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5.0 mm DIA LED LAMP REV: A / 1 PA CKAGE DIMENSIONS ITEM MATERIALS RESIN Epox y Resin LEAD FR AME Sn Plating iron Alloy DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page : 1 Note: 1.All Dimen sions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6.The lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling. 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 FEAT URES * 5.0mm DIA LED LAMP * HIGH LUMINOUS INTENSITY OUTPUT * LOW POWER CONSUMPTION. * HIGH EFFICIENCY. * VERSAT ILE MOUNTING ON P.C. BOARD OR PANEL. * I.C. COMPA TIBLE. CHIP MATERIALS * Dice Material : Ga AlInP/GaAs * Light Color : UL TRA YELLOW * Lens Color : WA TER CLEAR ABSOLUTE MAXIMUM RATING : ( Ta = 25°C ) SYMBOL PA RAMETER ULTRA YELLOW UNIT PAD Power Diss ipation Per Chip 85 mW VR Reverse V oltage Per Chip 5 V IAF Continuous Forward Current Per Chip 30 mA IPF Peak Forward Current Per Chip (Duty － 0.1,1KHz) 80 mA － Derating Linear From 25 °C Per Chip 0.40 mA/ °C Topr Operating Temperature Range -25°C to 85°C Tstg S torage Temperature Range -25°C to 85°C ELECTRO-O PTICAL CHARACTERISTICS : ( Ta = 25°C ) SYMBOL PA RAMETER TEST CONDITION MIN. TYP. MAX. UNIT VF Forward V oltage IF = 20mA 2.0 2.8 V IR Reverse Current VR = 5V 100 µA λD Dominant W avelength I F = 20mA 588 nm ∆λ S pectral Line Half-Width I F = 20mA 15 nm 2θ1/2 Half Intensity Angle IF = 20mA 15 deg IV Luminous Intensity I F = 20mA 3000 mcd FBLK IC Flicker Frequency 1.30 1.60 1.90 Hz VDD Operating V oltage Vdd=5Vdc 2 5 15 V DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page : 2 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page : 3 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 ySOLDERING METHOD SOLDERING CONDITIONS REMARK DIP SOLDERING Bath temperature: 260℃ Immersion time: with 5 sec,1 time y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. yAttached data of temperatuare cure for your reference SOLDERING IRON Soldering iron: 30W or smaller Temperature at tip of iron: 360 or lowe r℃ Soldering time: within 3 sec. y During soldering, t ake care not to press the tip of iron against the lead. (To prevent heat from being transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the p ackage is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. 2) When soldering wire to the l ead, work with a Fig (See Fig.2) to avoid stressing the package. Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin & copper and sliver is proposed with the temperature of Celsius 260. The proportion of the alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3 seconds. DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page : 4 Panel (Fig.1 Lead wries Leave a slight clearance Lead wries (Fig.2) 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 3) Similarly , when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). 4) Repos itioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. y STORAGE 1) The LEDs should be s tored at 30℃ or less and 70% RH or less after being shipped from PARA and the storage life limits are 3 months . 2) PARA LED lead frames are co mprised of a stannum plated iron alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible. Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page : 5 PC board ig.3）（F jig 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 yLED MOUNTING METHOD 3) When mounting the LED by using a case, as s hown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) 4) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page : 6 Fig. case pc board Stan d-off Fig.5 Fig Tube 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 yFORMED LEAD 1) The lead s hould be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2) Forming lead should be carried our prior to so ldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on bo ard, so that stress against the LED is prevented. (Fig.8) yLEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page :7 2mm Fig.7 Fig.9 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 2) T ensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) y HEAT GENERATION 1) Thermal design of the end produc t is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. The operating current should be decided after considering the ambient maximum temperature of LEDs. yCHEMICAL RESIST ANCE 1) A void exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the follo wing table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ Isopropyl Alcohol ⊙ Thinner ╳ Acetone ╳ Tr ichloroethylene ╳ ⊙--Usable ╳--Do not use. DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page :8 OK！ Fig. 1Kg NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on s uch factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. 520MY8C-f2

5.0 mm DIA LED LAMP REV: A / 1 yOTHERS 1) Care must be t aken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. 2) Flashing lights have been known to cause discomf ort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. 3) The LEDs described in this brochure are in tended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult PARA’s sales staff in advance for information on the applications in which exceptional quality and reliability are required , particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). 4) User shall not reverse engineer by disassemblin g or analysis of the LEDs without having prior written consent from PARA. When defective LEDs are found, the User shall inform PARA directly before disassembling or analysis. 5) The formal specifications mu st be exchanged and signed by both parties before large volume purchase begins. 6) The appearance and specifications of the product may be modified for improvement without notice. DRAW ING NO. : DS-35-05-0057 DATE : 2008-12-24 Page :9 520MY8C-f2