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Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: microsales@micropac.com 12-8-15 Rev E Pg. 1 of 8
53259 POWER MOSFET OPTOCOUPLER SPST
Features: Hermetically Sealed 8-Pin Dual-In-Line package Normally Closed Contact Performance over –55°C to +125°C Ambient Temperature Range ±400 VDC Blocking Voltage in Bi-directional Mode AC/DC Switching Maximum AC / DC Load Current: 0.12 A / 0.24 A 1500 VDC Withstand Test Voltage Optically Isolated 1.5 A Output Surge Current Same foot print as HSSR 7111 / Mii 53111 Applications: Satellite / Space Systems Military / High Reliability Systems Power Distribution Control AC/DC Electromechanical or Reed Relay Replacement I/O Modules for Automated Test Equipment Process Control Telecom Applications Medical Electronics
DESCRIPTION
The 53259 is a single channel power MOSFET optocoupler. Low on-resistance of the MOSFET outputs, combined with 1500 VDC isolation between input and output, makes th is optocoupler ideal for many solid state relay applications. Operation is specified ov er the full military temperature range. The part is supplied in an eight-pin, dual-in-line ceramic package, available in variety of qualit y levels from COTS to class K including any custom screening requirements. For ordering part number; consult wi th Micropac factory for detail. The part is normally shipped with gold plated leads, but lead finishes per MIL-PRF-38534 are available. Functionally, the device operates as a si ngle-pole, normally closed (1 Form B) solid state relay. The device is actuated by an input current, which can be supplied from standard logic types such as open-collector TTL. The input current biases a light emitting diode that is optically coupled to an in tegrated photovoltaic diode array. The photovoltaic array powers control circuitry that operates the output MOSFETs. Optimum switching of either AC or DC loads is provi ded by a configurable output. For AC loads, connection A in Figure 1 must be used. Connection A will also switch DC loads but connection B, in Figure 1, provides DC-only operation with the advantages of subst antial reduction in on-resistance and tw ice the output current capability as that obtained with connection A.
53259 Power MOSFET Optocoupler
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: microsales@micropac.com 12-8-15 Rev E Pg. 2 of 8 ABSOLUTE MAXIMUM RATINGS Output Current Connection A – I Inrush Output Current Connection A - I Output Blocking Voltage Connection A - V RECOMMENDED OPERATING CONDITIONS: PARAMETER SYMBOL MIN MAX UNITS Input Current (off) I F (OFF) 5 20 mA Input Voltage (on) V F (ON) 0 0.6 VDC Operating Temperature T A -55 +125 °C Note: On state means contact closed. Off state means contact open.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: microsales@micropac.com 12-8-15 Rev E Pg. 3 of 8 ELECTRICAL SPECIFICATIONS TA = -55C to +125C, unless otherwise specified. Parameter Sym. Min. Typ.* Max. Units Test Conditions Notes Output Blocking Voltage V O(OFF) 400 ---- ---- V IF = 10 mA IO = 10 A Output On-Resistance (Connection A) R(ON) ---- 25 50 IF = 0 mA, VIN = 28V IO = 120 mA (pulse duration 30 ms) Figure 3 Output On-Resistance (Connection B) ---- 12 25 I F = 0 mA, VIN = 28V IO = 240 mA (pulse duration 30 ms) Output Leakage Current I O (OFF) ---- 0.2 10 A VO(OFF) = 400 V Input Forward Voltage V F 1.0 1.2 1.9 V I F = 10 mA Input Reverse Breakdown Voltage VR 5.0 12 ---- V IR = 10 A Input-Output Insulation I I-O ---- ---- 1.0 A RH 45%, t = 5 s VI-O = 1500 VDC TA = 25C 4, 5 Turn-On Time t ON ---- 0.3 3.0 ms IF = 0 mA, VIN = 200V IO = 25 mA
3 Figure 3
Turn-Off time t OFF ---- 0.1 1.0 ms IF = 10 mA, VIN = 200V IO = 25 mA
- All typical values are at TA = 25ºC, unless otherwise specified. Notes: 1. Maximum junction to case thermal resistance ( JC) for the device is 15ºC/W, where case temperature (TC), is measured at the center of the package bottom. 2. R (ON) is measured for the individual sections of Condition B, Pins 5 and 6 and Pins 7 and 8. Meeting these limits guarantees the performance of Connection A. 3. During the pulsed R (ON), T(ON) T(OFF) measurements (IO duration < 30 ms), ambient (TA) and case temperature (TC) are equal. 4. Pins 2 and 3 shorted together and pins 5 through 8 shorted together. 5. This is a momentary withst and test, not an operating condition. 6. Care should be taken not to exceed the maximum out put power dissipation, maximum case temperature, and maximum junction temperature when repetitively switching loads.
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. Figure 1. Terminal Connections Figure 2. True Table
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
- PULSE GENERATOR HAS THE FOLLOWING CHARACTERISTICS: OUTPUT IMPEDANCE = 50
- LOAD CAPACITANCE (C ) INCLUDES PROBE AND JIG CAPACITANCE.
Figure 3. Switching Test Circuit and Waveform
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: microsales@micropac.com 12-8-15 Rev E Pg. 6 of 8 .050 (1.27) .035 (0.89) .050 (1.27) .035 (0.89) .110 (2.79) .090 (2.29) .390 (9.91) .370 (9.41) .110 (2.79) .090 (2.29) .020 (.051) MAX. .390 (9.91) .370 (9.41) NOTES: 1. PIN 1 IS INDICATED BY THE ESD TRIANGLE MARKED ON THE LID OF THE PACKAGE. 2. DIMENSIONS ARE IN INCHES, (mm). 3. METRIC EQUIVALENTS ARE GIVEN FOR GENERAL INFORMATION ONLY. 4. UNLESS OTHERWISE SPECIFIED, TOLERANCE IS ±.005 (0.13mm). .180 (4.57) MAX .170 (4.32) MAX. CASE OUTLINE X .170 (4.32) MAX. .020 (0.51) MAX. .047 (1.19) TYP .390 (9.91) .380 (7.87) .320 (8.13) MAX SEATING PLANE PIN 1 SYMBOL ESD .310 (7.87) .290 (7.37) .320 (8.13) MAX. CASE OUTLINE P
31757 USA
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: microsales@micropac.com 12-8-15 Rev E Pg. 7 of 8 CASE OUTLINE Y 53259-XXX
0.020 Max
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement. Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible. MICROPAC INDUSTRIES, INC. 905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281 www.micropac.com E-MAIL: microsales@micropac.com 12-8-15 Rev E Pg. 8 of 8 Ordering Guide The following chart explains the ordering procedure for Micropac Part Numbers. Please contact Micropac for other desired options. Example: Mii P/N 53259-PA 53259- P A Device Type & Model Number Case Outline P: 8-Pin DIP X: 8-Pin Gull Wing Y: 8-Pin Extended Gull Wing Lead Finish A: Solder DIP C: Gold Plate X: Either A or C Quality Screening Level None: Per Data Sheet H: Class H, MIL-PRF-38534 K: Class K, MIL-PRF-38534