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Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: hybridsales@micropac.com Rev A 02 08 2013
53115 POWER MOSFET OPTOCOUPLER,
480V / 0.28A / 0.55A, AC/DC, Hermetically Sealed Mii HYBRID MICROELECTRONICS PRODUCTS DIVISION Features: Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight Options: 5mA or 10mA input forward current Performance Guaranteed over –55°C to +125°C Ambient Temperature AC / DC Signal & Power Switching Maximum Average Current AC/DC: 0.28 A DC only: 0.55 A 1500 VDC Withstand Test Voltage High Transient Immunity Applications: Satellite/Space Systems Military/High Reliability Systems AC/DC Electromechanical and Solid State Relay Replacement I/O Modules
DESCRIPTION
The 53115 is a single channel, hermetically sealed, power MOSFET optocoupler. Low on- resistance of the MOSFET output, combined with 1500 VDC isolation between input and output, makes this optocoupler ideal for solid state relay applications. Operation is specified over the full military temperature range. The part is supplied in an eight-pin, dual-in-line ceramic package. Lead options support both through-hole and surface -mount assembly. Standard lead finish is gold plated. Functionally, the device operates as a single-pole, normally open (1 Form A) solid state relay. The device is actuated by an input current, wh ich can be supplied from standard logic types such as open-collector TTL. The input current bi ases a light emitting diode that is optically coupled to an integrated photovoltaic diode array. The photovoltaic array powers control circuitry that operates the output MOSFETs. Optimum switching of either AC or DC loads is provided by a configurable output. For AC loads, connection A in Figure 1 must be used. Connection A will also switch DC loads but connection B, in Figure 1, provides DC- only operation with the advantages of substantial reduction in on- resistance and twice the output current capability as that obtained with connection A.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: hybridsales@micropac.com Rev A 02 08 2013
53115 Power MOSFET Optocoupler
Single Shot Output Current - Figure 4 Output Voltage RECOMMENDED OPERATING CONDITIONS: PARAMETER SYMBOL DEVICE TYPE MIN MAX UNITS Input Current (on) I F (ON) 5 20 m A Input Voltage (off) VF (OFF) All 0 0.6 VDC Operating Temperature TA All -55 +125 °C
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: hybridsales@micropac.com Rev A 02 08 2013 TA = -55C to +125C, unless otherwise specified. Parameter Sym. Min. Typ.* Max. Units Test Conditions Notes Output Withstand Voltage VO(OFF) 480 V VF = 0.6 V IO = 10 A Output On-Resistance (Connection A) R(ON) 5.5 8.0 I F = 5 mA IO = 100 mA (pulse duration 30 ms) Figure Output On-Resistance (Connection B) 2.0 IF = 5 mA IO = 200 mA (pulse duration 30 ms) Output Leakage Current I O (OFF) 10 -4 25 A VF = 0.6 V VO = 480 V Input Forward Voltage V F 1.0 1.24 1.7 V I F = 5 mA Input Reverse Breakdown Voltage VR 5.0 V IR = 100 A Input-Output Insulation I I-O 1.0 A RH 45%, t = 5 s VI-O = 1500 VDC TA = 25C 4, 5 Turn-On Time t ON 1.25 6.0 ms IF = 5 mA VDD = 350 VDC IO = 200 mA Figure Turn-Off time t OFF 1.0 3.0 ms IF = 5 mA VDD = 350 VDC IO = 200 mA Figure Output Transient Rejection dV O/dt 1000 V/s VPEAK = 50 V CM = 1000 pF CL = 15 pF RM 1 M Figure Input-Output Transient Rejection dVI-O/dt 500 V/s VDD = 5 V VI-O (PEAK) = 50 V RL = 20 k CL = 15 pF Figure
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: hybridsales@micropac.com Rev A 02 08 2013 All typical values are at TA = 25C, IF (ON) = 10mA, VF (OFF) = 0.6V unless otherwise specified. Parameter Symbol Test Conditions Typ. Units Notes Output Off-Capacitance C O (OFF) VO = 28 V f = 1 MHz 145 pF Output Offset Voltage VOS IF = 10 mA IO = 0 mA 2 V 6 Input Diode Temperature Coefficient VF /TA IF = 10 mA -1.4 mV/°C Input Capacitance C IN VF = 0 V f = 1 MHz 20 pF 7 Input-Output Capacitance CI-O VI-O = 0 V f = 1 MHz 1.5 pF 4 Input-Output Resistance R I-O VI-O = 500 V t = 60 s 1013 4 Notes: 1. Maximum junction to case thermal resistance for the device is 15ºC/W, where case temperature, TC, is measured at the center of the package bottom. 2. Maximum permissible Output Power Dissipation is 800mW to 85 ⁰C then derate linearly to Zero at 145⁰C. 3. During the pulsed R ON measurement (IO duration < 30 ms), ambient (TA) and case temperature (TC) are equal. 4. Pins 2 through 3 shorted together and pins 5 through 8 shorted together. 5. This is a momentary withstand test, not an operating condition. 6. V OS is a function of IF and is defined between pins 5 and 8, with pin 5 as the reference. VOS must be measured in a stable ambient (free of temperature gradients). 7. Zero-bias capacitance measured between the LED anode and cathode. 8. Turn-On and Turn-Off times measured using specified voltage and resistive load. Reactive loads, specific voltage and load currents may affect the actual time measured. CAUTION: Care should be taken not to exceed the maximum output power dissipation, maximum case temperature, and maximum junction temperature when repetitively switching loads.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: hybridsales@micropac.com Rev A 02 08 2013 F Fig ure 1 - Terminal Connections 5 4 5 CONNECTION B DC CONNECTION Case outlines P, X, Y, AND Z Terminal number Terminal symbol Connection A Conneciton B (AC or DC load) (DC load only) NC = No connection I FV OI OV FI FV VO OI V NC V NC V NC NC V F-V NC VO+ O-N V O+ NC NC VF+ Figure 2 - Truth Table ON ON OFF OFF INPUT OUTPUT
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. Figure 3. Switching Test Circuit and Waveform.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
- C INCLUDES PROBE AND FIXTURE CAPACITANCE.
- R INCLUDES PROBE AND FIXTURE RESISTANCE.
Figure 4. Output Transient Rejection Test Circuit and Waveform.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. MICROCIRCUITS PRODUCTS DIVISION 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: hybridsales@micropac.com Rev A 02 08 2013 .050 (1.27) .035 (0.89) .050 (1.27) .035 (0.89) .050 (1.27) .035 (0.89) .110 (2.79) .090 (2.29) .390 (9.91) .370 (9.40) .390 (9.91) .370 (9.40) .110 (2.79) .090 (2.29) .110 (2.79) .090 (2.29) .390 (9.91) .370 (9.41) SEATING PLANE .180 (4.57) MAX .013 (0.33) .007 (0.18) .170 (4.32) MAX. .320 (8.13) MAX .310 (7.87) .290 (7.37) .170 (4.32) MAX. .170 (4.32) MAX. .390 (9.91) .380 (9.65) .320 (8.13) MAX SEATING PLANE PIN 1 .310 (7.87) .290 (7.37) .320 (8.13) MAX. Case Outline P Case Outline X Case Outline Y NOTES: 1. PIN 1 IS INDICATED BY THE ESD TRIANGLE MARKED ON THE LID OF THE PACKAGE. 2. DIMENSIONS ARE IN INCHES, (mm). 3. METRIC EQUIVALENTS ARE GIVEN FOR GENERAL INFORMATION ONLY. 4. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ±.005 (0.13mm). .140 (3.56) MAX. .050 (1.27) .035 (0.89) SEATING PLANE .045 (1.14) .035 (0.89) .110 (2.79) .090 (2.29) .390 (9.91) .370 (9.40) .320 (8.13) MAX .013 (0.33) .007 (0.18) .310 (7.87) .290 (7.37) Case Outline Z .020 (0.51) MAX. .050 (1.27) .030 (0.76) .020 (0.51) MIN .065 (1.65) .055 (1.40) .020 (0.51) MIN .055 (1.40) .045 (1.14) .020 (0.51) MIN .013 (0.33) .007 (0.18) .150 (3.81) MIN. 0.052 [1.32] 0.042 [1.07] 0.016 [0.41] 0.020 [0.51] 0.016 [0.41] 0.020 [0.51] Mii 31757 USA 53115 Q XXXXX