3758284 INFINEON | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 13
Technical content
MOTIX™ IMD700A / IMD701A EconoDUAL™ 3 Wave power modules EconoPIM™ and EconoPACK™ 2 and 3 IGBT modules with TRENCHSTOP™ IGBT7 TLD6098-1EP BGSX33M5U16 - 3P3T MIPI 2.1 antenna cross switch XENSIV™ - TLE4999C4 and C4-S0001 linear Hall sensors, fully ISO 26262 compliant BGT60TR13C - XENSIV™ 60GHz radar sensor for advanced consumer sensing AIROC™ CYW43439 and Module Partner Laird Connectivity EVAL_IMD700A_FOC_3SH EVAL-IKA15N65ET6 - Evaluation board for motor drive applications up to 1.2 kW AURIX™ TC334_LITE kit REF_WINLIFT_TLE9855 July 2022
MOTIX™ IMD700A / IMD701A MOTIX™ IMD700A and IMD701A are Infineon’s latest fully program- mable motor controllers integrating XMC1404 microcontroller with MOTIX™ 6EDL7141 3 - phase gate driver IC in one package. This enables the development of next-generation battery-operated prod- ucts using BLDC or PMSM motors. MOTIX™ IMD700A and IMD701A are ideal for applications such as professional cordless power tools, gardening products, e-bikes, and automated guided vehicles. With integrated precision power supply and current shunt amplifi- ers, many of the peripheral circuitry is no longer necessary allow- ing a reduction in PCB space, increased power density, and im- proved system packaging possibilities. Product collaterals / Online support Product family page Product page IMD700A Product page IMD701A Product brief Evaluation board page
Features
XMC1404 with MATH co-processor Integrated power supplies Adjustable slew rate Programmable gate drive parameters 3x current shunt amplifier Complete dedicated motor control protection suite Target applications Cordless power tools Automated guided robots Cordless gardening tools Drones Product overview incl. data sheet link Benefits Reduced external component count and PCB area Optimized efficiency and EMI Maximum flexibility to use different inverter MOSFET’s Highly accurate integrated current sense saves external components Higher dynamic range to increase signal resolution Improved reliability and fault detection Competitive advantage Motor drive specific XMC with dedicated high-performance 3-phase motor control gate driver IC for battery-operated products Fully programmable to provide the best system performance and efficiency Block diagram OPN SP Number Package IMD700AQ064X128AAXUMA1 SP005354876 PG-VQFN-64 IMD701AQ064X128AAXUMA1 SP005576993 PG-VQFN-64
EconoDUAL™ 3 Wave power modules CO2 reduction targets make the electrification of large vehicles inevitable, but the repetitive start-stop cycles and the long operation hours put a high demand on power module lifetime. The Wave power modules come in the standard EconoDUAL™ 3 housing, but feature additional ribbon bonds on the backside for an advanced cool- ing concept with direct liquid cooling. The ribbon bond solution reduces overall temperatures and ripple in etrucks, ebusses, drives or wind applica- tions. The temperature can be reduced by around 25 Kelvin leading to a lifetime extension of up to factor 6. Or at the same lifetime level, the current can be increased by up to 30 %. In addition, no thermal grease material is needed leading to a simplified inverter production. Product collaterals / Online support Product page FF600R12ME4W_B73 Product page FF900R12ME7W_B11 Product family page EconoDUAL™ 3 EconoDUAL™ 3 housing 1200 V, 600 A & 900 A TRENCHSTOP™ IGBT7 chip generation (FF900 only) Ribbon-bond structure on the baseplate for direct liquid-cooled heat sink PressFIT control pins and screw power terminals Compact and robust design with molded terminals Target applications eCAV Drives Wind Product overview incl. data sheet link Benefits 25 K lower temperature Up to 6 times longer lifetime due to better cooling Or improved output current by up to 30 % at same lifetime Simplified inverter production induced by no thermal grease application OPN SP Number Package FF600R12ME4WB73BPSA1 SP005589477 AG-ECONOD-411 FF900R12ME7WB11BPSA1 SP005589481 AG-ECONOD-711 Block diagram
EconoPIM™ and EconoPACK™ 2 and 3 IGBT modules with TRENCHSTOP™ IGBT7 portfolio extension The portfolio of EconoPIM™ and EconoPACK™ 2 and 3 IGBT modules with TRENCHSTOP™ IGBT7 chip generation has now been extended. The EconoPACK™ modules in sixpack configuration now feature 50, 75, 100 and 200 A versions. The EconoPIM™ family has additional options for customers to choose from including pre-applied thermal interface materi- al TIM, solder pin or PressFIT options. The modules can reach up to 175° C Tvjop under overload conditions, mak- ing them a perfect fit for industrial drives applications. Compared to IGBT4, the IGBT7 has a higher power density, an increased switching frequency, the cooling effort can be reduced. All in all, there is the same or better lifetime while keeping the operating conditions un- changed. Product collaterals / Online support Product page EconoPIM™ Product page EconoPACK™ Product page IGBT7 1200 V, 50 – 200 A Econo 2 and 3 housing PIM and sixpack topology Latest TRENCHSTOP™ IGBT7 chip generation Additional options incl. pre-applied TIM, solder pin or PressFIT version Target applications Industrial drives Product overview incl. data sheet link Benefits VCEsat is reduced by 20 % compared to IGBT4 while keeping the turn-off losses at the same level Optimized for drives applications Tvjop under overload up to 175° C High power density Broadest portfolio meets different customer needs Competitive advantage Broadest portfolio giving designers a maximum level of flexibility OPN SP Number Package FP50R12N2T7PBPSA1 SP005407056 AG-ECONO2B-711 FP50R12N2T7PB11BPSA1 SP005595806 AG-ECONO2B-711 FP75R12N2T7PB11BPSA1 SP005595812 AG-ECONO2B-711 FP75R12N3T7B11BPSA1 SP005632397 AG-ECONO3B-711 FP75R12N3T7BPSA1 SP005632393 AG-ECONO3B-711 FP100R12N2T7B11BPSA1 SP005597715 AG-ECONO2B-711 FP100R12N3T7B11BPSA1 SP005402466 AG-ECONO3B-711 FP100R12N3T7BPSA1 SP004145198 AG-ECONO3B-711 FP150R12N3T7B11BPSA1 SP005404168 AG-ECONO3B-711 FP150R12N3T7PB11BPSA1 SP005596103 AG-ECONO3B-711 FP200R12N3T7B11BPSA1 SP005612514 AG-ECONO3B-711 FS50R12N2T7B15BPSA2 SP005612508 AG-ECONO2B-711 FS75R12N2T7B15BPSA2 SP005612510 AG-ECONO2B-711 FS100R12N2T7B15BPSA1 SP005551553 AG-ECONO2B-711 FS150R12N2T7B15BPSA1 SP005551571 AG-ECONO2B-711 FS150R12N2T7B54BPSA1 SP005546346 AG-ECONO2B-711 FS150R12N3T7BPSA1 SP004145224 AG-ECONO3B-711 FS200R12N3T7BPSA1 SP005337556 AG-ECONO3-4
LITIX™ Power TLD6098-1EP is a single channel configurable DC-DC boost controller with built-in diagnosis and protection features for automotive exterior and interior lighting. Product collaterals / Online support Product page Peak current mode controller Fixed current or fixed voltage configuration in Boost, Buck, Buck- Boost, SEPIC and Flyback topology Drives low-side external n-channel switching MOSFET from inter- nal 5 V voltage regulator Flexible switching frequency range from 100 kHz to 500 kHz with spread spectrum modulator Synchronization with external clock source from 100 kHz to 500 kHz and 2.2 MHz Wide input voltage range from 4.5 V to 60 V Analog dimming and PWM dimming feature (embedded or exter- nal) to adjust average LED current Integrated PMOS gate drivers for PWM dimming and output dis- connection Automotive qualified Target applications Automotive exterior and interior lighting General illumination General-purpose constant output current / voltage appli- cations Product overview incl. data sheet link Benefits Reduced EMI emissions Reliable protection with high - side load disconnection using a PMOS 2.2 MHz option for small size DC-DC Competitive advantage Low EMI emissions Reliable protection with high-side load disconnection using a PMOS OPN SP Number Package TLD60981EPXUMA2 SP005568815 PG-TSDSO-14 Block diagram
BGSX33M5U16 - 3P3T MIPI 2.1 antenna cross switch 3P3T MIPI 2.1 antenna cross switch The BGSX33M5U16 RF CMOS switch is specifically designed for LTE and 5G antenna applications. This 3P3T cross-switch offers low insertion loss and low harmonic generation. The switch is controlled via a MIPI RFFE control interface. The on-chip controller allows power-supply voltages from 1.65 to 1.95 V. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. The device has a very small size of only 2.0 mm x 2.0 mm and a thickness of 0.6 mm. Product collaterals / Online support Product page High linearity up to 38 dBm peak power Fast switching speed (2 µs max.) for 5G SRS applications Very low insertion loss and high port to port isolation up to 7.125 GHz MIPI RFFE 2.1 control interface Software and hardware programmable USID Ultra low profile lead - less plastic package (MSL-1, 260° C per IPC / JEDEC J-STD-20) RoHS and halogen-free package Target applications LTE / 5G smartphones 5G notebooks / laptops 5G customer - premises - equipment (CPE), 5G routers Product overview incl. data sheet link Benefits Optimizing RF performance through best antenna selection and swapping of LTE / 5G triple antenna applications Enabling 5G new radio (NR) coverage with very low system losses Targeting 4 x 4 MIMO and 3 antenna 5G SRS application Enhancing device’s battery lifetime by reducing SAR unwanted effects Competitive advantage Fastest switching speed 3P3T (2 µs max.) Lowest insertion loss 3P3T in the market, 0.88 dB max. at 5G NR band n79 (4.4 - 5.0 GHz) OPN SP Number Package BGSX33M5U16E6327XTSA1 SP005425077 PG-ULGA-16 Block diagram
XENSIV™ - TLE4999C4 and C4-S0001 linear Hall sensors, fully ISO 26262 compliant The TLE4999C4 and C4-S0001 are dual channel linear Hall sensors with a bus-capable digital Short-PWM-Code (SPC) interface. Both channels are integrated on one die in the chip. The highly accurate measurement chan- nels (main and sub) can be used for a plausibility check on system level. This enables a high diagnostic coverage. The sensor is developed in com- pliance to ISO 26262 (first edition 2011), supporting safety requirements on system level rated up to ASIL D (C4) and ASIL C (S0001). Highest accuracy over a wide tempera- ture range and lifetime is achieved by an integrated digital temperature- and stress-compensation. Product collaterals / Online support Product page TLE4999C4 Product page TLE4999C4-S0001 Two highly accurate redundant Hall measurement channels (main and sub) integrated on one chip Developed compliant to ISO 26262 (first edition 2011) Safety Element out of Context for safety requirements rated up to ASIL D High diagnostic coverage by plausibility checking of main and sub signal on system level Fast digital SPC interface with min. 0.5 µs unit time for transmission of main and sub signals in less than 500 µs Bus-capability for up to 4 sensor ICs on one data line Selectable 12 / 14 / 16 bit output signals, protected by CRC and rolling counter Thin 4 pin leaded single sensor package Operating automotive temperature range -40° C to 150° C Digital temperature and stress compensation Reverse-polarity and over voltage protection for VDD, GND and OUT pins Main and sub channel programmable independently in EEPROM Multipoint calibration up to 9 points Frameholder mechanism Single-wire SICI programming interface on output pin 2 x 16 bit user-configurable ID in EEPROM Target applications Robust replacement of potentiometers: No mechanical abrasion, resistant to humidity, temperature, pollution, and vibration. Linear and angular position sensing in automotive and in- dustrial applications with highest accuracy requirements. Suited for safety applications such as pedal position, throttle position, and steering torque sensing. Product overview incl. data sheet link Benefits High diagnostic coverage, ISO 26262-compliancy and dual sensor cell integration enable development of fail operational systems Multi-point calibration for better fit into various magnetic circuit designs Easy system integration due to programmability of several sensor parameters Competitive advantage Infineon provides excellent functional safety design support during development enabling for ASIL D systems with two sensor channels in one device SPC protocol enables common bus usage with angle sensors, with common timestamp for up to 4 sensors. Tolerance specifications over temperature and life time enable for higher tolerances of mechanical components and use of less expensive magnet power down mode (7 nA) OPN SP Number Package TLE4999C4HALA1 SP005425077 PG-SSO-4 TLE4999C4S0001HALA1 SP005727375 PG-SSO-4 Block diagram
BGT60TR13C - XENSIV™ 60 GHz radar sensor for advanced consumer sensing The BGT60TR13C MMIC is a 60 GHz radar sensor with integrated antennas and comes with one transmitting and three receiving antennas. Thanks to the L - shaped antenna array, horizontal and as well as vertical angular measurement can be ensured. Moreover, the Antennas in Package (AIP) concept eliminates the antenna design complexity at the user end and the PCB can be designed with standard FR4 materials. With its small form factor and low power consumption, BGT60TR13C MMIC brings innovative, intuitive sensing capabilities to many applications. Based on the developed algorithm the MMIC can serve established as well as new applications and use cases without intruding on privacy. BGT60TR13C has been demonstrated to be a powerful sensor for presence detection/segmentation, touchless interaction and vital sensing. Product collaterals / Online support Product page Product brief Board page Integrated Finite - State - Machine (FSM) Fast chirp speed: 800 MHz / µs High Signal - To - Noise Ratio (SNR) High Bandwidth >5 GHz FMCW operation Integrated L - shaped antennas + small package ( 6.5 x 5.0 x 0.9 mm³ ) Able to track vital signs in consumer electronics, healthcare as well as industrial applications Target applications Smart TV Smart speaker Notebook / PC Vital sensing monitoring systems Product overview incl. user manual link Benefits Enables human presence detection, tracking, and segmentation while providing extremely high accuracy in detecting micro & macro motions Allows semi - autonomous operation Highly configurable modulation and power modes High velocity resolution High sensitivity allows submillimeter level motion detection Demo board This demo features Infineon’s advanced 60 GHz radar sensor – the BGT60TR13C. The BGT60TR13C MMIC comes with integrated antennas and is equipped with one transmitting and three receiving antennas. OPN SP Number Package BGT60TR13CE6327XUMA1 SP002262606 PG-VF2BGA-40 DEMOBGT60TR13CTOBO1 SP005728718 Block diagram
AIROC™ CYW43439 and Module Partner Laird Connectivity AIROC™ CYW43439 and Laird Connectivity’s Sterling LWB+ Modules are the perfect pairing …. Reliable, Secure and Power Efficient Designs for the Connected Edge. The CYW43439 has a 1x1 single-band 2.4 GHz Wi-Fi 4 and Bluetooth® 5.2. It includes updated Bluetooth® capabilities, including enhanced security with WPA3, plus Soft AP and shared SDIO host interface for Wi-Fi + Bluetooth®. Product collaterals / Online support Product page Product information Laird Connectivity module Wi-Fi features: Wi-Fi 4 (802.11 n) Single - band (2.4 GHz) 1x1 SISO 20 MHz channels, up to 96 Mbps PHY data rate Integrated internal PA, LNA, and T/R switch supports a single antenna shared between Wi-Fi and Bluetooth Bluetooth features: Class 1 (100 m) and Class 2 (10 m) operation Bluetooth 5.2, supports BDR (1 Mbps), EDR (2/3 Mbps), and Bluetooth LE Target applications Smart home: smart appliances, smart thermostat, smart doorbells, IP cameras, service robots Consumer audio: smart speakers Digital signage, Mobile Asset Scanners Factory Automation: industrial robotics, asset tracking Power & energy: smart meters, data concentrators Building control: surveillance equipment, smart commercial HVAC, occupancy management Healthcare: blood pressure monitors, tele - health gateways, con- nected patient room equipment Product overview incl. data sheet link Benefits Cost - optimization without sacrificing Wi-Fi RF perfor- mance or security Built on market proven wireless IP – maximum interopera- bility Efficient power consumption for Wi-Fi 4 enabled devices Supports concurrent Wi-Fi and Bluetooth connectivity use cases Reduction in development time with Wi-Fi software ena- blement for both RTOS (i.e. ModusToolboxTM) and Linux/ Android designs with multiple hosts supported Rapid time - to - market with partner modules and devel- opment kits integrating AIROC™ CYW43439 with full glob- al certifications, reference platforms, and more Wi-Fi support in Infineon Developer Community with direct access to online applications support engineers Competitive advantage Linux (v4.1 to v5.15), Android (9 &10) and RTOS (MODUS & STM32 Cube) broader coverage Power optimized solution and smaller footprint design for space constrained applications CYW43439KUBGT WLCSP Block diagram
EVAL_IMD700A_FOC_3SH EVAL_IMD700A_FOC_3SH with configurable gate drive, on-board power supplies and protection, is capable of driving up to 300 W motor utilizing sensor-less FOC control. Using MOTIX™ IMD701A, our latest fully programmable motor controller integrating XMC1404 microcontroller with MOTIX™ 6EDL7141 3-phase gate driver IC in one package to enable the development of next generation battery operated products using BLDC or PMSM motors. Product collaterals / Online support Board page Fully integrated BLDC motor drive solution based on the MOTIX™ IMD701A Configurable gate drive, on-board power supplies and protection Integration of XMC1404 and MOTIX™ 6EDL7141 in one package Can operate independently or with Infineon motor control GUI Target applications Motor control & drives Power tools Robotics - production Small home appliances Three phase - 2 Level Three phase control Product overview incl. user manual link Benefits High efficiency Small size Low component count Based on MOTIX™ IMD701A integrated XMC1404 micro- controller and smart MOTIX™ 6EDL7141 3-phase gate driver for BLDC motor drives with 3 x 3 sized OptiMOS™ 6 40 V / 1.5 mOhm power devices Operates up to 300 W with no heatsink required Competitive advantage Very low power consumption Excellent thermal management removes need of expensive heatsink Most compact solution on the market OPN SP Number EVALIMD700AFOC3SHTOBO1 SP005573307 Block diagram
EVAL-IKA15N65ET6 - Evaluation board for motor drive applications up to 1.2 kW The evaluation board EVAL-IKA15N65ET6 is intended to control three-phase motors, plus power factor correction (PFC). The board is equipped with all assembly groups for sensor less field -oriented control (FOC). It includes an EMI filter and soft power- up circuit, an 8-pin iMOTION™ interface connector, the motor controller, a PFC gate drive circuit, an auxiliary power supply, discrete modules, and a three-phase output for connecting the motor. Product collaterals / Online support Board page Power factor correction (PFC) control stage with Rapid
1 IDW30E65D1 and TRENCHSTOP™ 5
IGBT IKWH30N65WR6 in a wide creepage and clearance TO-247 package 3-phase, 2-level inverter with TRENCHSTOP™ IGBT6 IKA15N65ET6 in TO-220FP, 15 A, 650 V Sensor less or hall sensor operation using the TLI4971 IMD112T-6F040 controller for PFC and inverter operation Target applications Corded power tools Home appliances Residential aircon - motor-, system control and monitoring Washer and dryer motor-control - quieter systems Product overview incl. user manual link Competitive advantage Comprehensive solution in through hole devices enables easy plug and play for evaluation purposes OPN SP Number EVALIKA15N65ET6TOBO1 SP005749161 Block diagram Benefits Complete solution for PMSM or brushless DC machines, used e.g. for pumps, fans, washing machines, general pur- poses drives and power tools up to 1.2 kW All devices (PFC & inverter) in through hole standard pack- ages on a common heatsink Lower BOM cost due to a single iMOTION™ controller for PFC and inverter functionally together Improved efficiency of the inverter via hall sensor Evaluation board can be used during the design-in process, for evaluating and measuring characteristic curves, and for checking datasheet specifications.
AURIX™ TC334_LITE kit AURIXTM TC334 lite kit is equipped with a 32-Bit Single-Chip AURIXTM TriCoreTM based-Microcontroller AURIXTM TC334. It can be used with a range of development tools including AURIXTM Development Studio, Infineon’s free of charge Eclipse-based IDE or the Eclipse-based “FreeEntryToolchain” from Hightec / PLS / Infineon. Product collaterals / Online support Board page Most AURIX™ pins available on expansion connectors (X1, X2) Two Infineon Shield2Go connectors Arduino compatible connectors for 3.3 V mikroBUS™ connector Micro-USB connector DAP Debug connector CAN connector RJ45 connecto CAN transceiver TLE9251VSJ from Infineon 1 user push-button, 3 user LEDs Reset push-button Potentiometer (10 kOhm) for variable analog input Target applications Automotive Industrial Product overview incl. user manual link OPN SP Number KITA2GTC334LITETOBO1 SP005626540 Block diagram Benefits Can be used with a range of development tools including Infineon’s free of charge Eclipse based IDE AURIX™ Devel- opment Studio or the Eclipse based “FreeEntryToolchain” from HighTec / PLS / Infineon Is a comprehensive environment, including C-Compiler and Multi-core Debugger, Infineon’s low - level driver (iLLD), with no time and code-size limitations that enables editing, com- piling and debugging application code The FreeEntryToolchain is a full C/C++ development envi- ronment which has a source-level UDE debugger from PLS included and is also based on Infineon low-level driver (iLLD)
REF_WINLIFT_TLE9855 The REF_WINLIFT_TLE9855 is a reference design developed for 2-phase automotive window lift systems. TLE9855QX: This device is a part of the Embedded Power IC family and it is a single chip H-Bridge motor driver, System-on-Chip (SoC) solution. It integrates an industry-standard Arm® Cortex®-M0 core along with LIN transceiver, bridge driver and power supply. IPZ40N04S5-3R1: This component is an OptiMOS™ 5 40 V in S3O8 Package and it combines leading power MOSFET technology with a 3.3 x 3.3 mm leadless power package for very compact and robust automotive system solutions. It is based on Infineon’s latest silicon automotive PowerMOS technology, optimized to meet and exceed the energy efficiency and power density requirements of automotive BLDC and H-bridge applications. In combination with Infineon’s robust S3O8 leadless package technology, it enables very small and efficient system designs with minimal RDS down to 2.8 mΩ. TLE4966G: This is device is an integrated circuit double Hall-effect sensor designed specifically for highly accurate applications in the automotive sector. Precise magnetic switching points and high-temperature stability are achieved by active compensation circuits and chopper techniques on-chip. Product collaterals / Online support Board page Reference for EMC and board size Optimized BOM and PCB size Power capability up to 200W SWD port for debug connection LIN, Panel and monitoring connector High - temperature FR4 PCB, 2 - layer copper Small 90 mm x 55 mm PCB size Target applications Car windows Product overview incl. user manual link OPN SP Number REFWINLIFTTLE9855TOBO1 SP005679693 Benefits Reduced time to market Minimal BOM and reduced PCB size State of the art components Scalability of the device