560JY8C HB | Alldatasheet

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5.0 mm DIA LED LAMP PACKAGE DIMENSIONS DRAWING NO. : DS-35-03-0393 DATE : 2003-06-26 Page : 1 HD-R/RD013 Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 560JY8C REV:A / 0

5.0 mm DIA LED LAMP 560JY8C REV:A / 0

FEATURES

  • 5.0mm DIA LED LAMP * HIGH LUMINOUS INTENSITY OUTPUT. * LOW POWER CONSUMPTION. * HIGH EFFICIENCY. * VERSATILE MOUNTING ON P.C. BOARD OR PANEL. * I.C. COMPATIBLE. CHIP MATERIALS * Dice Material : AlGaInP/GaAs * Light Color : ULTRA YELLOW * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING : ( Ta = 25°C ) SYMBOL PARAMETER ULTRA YELLOW UNIT PAD Power Dissipation Per Chip 80 mW VR Reverse Voltage Per Chip 5 V IAF Continuous Forward Current Per Chip 30 mA IPF Peak Forward Current Per Chip (Duty －0.1,1KHz) 80 mA － Derating Linear From 25 °C Per Chip 0.40 mA/ °C Topr Operating Temperature Range -25 °C to 85°C Tstg Storage Temperature Range -40 °C to 85°C Lead Soldering Temperature｛1.6mm(0.063 inch) From Body｝260°C ± 5°C for 5 Seconds ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C ) SYMBOL PARAMETER TEST CONDI TION MIN. TYP. MAX. UNIT VF Forward Voltage I F = 20mA 1.8 2.1 2.6 V IR Reverse Current V R = 5V 100 µA λD Dominant Wavelength I F = 20mA 585 588 590 nm ∆λ Spectral Line Half-Width I F = 20mA 15 nm 2θ1/2 Half Intensity Angle IF = 20mA 50 55 60 deg IV Luminous Intensity I F = 20mA 1500 1900 2400 mcd DRAWING NO. : DS-35-03-0393 DATE : 2003-06-26 Page : 2 HD-R/RD014

5.0 mm DIA LED LAMP 560JY8C REV:A / 0 DRAWING NO. : DS-35-03-0393 DATE : 2003-06-26 Page : 3

5.0 mm DIA LED LAMP 560JY8C REV:A / 0 ySOLDERING METHOD SOLDERING CONDITIONS REMARK DIP SOLDERING Bath temperature: 260±5℃ Immersion time: with 5 sec y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. SOLDERING IRON Soldering iron: 30W or smaller Temperature at tip of iron: 260 or lowe r℃ Soldering time: within 5 sec. y During soldering, take care not to press the tip of iron against the lead. (To prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 4 Panel (Fig.1) Lead wries Leave a slight clearance Lead wries (Fig.2)

5.0 mm DIA LED LAMP 560JY8C REV:A / 0 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. yLED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 5 PC board ig.3）（F jig Fig.4 case pc board

5.0 mm DIA LED LAMP 560JY8C REV:A / 0 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2) Forming lead should be carried our prior to so ldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 6 Stand-off Fig.5 Fig.6 Tube2mm Fig.7

5.0 mm DIA LED LAMP 560JY8C REV:A / 0 yLEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) 2) Tensile strength (@ Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) yHANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. yCHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may at tack the LED surface and cause discoloration. 2) When washing is required, refer to the follo wing table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ Isopropyl Alcohol ⊙ Thinner ╳ Acetone ╳ Trichloroethylene ╳ ⊙--Usable ╳--Do not use. DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 7 Fig.9 OK！ Fig.10 1Kg NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical.

5.0 mm DIA LED LAMP 560JY8C ssREV:A / 0 Experiment Item: Test Condition Item Lamp & IR Reference Standard OPERATION LIFE Ta： 25 ±5℃ IF= 20mA RH ：＜=60%RH ① DYNAMIC:100mA 1ms 1/10 duty ② STATIC STATE: IF＝20mA TEST TIME: 168HRS（-24HRS，+24HRS） 500HRS（-24HRS，+24HRS） 1000HRS（-24HRS，+72HRS） MIL-STD-750：1026 MIL-STD-883：1005 JIS C 7021 ：B-1 HIGH TEMPERATURE HIGH HUMIDITY STORAGE Ta： 65 ℃±5℃ RH： 90 〜95%RH TEST TIME ：240HRS±2HRS MIL-STD-202：103B JIS C 7021 ：B-1 TEMPERATURE CYCLING 30min 5min 30min 5min 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021 ：A-4 THERMAL SHOCK 1 0 m i n 1 0 m i n 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011 SOLDER RESISTANCE DWELL TIME ：10±lsec MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021 ：A-1 SOLDERABILITY DWELL TIME ：5±lsec MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021 ：A-2 DRAWING NO. : DS-35-04-0744 DATE : 2004-12-03 Page : 8