0.8 0.9 V recessive to dominant Vdiff,drN 0.5 0.6 – V dominant to recessive Differential receiver threshold, low power mode Vdiff,rdLP 0.9 1.15 V recessive to dominant Vdiff,drLP 0.4 0.8 V dominant to recessive Common Mode Range CMR -12 – 12 V VCC = 5 V Differential receiver hysteresis Vdiff,hys – 200 – mV – CANH, CANL input resistance Ri 10 20 30 k Ω recessive state Differential input resistance Rdiff 20 40 60 k Ω recessive state Bus Transmitter CANL/CANH recessive output voltage VCANL/H 2.0 2.5 3.0 V VTxD = VCC; no load CANH, CANL recessive output voltage difference Vdiff -500 – 50 mV VTxD = VCC; no load CANL dominant output voltage VCANL 0.5 – 2.25 V VTxD = 0 V; VCC = 5 V CANH dominant output voltage VCANH 2.75 – 4.5 V VTxD = 0 V; VCC = 5 V Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max.

Data Sheet 16 Rev. 3.1, 2007-08-20 TLE6251DS CANH, CANL dominant output voltage difference Vdiff = VCANH - VCANL Vdiff 1.5 – 3.0 V VTxD = 0 V; VCC = 5 V CANL short circuit current ICANLsc 50 80 200 mA VCANLshort = 18 V CANH short circuit current ICANHsc -200 -80 -50 mA VCANHshort = 0 V Leakage current ICANH,L,lk --- 5 µA VCC = 0 V;

0 V < VCANH,L < 5 V

Dynamic CAN-Transceiver Characteristics Propagation delay TxD-to-RxD LOW (recessive to dominant) td(L),TR – 150 255 ns CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF Propagation delay TxD-to-RxD HIGH (dominant to recessive) td(H),TR – 150 255 ns CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF Propagation delay TxD LOW to bus dominant td(L),T – 50 120 ns CL = 47 pF; RL = 60 Ω; VCC = 5 V Propagation delay TxD HIGH to bus recessive td(H),T – 50 120 ns CL = 47 pF; RL = 60 Ω; VCC = 5 V Propagation delay bus dominant to RxD LOW td(L),R – 100 135 ns CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF Propagation delay bus recessive to RxD HIGH td(H),R – 100 135 ns CL = 47 pF; RL = 60 Ω; VCC = 5 V; CRxD = 15 pF Min. dominant time for bus wake-up signal (RxD high to low) tWU1 0.75 3 5 µs tWU1 = td(L),R + tWU see Figure 6 Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max.

Data Sheet 17 Rev. 3.1, 2007-08-20 Min. recessive time for bus wake-up signal (RxD low to high) tWU2 0.75 3 5 µs tWU2 = td(H),R + tWU see Figure 6 TxD permanent dominant disable time tTxD 0.3 – 1.0 ms – Table 5 Electrical Characteristics (cont’d) 4.75 V < VCC < 5.25 V; RL = 60 Ω; -40 °C < Tj < 150 °C; all voltages with respect to ground; positive current flowing into pin; unless otherwise specified. Parameter Symbol Limit Values Unit Remarks Min. Typ. Max.

Data Sheet 18 Rev. 3.1, 2007-08-20 TLE6251DS Diagrams Figure 8 Test Circuits for Dynamic Characteristics AEA03392.VSD GND 5 100 nF 5 V

6 CANL

7 CANH

60 Ω47 pF 15 pF VCC STB TxD SPLIT RxD

Data Sheet 19 Rev. 3.1, 2007-08-20 Figure 9 Timing Diagrams for Dynamic Characteristics AET02926 TxDV VµC GND VDIFF d(L), Tt d(H), Tt VDIFF(d) DIFF(r)V t t GND CµV VRxD t d(L), Rt d(H), Rt CµV0.8

0.2 CµV

d(L), TRt d(H), TRt

Data Sheet 20 Rev. 3.1, 2007-08-20 TLE6251DS Application Figure 10 Applic ation Circuit ECU ECU µP with On Chip CAN Module e.g. C164C C167 C e.g. TLE 4476 (3.3/5 V) or TLE 4471 TLE 4276 TLE 4271 e. g. TLE 4270 µP with On Chip CAN Module e.g. C164C C167 C AEA 03387.VSD GND TLE6251G WK9 GND 100 nF 100 nF 100 nF 10 k Ω CANH13 51 µH CANL12 VS SPLIT11 INH7 100 nF GND VS EN NSTB NERR 4RxD TxD 5V µC 3VCC VQ2 INH VI + 22 µF + 22 µF 5 V 100 nF +22 µF VQ1 STB RxD 4 TxD 3V CC TLE6251DS GND CANH7 51 µH CANL6 SPLIT5 VQVI GND GND100 nF 100 nF+ 22 µF 5 V 100 nF +22 µF 60 Ω CAN Bus 60 Ω V Bat 4.7 nF 60 Ω 60 Ω 4.7 nF 1) Optional, according to the car manufacturer requirements

Data Sheet 21 Rev. 3.1, 2007-08-20 Package Outlines Figure 11 PG-DSO-8 (PG-DSO-8-16 Plastic Dual Small Outline) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). +0.06 0.19 0.35 x 45˚ -0.24 C 8 MAX. 0.64 ±0.26 ±0.25 0.2 8xM C 1.27 +0.10.41

0.2 M A

-0.06 1.75 MAX. (1.45) ±0.070.175 B 8xB Index Marking 5-0.2 A 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area GPS01181 0.1 Y ou can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mmSMD = Surface Mounted Device

Data Sheet 22 Rev. 3.1, 2007-08-20 TLE6251DS

Revision History

Rev. 3.1 2007-08-20 RoHS-compliant version of the TLE6251DS

• All pages: Infineon logo updated
• Page 3: “added AEC qualified” and “R oHS” logo, “Green Product (RoHS compliant)” and “AEC qualified” statement added to feature list, package name changed to RoHS compliant versions, package picture updated, ordering code removed
• Page 21: Change package drawing to GPS01181 Package name changed to RoHS compliant versions, “Green Product” description added
• added Revision History
• updated Lega l Disclaimer