560MR2C

560MR2C HB | Alldatasheet

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Page: 1 /g190/g3Features /g122/g3Single color /g122/g3High bright output /g122/g3Low power consumption /g122/g3High reliability and long life /g190/g3Descriptions/g726 /g122/g3Dice material/g726AlGaInP Hewlett Packard /g122/g3Emitting Color/g726 Super Bright RED /g122/g3Device Outline/g726 /g1825mm Round Type/ 5mm /g122/g3Lens Type/g726 Water Clear 1. All dimensions are millimeters 2. Tolerance is +/-0.25mm unless otherwise noted 560MR2C 1. All dimensions are millimeters 2. Tolerance is +/-0.25mm unless otherwise noted Ta=25° C IF=20mA Relative Luminous 90° 0.5 1.0 60° 1.0 Radiation Angle 30°60° 0° 0.5 DIRECTIVITY 30° 90° /g190/g3Directivity/g726

Page: 2 Absolute maximum ratings/g708Ta = 25/g263/g709 Value Parameter Symbol Test Condition Min. Max. Unit Reverse Voltage V R I R = 30/g173A 5 -- V Forward Current I F ---- ---- 30 mA Power Dissipation Pd ---- ---- 75 mW Pulse Current Ipeak Duty=0.1mS /g7121kHz ---- 100 mA Operating Temperature Topr ---- -40 +85 /g263 Storage Temperature Tstr ---- -40 +100 /g263 Electrical and optical characteristics /g708Ta = 25/g263/g709 Value Parameter Symbol Test Condition Min. Typ. Max. Unit Forward Voltage V F I F = 20mA V2~V4 Reverse Current I R V R = 5V ---- ---- 30 /g173A Dominate Wavelength /g172d I F = 20mA R1~R3 Spectral Line half-width /g141/g172 I F = 20mA ---- 20 ---- nm Luminous Intensity I V I F = 20mA R~T Viewing Angle 2 /g1691/2 I F = 20mA 55 65 Deg.

Bin Code IV(mcd) Bin Code IV(mcd) B in Code IV(mcd) Bin Code IV(mcd) A 0-5.0 H 37.2-52.0 Q 390-550 X 4180--5860 B 5.0-7.0 J 52.0-72.8 R 550-770 Y 5860-8200 C 7.0-9.8 K 72.8-102 S 770-1100 Z1 8-10cd D 9.8-13.7 L 102-145 T 1100-1520 Z2 10-12cd E 13.7-19.0 M 145-200 U 1520-2130 Z3 12-14cd F 19.0-26.6 N 200-280 V 2130-3000 Z4 14-16cd G 26.6-37.2 P 280-390 W 3000-4180 Z5 16-18cd Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm) B1 450-455 YG1 555-558 B2 455-460 YG2 558-561 B3 460-465 YG3 561-564 B4 465-470 YG4 564-567 B5 470-475 YG5 567-570 B6 475-480 YG6 570-573 G1 491-494 YG7 573-576 G2 494-497 Y1 582-585 G3 497-500 Y2 585-588 G4 500-503 Y3 588-591 G5 503-506 Y4 591-594 G6 506-509 Y5 594-597 G7 509-512 YO1 597-600 G8 512-515 YO2 600-603 G9 515-518 YO3 603-606 G10 518-521 YO4 606-609 G11 521-524 O1 609-612 G12 524-527 O2 612-615 G13 527-530 O3 615-618 G14 530-533 R1 618-621 G15 533-536 R2 621-624 G16 536-539 R3 624-627 G17 539-542 R4 627-630 G18 542-545 R5 630-633 G19 545-548 R6 633-636 Bin Code VF (V) Bin Code VF (V) Bin Code VF (V) Bin Code VF (V) BRIGHTNESS BIN YELLOW YELLOW ORANGE PURE ORANGE YELLOW GREEN BLUE GREEN FORWARD VOLTAGE (VF) BIN RED BLUE WAVELENGTH BIN PURE GREEN BIN ranking for LEDs Page: 3

Page: 4 Typical electrical/optical characteristic curves/g726 Luminous Intensity Relative Value at IF=20mA Forward Current(mA) 2.0 Forward Current(mA) Ambient Temperature T A ( )/g263 02 0 40 8060 100 Forward Voltage(V) 1.7 1.9 5040302.32.1 2.5 10 200 IF-Forward Current (mA) 0.5 1.0 1.5 50 2.5 1.5 Relative Luminous Intensity Ambient Temperature T A ( )/g263 -40 0 20 0.5 1.0 1.5 80 906040 2.0 2.5 -20 LUMINOUS INTENSITY /g3Vs. FORWARD CURRENT LUMINOUS INTENSITY Vs. AMBIENT TEMPERATURE FORWARD CURRENT Vs. AMBIENT TEMPERATURE FORWARD CURRENT Vs. FORWARD VOLTAGE 750450 500 600 550 650 700 Wavelength /g172(nm) Relative Luminous Intensity 100

/g121SOLDERING METHOD SOLDERING CONDITIONS REMARK DIP SOLDERING Bath temperature: 260±5/g263 Immersion time: with 5 sec /g121 Solder no closer than 3mm from the base of the package /g121 Using soldering flux,” RESIN FLUX” is recommended. SOLDERING IRON Soldering iron: 30W or smaller Temperature at tip of iron: 260 or lowe r/g263 Soldering time: within 5 sec. /g121 During soldering, take care not to press the tip of iron against the lead. (To prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. /g1635 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. /g1635 Page : 5 /g51/g68/g81/g72/g79/g11/g41/g76/g74/g17/g20/g12 /g47/g72/g68/g71/g3/g90/g85/g76/g72/g86 /g47/g72/g68/g89/g72/g3/g68/g3/g86/g79/g76/g74/g75/g87/g3 /g70/g79/g72/g68/g85/g68/g81/g70/g72 /g47/g72/g68/g71/g3/g90/g85/g76/g72/g86 /g11/g41/g76/g74/g17/g21/g12

3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). /g1635 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. /g121LED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) Page : 6 /g51/g38/g3/g69/g82/g68/g85/g71 /g76/g74/g17/g22/g709/g708/g41 /g3/g3/g77/g76/g74 Fig.4 case pc board LED LAMP APPLICATION

2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. /g121FORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) Page : 7 Stand-off Fig.5 Fig.6 Tube /g21/g80/g80 /g41/g76/g74/g17/g26 LED LAMP APPLICATION

/g121LEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) /g121HANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. /g121CHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE /g308 Chlorothene /g854 Isopropyl Alcohol /g308 Thinner /g854 Acetone /g854 Trichloroethylene /g854 /g308--Usable /g854--Do not use. Page : 8 Fig.9 /g50/g46/g701 Fig.10 /g20/g46/g74 NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. LED LAMP APPLICATION

Experiment Item: Test Condition Item Lamp & IR Reference Standard OPERATION LIFE Ta/g922 25 /g8365/g1082 IF= 20mA RH /g922/g1030=60%RH /g311/g691DYNAMIC:100mA 1ms 1/10 duty /g312/g691STATIC STATE: IF/g103220mA TEST TIME: 168HRS/g944-24HRS/g916+24HRS/g945 500HRS/g944-24HRS/g916+24HRS/g945 1000HRS/g944-24HRS/g916+72HRS/g945 MIL-STD-750/g9221026 MIL-STD-883/g9221005 JIS C 7021 /g922B-1 HIGH TEMPERATURE HIGH HUMIDITY STORAGE Ta/g922 65 /g1082/g8365/g1082 RH/g922 90 /g104495%RH TEST TIME /g922240HRS/g8362HRS MIL-STD-202/g922103B JIS C 7021 /g922B-1 TEMPERATURE CYCLING 105/g1082/g104425/g1082/g1044-55/g1082/g104425/g1082 30min 5min 30min 5min 10CYCLES MIL-STD-202/g922107D MIL-STD-750/g9221051 MIL-STD-883/g9221010 JIS C 7021 /g922A-4 THERMAL SHOCK 105/g1082/g8365/g1082/g1044-55/g1082/g8365/g1082 1 0 m i n 1 0 m i n 10CYCLES MIL-STD-202/g922107D MIL-STD-750/g9221051 MIL-SYD-883/g9221011 SOLDER RESISTANCE T/g916sol/g922260/g1082/g8365/g1082 DWELL TIME /g92210/g836lsec MIL-STD-202/g922210A MIL-STD-750-2031 JIS C 7021 /g922A-1 SOLDERABILITY T/g916sol/g922230/g1082/g8365/g1082 DWELL TIME /g9225/g836lsec MIL-STD-202/g922208D MIL-STD-750/g9222026 MIL-STD-883/g9222003 JIS C 7021 /g922A-2 Page : 9 LED LAMP PASSED TESTS Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED\`s could be found due to the Vf-If characteristics of LED.