31GF6 GE | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- Plastic package has Underwriters Laboratories Flammability Classification 94V-0
- Glass passivated chip junction
- Low cost
- Ultrafast recovery time for high efficiency
- Low forward voltage, high current capability
- Low leakage
- High surge capability
- High temperature soldering guaranteed: 250°C, 0.375" (9.5mm) lead length for 10 seconds, 5 lbs. (2.3kg) tension Mechanical Data Case: JEDEC DO-201AD molded plastic body over passivated chip Terminals:Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity:Color band denotes cathode end Mounting Position:Any Weight:0.04 oz., 1.1 g 0.210 (5.3) 0.190 (4.8) Dia. 0.052 (1.32) 0.048 (1.22) Dia. 1.0 (25.4) Min. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) Min. DO-201AD Document Number 88530 www.vishay.com 30-Jul-02 1
1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 175 Fig. 1 – Maximum Forward Current Derating Curve Average Forward Rectified Current (A) Lead Temperature (¡C) 0.5 P.C.B. Mounted on 3 x 3" (76.2 x 76.2mm) Copper Pad Areas Reverse Voltage (V) Junction Capacitance (pF) 1 10 100 100 Fig. 5 – Typical Junction Capacitance TJ = 25¡C f = 1.0 MHZ Vsig = 50mVp-p 100 1 100 10 Fig. 2 – Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles at 60HZ Instantaneous Forward Voltage (V) Fig. 3 – Typical Forward Volyage 02 0 6 0 40 100 80 Fig. 4 – Typical Reverse Current Instantaneous Reverse Current (µA) Percent of Peak Reverse Voltage (%) 0.01 0.1 100 Instantaneous Forward Current (A) TJ = 25°C TJ = 100°C TJ = 150°C 0.01 0.001 0.1 100 1,000 2.0 TJ = 25°C TJ = 150°C TJ = 100°C 31GF6 Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves(TA = 25°C unless otherwise noted) www.vishay.com Document Number 88530 2 30-Jul-02