338RPFS MAXWELL | Alldatasheet

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All data sheets are subject to change without notice (858)503- 3000 Fax:(858) 503-3100 - www.maxwell.com ©2002 Maxwell Technologies Inc.. All rights reserved.

09.12.02 Rev 3

FEATURES:

  • R AD-PAK®Technologyhardenedagainst natural space radiation
  • Total dose hardness >100 Krads (Si), dependent upon orbit
  • Package: -16 Pin RAID-PAK®f l a tp a c k
  • On-resistance, <400 Ohms max
  • Transition time, <500ns
  • On-resistance match, <10 Ohms
  • NO-Off leakage current, <20pA at 25 oC
  • 1.5pC charge injection
  • Single-supply operation (4.5V to 30V) bipolar-supply operation (±4.5V to ±20V)
  • Plug-in upgrade for industry-standard DG508A/DG509A
  • Rail-to-rail signal handling
  • TTL/CMOS-logic compatible DESCRIPTION: Maxwell Technologies’ 338 monolithic, CMOS analog multiplexer features the 338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address, and may be used as either a mux or a demux. On-resistance is 400 ohms max, and the it conducts current equally well in both directions. These muxes feature extremely low off leakages (less than20pAat 25°C),and extremely low on-channel leakages (less than 50pA at 25°C). The new design offers guaran- teedlowchargeinjection(1.5pCtyp)andelec- trostatic discharge (ESD) protection greater than 2000V, per method 3015.7. The 338 operates from a single 4.5V to 30V supply or fromdualsuppliesof±4.5Vto±20V.Allcontrol inputs (whether address or enable) are TTL compatible (0.8V to 2.4V) over the full speci- fied temperature range and over the ±4.5V to ±18V supply range. Capable of surviving space environments, the 338 is ideal for satel- lite, spacecraft, and space probe missions. The patented radiation-hardened RAD-PAK® technology incorporates radiation shielding in the microcircuit package. It eliminates box shielding while providing required lifetime in orbit. This product is available up to Class S packaging and screening. CMOS DECODE LOGIC NO1 NO3 NO4 NO5 NO6 NO7 NO8 NO2 COM A2 A1A0 EN V-V+ GND SEi 338RP EN NO1 NO2 NO3 NO4 COM GND NO5 NO6 NO7 NO8 338 Maxwell

209.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. TABLE 2. 338RP ELECTRICAL CHARACTERISTICS -SINGLE SUPPLY

  1. The algebraic convention where the most negative value is a minimum and the most positive value a

maximum is used in this data sheet.

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©2002 Maxwell Technologies Inc. TABLE 3. ELECTRICAL CHARACTERISTICS -D UAL SUPPLIES

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©2002 Maxwell Technologies Inc.

  1. The algebraic convention where the most negative value is a minimum and the most positive value a

m a x i m u mi su s e di nt h i sd a t as h e e t .

  1. Characterized and not 100% tested.
  2. Leakage parameters are 100% tested at the maximum rated hot temperature and guaranteed at 25oC.
  3. Worst-caseisolation ison channel4 because of itsproximityto the drain pin. Isolation =20logV

where VCOM = output and VNO = input to off switch. TABLE 3. ELECTRICAL CHARACTERISTICS -D UAL SUPPLIES

509.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. FIGURE 1. ON-RESISTANCE VS.V COM (DUAL SUPPLIES) FIGURE 2. ON-RESISTANCE VS.V C O MOVER TEMPERATURE (DUAL SUPPLY)

609.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. FIGURE 3. ON-RESISTANCE VS.V COM OVER TEMPERATURE (SINGLE SUPPLY) FIGURE 4. ON-RESISTANCE VS.V COM OVER TEMPERATURE (SINGLE SUPPLY) FIGURE 5. OFF LEAKAGE VS.T EMPERATURE

709.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. FIGURE 6. ON LEAKAGE VS.T EMPERATURE FIGURE 7. CHARGE INJECTION VS.V COM FIGURE 8. SUPPLY CURRENT VS.T EMPERATURE

809.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. FIGURE 9. TRANSITION TIME VS.P OWER SUPPLIES FIGURE 10. OVER VOLTAGE PROTECTION FIGURE 11. ENABLE SWITCHING TIME

909.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. FIGURE 12. TRANSISTION TIME FIGURE 13. BREAK-BEFORE-MAKE INTERVAL FIGURE 14. CHARGE INJECTION

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©2002 Maxwell Technologies Inc. FIGURE 15. OFF ISOLATION FIGURE 16. CROSSTALK FIGURE 17. NO/COM CAPACITANCE

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©2002 Maxwell Technologies Inc. All rights reserved. 8-CHANNEL MULTIPLEXER338 FIGURE 18.1TRUTH TABLE 1. Logic “0” VAL ≤ 0.8V, Logic “1” VAH ≥2.4V. A2 A1 A0 EN O N SWITCH XXX0N o n e 0001 1 0011 2 0101 3 0111 4 1001 5 1011 6 1101 7 1111 8

1209.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. All rights reserved. 8-CHANNEL MULTIPLEXER338

16 PIN RAD-PAK®F LAT PACKAGE DIAGRAM

Note:All dimensions in inches 16P IN RAD-PAK®F LAT PACKAGE SYMBOL DIMENSION MIN NOM MAX A 0.117 0.130 0.143 b 0.015 0.017 0.019 c 0.004 0.005 0.007 D 0.406 0.415 0.440 E 0.275 0.280 0.285 E1-- -- 0.500 E2 0.150 0.156 0.162 E3 0.030 0.062 -- e 0.050 BSC L 0.325 0.335 0.345 Q 0.020 0.033 0.045 S10.005 0.024 -- N16

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©2002 Maxwell Technologies Inc. All rights reserved. 8-CHANNEL MULTIPLEXER338 Important Notice: These data sheets are created using the chip manufacturers published specifications. Maxwell Technologies verifies functionality by testingkey parameters eitherby 100%testing, sampletest- ing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no responsibility for the use of this information. Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems without express written approval from Maxwell Technologies. Any claim against Maxwell Technologies Inc. must be madewithin90 days from the date of ship- ment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts.

1409.12.02 Rev 3 All data sheets are subject to change without notice

©2002 Maxwell Technologies Inc. All rights reserved. 8-CHANNEL MULTIPLEXER338 ProductOrderingInformation 338RPFX Features OptionDetails ScreeningFlow Package RadiationFeature BaseProduct Nomenclature Monolithic S=M a x w e l lCl a s sS B=M a x w e l lCl a s sB I = Industrial (-55 to 125C) E = Engineering (+25C) Flat Package RP = Rad-Pak® 8-Channel Multiplexer