334-15-T1C1-1VXA EVERLIGHT | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
Features
- Popular T-1 3/4 round package
- High luminous power
- Typical chromaticity coordinates x=0.29, y=0.28 according to CIE1931
- Bulk, available taped on reel.
- ESD-withstand voltage: up to 4KV
- The product itself will remain within RoHS compli ant version
Description
- The series is designed for application required h igh luminous intensity.
- The phosphor filled in the reflector converts the blue emission of InGaN chip to ideal white.
Applications
- Message panels
- Optical Indicators
- Backlighting
- Marker Lights
Materials Emitted Color Resin Color InGaN White Water Clear Absolute Maximum Ratings (Ta=25 )℃℃℃℃ Parameter Symbol Rating Unit Continuous Forward Current I F 30 mA Peak Forward Current (Duty 1/10 @ 1KHZ) I FP 100 mA Reverse Voltage V R 5 V Power Dissipation P d 110 mW Operating Temperature T opr -40 ~ +85 ℃ Storage Temperature T stg -40 ~ +100 ℃ ESD ESD HBM 4K V Zener Reverse Current I z 100 mA Soldering Temperature Tsol 260 ℃ for 5 sec. Electro -Optical Characteristics (Ta=25 )℃℃℃℃ Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF 2.8 ----- 3.6 V I F=20mA Zener Reverse Voltage Vz 5.2 ----- ----- V Iz=5mA Reverse Current IR ----- ----- 50 µA V R=5V Luminous Intensity IV 11250 ---- 22500 mcd I F=20mA Viewing Angle 2θ1/2 ---- 15 ---- deg I F=20mA Chromaticity Coordinates IF =20mA
Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition V 11250 14250 mcd I F =20mA W 14250 18000 X 18000 22500 Note: Tolerance of Luminous Intensity: ±10% Forward Voltage Combination Bin Code Min. Max. Unit Condition 0 2.8 3.0 V I F =20mA 1 3.0 3.2 2 3.2 3.4 3 3.4 3.6 Note: Measurement Uncertainty of Forward Voltage ： ±0.1V Color Combination ( at 20mA) Group Bins
1 A1+A0+B3+B4+B5+B6+C0
X 0.255 0.264 0.28 0.27 Y 0.245 0.267 0.248 0.23 X 0.264 0.283 0.296 0.28 Y 0.267 0.305 0.267 0.248 X 0.283 0.304 0.307 0.287 Y 0.305 0.33 0.315 0.295 X 0.304 0.33 0.33 0.307 Y 0.33 0.36 0.339 0.315 X 0.287 0.307 0.311 0.296 Y 0.295 0.315 0.294 0.276 X 0.307 0.33 0.33 0.311 Y 0.315 0.339 0.318 0.294 X 0.33 0.361 0.355 0.33 Y 0.36 0.385 0.35 0.318 *Measurement uncertainty of the color coordinates ： ±0.01 0.0 0.2 0.4 0.6 0.8 4600K 5600K 7000K 9000K 14000K 22000K B4 CO AO CIE-Y CIE-X
Typical Electro -Optical Characteristics Curves Relative Intensity vs. Wavelength (Ta=25 )℃℃ ℃℃ Directivity (Ta=25 )℃℃ ℃℃ Relative Intensity (a.u.) Radiation Angle Wavelength (nm) Relative Intensity (a.u.) Forward Current vs. Forward Voltage (Ta=25 )℃℃ ℃℃ Relative Intensity vs. Forward Current (Ta=25 ) ℃℃ ℃℃ Forward Current (mA) Relative Intensity(a.u.) 0 5 10 15 20 25 0.0 0.5 1.0 1.5 Forward Voltage (V) Forward Current (mA) Chromaticity Coordinate vs. Forward Current(Ta=25 )℃℃ ℃℃ Forward Current vs. Ambient Temp. Chromaticity Coordinate Forward Current (mA) Forward Current (mA) Ambient Temperature Ta( ℃ ) 350 400 450 500 550 600 650 700 750 800 0.0 0.2 0.4 0.6 0.8 1.0 0 10 20 O O O O O O O O OO 1.0 1.0 0.5 O O O 0.5 Relative Luminusity 0 10 20 30 40 50 0.260 0.270 0.280 0.290 0.300 Relative Intensity(a.u.) Forward Current(mA) x y
Note: 1.All dimensions are in millimeters, and tolerance is 0.25mm except being specified. 2.Lead spacing is measured where the lead emerges from the package. 3.Protruded resin under flange is 1.5mm Max. LED.
E L E C T R O S T A T I C E L E C T R O N A G N E T I C M A G N E T I C O R R A D I O A C T I V E R E L D S a n t i - s t a t i c f o r 7 5 0 Moisture Resistant Packing Materials Label Explanation ‧ CPN: Customer’s Production Number ‧ P/N : Production Number ‧ QTY: Packing Quantity ‧ CAT: Ranks of Luminous Intensity and Forward Voltage ‧ HUE: Color Rank REF: Reference LOT No: Lot Number‧ Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton ■ Packing Quantity 1. Min 200 to Max 500 PCS/1 Bag, 5 Bags/1 Inner Carton 2. 10 Inner Cartons/1 Outside Carton
- Lead Forming /square6 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. /square6 Lead forming should be done before soldering. /square6 Avoid stressing the LED package during leads formi ng. The stress to the base may damage the LED’s characteristics or it may break the LEDs. /square6 Cut the LED leadframes at room temperature. Cuttin g the leadframes at high temperatures may cause failure of the LEDs. /square6 When mounting the LEDs onto a PCB, the PCB holes m ust be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage /square6 The LEDs should be stored at 30° C or less and 70%R H or less after being shipped from Everlight and th e storage life limits are 3 months. If the LEDs are s tored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. /square6 Please avoid rapid transitions in ambient temperat ure, especially, in high humidity environments wher e condensation can occur. 3. Soldering /square6 Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder jo int to epoxy bulb, and soldering beyond the base of the tie bar is recommended. /square6 Recommended soldering conditions: Hand Soldering DIP Soldering Temp. at tip of iron 300 Max. (30W ℃ Max.) Preheat temp. 100 Max. (60 sec ℃ Max.) Soldering time 3 sec Max. Bath temp. & time 260 Max ., 5 sec Max Distance 3mm Min.(From solder joint to epoxy bulb) Distance 3mm Min. (From solder joint to epoxy bulb) Color Group Luminous Intensity Bins Voltage Group
/square6 Recommended soldering profile /square6 Avoiding applying any stress to the lead frame whi le the LEDs are at high temperature particularly wh en soldering. /square6 Dip and hand soldering should not be done more tha n one time /square6 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. /square6 A rapid-rate process is not recommended for coolin g the LEDs down from the peak temperature. /square6 Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs. /square6 Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning /square6 When necessary, cleaning should occur only with is opropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. /square6 Do not clean the LEDs by the ultrasonic. When it i s absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic p ower and the assembled condition. Ultrasonic cleani ng shall be pre-qualified to ensure this will not cause damage to the LED 5. Circuit Protection /square6 Below the zener reference voltage Vz, all the curr ent flows through LED and as the voltage rises to V z, the zener diode “breakdown." If the voltage tries to ri se above Vz current flows through the zener branch to keep the voltage at exactly Vz. /square6 When the LED is connected using serial circuit, if either piece of LED is no light up but current can’t flow through causing others to light down. In new design, the LE D is parallel with zener diode. if either piece of LED is no light up but current can flow through causing others to light up.
- Heat Management /square6 Heat management of LEDs must be taken into conside ration during the design stage of LED application. The current should be de-rated appropriately by referri ng to the de-rating curve found in each product specification. /square6 The temperature surrounding the LED in the applica tion should be controlled. Please refer to the data sheet de-rating curve. 7. ESD (Electrostatic Discharge) /square6 The products are sensitive to static electricity o r surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials /square6 Proper grounding is required for all devices, equi pment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products. /square6 If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers
- Other /square6 Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. /square6 When using this product, please observe the absolu te maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use o f the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. /square6 These specification sheets include materials prote cted under copyright of EVERLIGHT corporation. Plea se don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.