301250014

DRAGSTER AMSOSRAM | Alldatasheet

Document overview

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Technical content

Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved Dragster Datasheet

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12.2 Connector signal assignment for Invar headboard variations

12.3 Connector signal assignment for Invar headboard variations

DR4K7, DR8K7, DR8K3.5, DR16K3.5, DR2x4K7, DR2x8K7

12.4 Connector signal assignment for Invar headboard variant

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 4 / 109 Dragster Line scan sensor

1 General description

Dragster is a platform of digital line-scan sensors. The sensor family is made using three types of basic elements: A single line element from 2K to 8K pixel resolution (7 μm pixel size and pitch), a dual line element from 2K to 8K pixel resolution (7 μm pixel size and pitch) and a single line element from 4K to 16K pixel resolution (3.5 μm (H) x 3.5 μm (V) pixel size). The chip versions with dual line are optionally available with Bayer Pattern RGB filters placed on the sensors. The sensor features a low noise pixel with true CDS and global shutter for interleaved readout and integration operation. Each pixel has an on pixel 13-bit ADC and its gain can be programmed in a range of -6 dB till +20 dB by means of an 8-bit DAC controlled over the serial configuration interface. The readout is made by two 13-bit wide digital taps organized in odd/even order for each 2K segment. For each line segment, 2K (7 μm pixel) or 4K (3.5 μm pixel), all pixels are read out. For sensor versions with 3.5 μm pixel pitch, two 2K segment readout circuits are placed on each side of the pixel line, to lead to a basic segment of 4K pixels, where even pixels are read out over the bottom readout and odd pixels are read out over the top readout. Start and end of integration, as well as optional start of readout, are started upon individual external trigger events. To enhance dynamic range multiple non-destructive readouts are possible.

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1.1 Key benefits & features

The benefits and features of Dragster, Line scan sensor are listed below: Table 1: Dragster benefits and features Benefits Features Differentiators Allows integration in inspection systems and cameras on the basis of the same electronics High resolution, complete family 2K to 16K versions Most complete sensor family on the market. Complete coverage of high resolution & high-speed Monochrome scanning needs Allows inspection speed to increase => higher machine production speed. Line rates up to 80 kHz for all resolutions Competing products offer reduced line rates at higher resolution Easy integration Completely digital sensor Improved camera quality compared to CCD based products COB/Invar package High mechanical stability and planarity of the die. Re-use of the same camera interface across different Dragster variants

1.2 Applications

• Automated Optical Inspection (AOI) in (SMD, PCB, flat panel, web)
• Industrial sorting (e.g. food)

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1.3 Block diagram

The functional blocks of this device are shown below: Figure 1: Dragster block diagram Dragster ADC 13bit 13bit shadow register 13bit readout register 13bit offset register 13b 13b 13b 13bit shadow register 13bit readout register 13bit offset register Readout Control 13b 13b ADC 13bit 13b ADC 13bit 13bit shadow register 13bit readout register 13bit offset register 13b 13b 13b Bias & Reference Generation ADC Control SPI Offset Subtraction 12bit Saturation x4 x4 26b 26b 26b RST_CVC RST_CDS Sample N_RST MCLK Load_Pulse LVAL Bit [00...12] TapA Bit [00...12] TapB End_ADC MISO MOSI N_CS SCLK VDD_Bulk VSS_Bulk VDDA VSSA VDDD VSSD VDDIO VSSIO VDDESD VSSES D Pixel Pixel Pixel CDS Stage CDS Stage CDS Stage S&H S&H S&H

Ordering information

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2 Ordering information

number Q number Ordering code Package Chroma Delivery quantity (pcs/tray)

301740016 Q65114A3364 DR2K7_Invar_B&W_BM_v6 Invar Mono 4

301740011 Q65114A3362 DR2K7_LCC_B&W_BM_Ceramic_v1.0 Ceramic Mono 12 301110006 Q65114A3337 DR2x2K7_LCC_B&W_Ceramic_v1.0 Ceramic Mono 12 301720007 Q65114A3358 DR2x2K7_LCC_RGB_Ceramic_v1.0 Ceramic Color 12

301110008 Q65114A3338 DR2x2K7_Invar_B&W_v6 Invar Mono 4

301720008 Q65114A3359 DR2x2K7_Invar_RGB_v6 Invar Color 4

301090010 Q65114A3335 DR4K3.5_Invar_B&W_v6 Invar Mono 4 301090009 Q65114A3334 DR4K3.5_LCC_B&W_Ceramic_v1.0 Ceramic Mono 12

301020013 Q65114A3330 DR4K7_Invar_B&W_BM_v5 Invar Mono 4

301030008 Q65114A3331 DR2x4K7_Invar_B&W_v6 Invar Mono 4

301040008 Q65114A3332 DR2x4K7_Invar_RGB_v6 Invar Color 4

301240011 Q65114A3352 DR6K7_BM_v2 Invar Mono 2

301250014 Q65114A3356 DR8K3.5_Invar_B&W_BM_v6 Invar Mono 4

301750005 Q65114A3365 DR8K7_Invar_B&W_BM_v6 Invar Mono 2

301120005 Q65114A3339 DR2x8K7_Invar_B&W_v5 Invar Mono 2

301730005 Q65114A3360 DR2x8K7_Invar_RGB_v5 Invar Color 2

301100006 Q65114A3336 DR16K3.5_Invar_B&W_v6 Invar Mono 2 Figure 2: Ordering code Product Family Resolution Pixel Pitch Package Chroma Mask Product Version DR - Dragster Single Line zK z = 2, 4, 6, 8, 16 Dual line 2xzK z = 2, 4, 8 7 um 3.5 um Invar Ceramic/LCC * If not specified is Invar B&W / Monochrome RGB / Color * If not specified is B&W BM - When applicable, uses a black mask coating Version of the final product D R 8 K 7 _ I N V A R _ B & W _ B M _ V 6

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3 Pin assignment

3.1 Pin diagram

The available packages are organized into two main types: LCC Ceramic and INVAR. The LCC is a no lead package where the silicon's carrier is ceramic while the INVAR package uses a special nickel-iron alloy as heat dissipation and mechanical reference. While the LCC Ceramic package is oriented for size, resolution and cost conscious applications, the INVAR type is focused on high performance and robustness, where highest speed and high resolutions are the main advantages to the field application. All package types take a cover glass (anti-reflective coating) over sensor's silicon to protect from external dust particles. For the customer, one of the most obvious advantages of Dragster packages is the use of commercially available INVAR connectors or low cost LCC Ceramic connections. This makes each camera development fast, easy and also brings other advantages: precise mechanical alignment to the optics by taking INVAR as reference and its CNC machined features, integrated heat dissipation plate that minimizes sensor stress in z-axis, maximization of sensor performance in speed and noise and customizable package to suit any requirement. The LCC Ceramic can also be mounted as a SMD part. Dragster INVAR modules have up to four Molex connectors with 120-pin and reference 5010171203. On the camera side the matching part is 546841204. Figure 3: Pin numbering of DR16K3.5 and DR2x8K7 (back view) Connector 4 Connector 2 Connector 3 Connector 1 120 120 120 120 60 60 60 11 1 1 61 61 6161

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 10 / 109 The below table indicates which connectors are present for the different sensors versions. Table 2: Connector usage per sensor Sensor Present connectors Connector reference Mating part DR2K7_LCC_Ceramic Not applied DR2x2K7_LCC_Ceramic DR4K3.5_LCC_Ceramic DR4K7_Invar Connector 1 Molex 501017 1203 Molex 546841204 DR2K7-Invar(1) Connectors 1 & 2 DR2x2K7-Invar DR4K3.5-Invar DR2x4K7-Invar DR6K7-Invar DR8K3.5-Invar DR8K7-Invar Connectors 1 & 3 DR2x8K7-Invar Connectors 1 - 4 DR16K3.5-Invar (1) For DR2K7_Invar, connector 2 is present but not required. Only the powers present on the connector are routed to the sensor. Connector 2 can be left completely unconnected for DR2K7_Invar. A package overview for all sensor versions is shown in the below table. Table 3: Package overview Part number Ordering code Top view Bottom view

301740016 DR2K7_Invar_B&W_BM_v6

301740011 DR2K7_LCC_B&W_BM_Ceramic_v1.0

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 11 / 109 Part number Ordering code Top view Bottom view 301110006 DR2x2K7_LCC_B&W_Ceramic_v1.0 301720007 DR2x2K7_LCC_RGB_Ceramic_v1.0

301110008 DR2x2K7_Invar_B&W_v6

301720008 DR2x2K7_Invar_RGB_v6

301090010 DR4K3.5_Invar_B&W_v6 301090009 DR4K3.5_LCC_B&W_Ceramic_v1.0

301020013 DR4K7_Invar_B&W_BM_v5

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301030008 DR2x4K7_Invar_B&W_v6

301040008 DR2x4K7_Invar_RGB_v6

301240011 DR6K7_BM_v2

301250014 DR8K3.5_Invar_B&W_BM_v6 Connector 1 Connector 2

301750005 DR8K7_Invar_B&W_BM_v6

301120005 DR2x8K7_Invar_B&W_v5

301730005 DR2x8K7_Invar_RGB_v5

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 13 / 109 Part number Ordering code Top view Bottom view 301100006 DR16K3.5_Invar_B&W_v6 The table below exemplifies which sensor versions have a common headboard and footprint. Table 4: Sensor shared headboard and footprint Package Sensor Same headboard Invar DR2K7, DR2x2K7, DR4K3.5 DR2x4K7, DR8K3.5 DR2x8K7, DR16K3.5 Same footprint & pinout LCC_Ceramic DR2K7, DR2x2K7, DR4K3.5

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4 Absolute maximum ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 5: Absolute maximum ratings of Dragster Symbol Parameter Min Max Unit Comments Electrical parameters VDDD Supply voltage to ground -0.3 3.6 V VDDA Supply voltage to ground -0.3 3.6 V VIO Input/ output pin voltage to digital inputs -0.3 VDDIO + 0.3 or 3.6 V IIO Input/ output DC forward bias current -24 (source) + 24 (sink) mA VIN Input pin voltage to ground 3.6 V Temperature ranges TA Operating temperature range(1) 0 60 °C RTH, JC Junction to case thermal resistance(2) 0.36 °C/W TJ Operating junction temperature(3) -55 125 °C Storage condition TSTRG Storage temperature range -30 40 °C RHNC_STRG Long term storage humidity 30 60 % Shelf life Years Invar package Ceramic LCC package MSL Moisture sensitivity level 6 Bake out before soldering 24hrs @ 125ºC, ±5ºC Bump temperature (soldering) (4) TPEAK Peak temperature 245 °C Refer to chapter 11 tWELL Well time above 217 °C 60 80 s Refer to chapter 11 (1) The operating temperature range is regarding the ambient temperature that is more suitable for a good performance of the sensor. It is considered with no heat dissipation, since it is the environment temperature. (2) Determined to DR16K3.5 Invar packaging, and calculated from the die to the bottom of the Invar plate. Relevant if a heat dissipater is attached to the Invar. (3) Operating the silicon within this temperature range is manageable, though it does not ensure consistent device performance. It is worth noticing that prolonged exposure to such extreme temperature is not recommended. (4) Relative to the ceramic LCC package.

Electrical characteristics

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5 Electrical characteristics

All limits are guaranteed. The parameters with Min and Max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Table 6: Electrical characteristics of Dragster Symbol Parameter Conditions Min Typ Max Unit VDDA Analogue power supply 3.2 3.3 3.4 V VnrmsVDDA RMS noise on VDDA 5 mV VnppVDDA Peak to peak noise on VDDA 20 mV VDDD Power supply voltage 3.2 3.3 3.4 V VnrmsVDDD RMS noise on VDDD 20 mV VnppVDDD Peak to peak noise on VDDD 100 mV VDDIO Power supply voltage on IO’s 2.4(1) 3.3 3.4 V VnrmsVDDIO RMS noise on VDDIO 20 mV VnppVDDIO Peak to peak noise on VDDIO 100 mV VDDESD Power supply voltage ESD 3.2 3.3 3.4 V VSSA Ground for analogue power supply 0 V VSSD Ground for digital power supply 0 V VSSIO Ground for IO power supply 0 V Duty Cycle Input clock duty cycle Up to 50 MHz 45 55 70 % Duty Cycle Input clock duty cycle Up to >50 MHz 55 57 65 % Jitter Clock Input clock jitter < 5% TCLK % TCLK CLoad Load capacitance on digital IO’s 10 pF Input Clock Frequency 1(2) 85(3) MHz Characteristics for CMOS-LVTTL outputs VOL Low level output voltage 0.5 V VOH High level output voltage VDDIO-0.6 V Tslew, rising (4) Output slew rate of rising edge 5 ns Tslew, falling (4) Output slew rate of falling edge 5 ns

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 16 / 109 Symbol Parameter Conditions Min Typ Max Unit Characteristics for CMOS-LVTTL inputs VIL Low level input voltage -0.3 0 0.4 V VIH High level input Voltage 0.8 x VDDIO VDDIO VDDIO+0.3 V IIL Low level input leakage VI = 0 ±1 µA IIH High level input leakage VI = VDDIO ±1 µA Tslew, rising Input slew rate of rising edge 2.5 ns Tslew, falling Input slew rate of falling edge 2.5 ns TSetup, Data In Setup time for digital input signals relative to rising edge of MCLK @ MCLK pin 3 ns THold, Data In Hold time for digital input signals relative to rising edge of MCLK @ MCLK pin 3 ns TSetup, Control Signals Setup time for control signals relative to rising edge of MCLK 1 ns THold, Control Signals Hold time for control signals relative to rising edge of MCLK 6 ns TSetup, MOSI Setup time for MOSI input signals relative to rising edge of SCLK 3 ns THold, MOSI Hold time for MOSI input signals relative to rising edge of SCLK 5 ns Power consumption(5) PTotal Power consumption per 2K segment 500 mW IVDDA Current to analogue devices per 2K segment 70 mA IVDDD Current to Digital devices per 2K segment 35 mA IVDDIO Current for IO per 2K segment 40 mA (1) VDDIO < 3.0 V is not recommended for pixel clock speeds above 40 MHz and may not meet the slew rate specifications in all cases. As LCC Ceramic package has, VDDD/VDDIO/VDDESD wired internally, this situation is not applicable. (2) The input clock frequency can be lower than 1 MHz. However, the ADC conversion accuracy might be reduced. (3) The ADC can be clocked with up to 100MHz for faster conversion when using clock reduction for readout. (4) The output swing on signal pixel clock, if enabled, may be smaller at pixel clock rates above 60 MHz. (5) Typical values.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 17 / 109 Table 7: Typical power consumption for Dragster(1) Sensor IVDDIO (mA) IVDDA (mA) IVDDD (mA) PTotal (mW)(1) DR2K7 40 70 35 500 DR2x2K7 80 140 70 975 DR4K3.5 80 140 70 975 DR4K7 80 140 70 975 DR6K7 120 210 105 1450 DR2x4K7 160 280 140 1925 DR8K7 160 280 140 1925 DR8K3.5 160 280 140 1925 DR2x8K7 320 560 280 3850 DR16K3.5 320 560 280 3850 (1) VDDD = VDDA = VDDIO = 3.3 V, MCLK = 80 MHz.

Typical operating characteristics Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 18 / 109

6 Typical operating characteristics

6.1 Electro-optical characteristics

Table 8: Characteristics of Dragster sensor Parameter Value Remark Pixel type Global shutter Low noise pixel with true CDS Shutter type Pipelined global shutter Exposure of next image during readout of the previous image Fill factor 100% ADC programmable gain -6dB to 20dB in 256 steps ADC resolution 12-bit Exposure time range Minimal 2 µs Down time for integration Minimal 2 µs + 7 MCLK pulses Depends on the MCLK frequency Data output Tap Parallel/LVCMOS TTL Trigger delay 1 µs Integration & readout Interleaved or Sequential Sensor planarity 30 µm Invar packaging 50 µm Ceramic LCC packaging Cover glass AR-coated Table 9: Sensor characteristics of Dragster 7µm Parameter Value Remark Pixel size 7 x 7 µm2 Pixel pitch x 7 µm Distance from the center of a pixel to the center of the adjacent pixel (horizontal axis) Pixel pitch y 7 µm Distance from the center of a pixel to the center of the adjacent pixel (vertical axis) Number of special pixels in the most left segment 32 pixels Single line – 2K7 2x32 pixels Dual line – 2x2K7 Maximum line rate 80 kLines/s 2K7 80 kLines/s 2x2K7 – 2:1 TDI Mode 160 kLines/s 2x2K7 – Dual Line Mode Number of output taps 2 per 2K Segment 4 per 2x2K Segment

Typical operating characteristics Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 19 / 109 Parameter Value Remark Configuration interface Serial 4 Line

1 SPI Interface per 2K Segment

2 SPI Interfaces per 2x2K7 Segment

Integration control(1) Asynchronous With 6 Digital Signals (MCLK, RST_CVC, RST_CDS, Sample, Load_Pulse, N_Reset) (1) On the dual line sensor version, each line can be triggered individually. Table 10: Sensor characteristics of Dragster 3.5µm Parameter Value Remark Pixel size 3.5 x 3.5 µm2 Pixel pitch x 3.5 µm Distance from the center of a pixel to the center of the adjacent pixel (horizontal axis) Pixel pitch y 7 µm Distance from the center of a pixel to the center of the adjacent pixel (vertical axis) Number of special pixels in the most left segment 64 pixels Maximum line rate 80 kLines/s Number of output taps 4 per 4K pixels segment Configuration interface Serial 4 Line 2 Interfaces for each 4K Pixel Segment Integration control Asynchronous With 6 Digital Signals (MCLK, RST_CVC, RST_CDS, Sample, Load_Pulse, N_Reset)

Typical operating characteristics Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 20 / 109 Table 11: Electro-optical parameter of Dragster 7µm, and 3.5µm, mono version Parameter 7µm 3.5µm Remark QE @ 600 nm 60% 60% Full well capacity(1) 46ke- 23ke- Total system gain 0.076DN/e- 0.152DN/e- CDS Unit Gain Responsivity(2)(3) 77DN/nJ/cm2 38.5DN/nJ/cm2 CDS Unit Gain @ 12-bit 308DN/nJ/cm2 154DN/nJ/cm2 CDS Gain 4x @ 12-bit Dynamic range 66.4dB 60.4dB SNR 47dB 44dB Temporal dark noise(4)(5) 1.7DN 3.3DN CDS Unit Gain 22e- 22e- Dark current 3 e-/ms 3 e-/ms @ 27 °C DSNUrms (2)(6)(7) 4DN 4DN PRNUrms Non linearity(8) 2% 2% Image lag 0% 0% Crosstalk 2% 2% Optical & electrical (1) At Unity Gain (CDSGain = 0 -> x1, Inverse ADC Gain = 0x20H, End Counter 128 –> 4096 ADC levels). (2) Tint = 10 µs, Unity Gain (CDSGain = 0 -> x1, Inverse ADC Gain = 0x20H). (3) T= 27 °C, Tint = 20 µs, Unity Gain (CDSGain = 1 -> x4, Inverse ADC Gain = 0x20H). (4) T= 27 °C, Tint = 20 µs, Unity Gain (CDSGain = 0 -> x1, Inverse ADC Gain = 0x20H). (5) Temporal noise can further be reduced by subtracting from each line the average value of the dark reference pixels, which will reduce temporal noise components coupled over the supply at frequencies below the line rate. (6) Ramp offset and ramp gain must be adjusted for all segments to match with each other. (7) Per each 2K7µm and 4K3.5µm segment. (8) Measured in % deviation from full scale signal for the signal range of 5% - 95%, according to EMVA1288 proposal for linearity measurement.

Typical operating characteristics Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 21 / 109

6.2 Spectral characteristics

Figure 6: Dragster QE(1) (1) RGB spectral response extrapolated by supplier color filter transmittance data. 400 500 600 700 800 900 1000 QE [%] Wavelength [nm] Blue Green Red Mono

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7 Functional description

7.1 General sensor description

The Dragster family has 17 variants, which each one them has one or two lines, from one up to four segments, different pixel size, color, package and resolution. Table 12: Dragster variants Sensor variant # of lines Pixel size (µm) Chroma Resolution Package DR2K7 1 7x7 Mono 2080x1 INVAR/LCC DR2x2K7 2 7x7 Mono/RGB 2080x2 INVAR/LCC DR4K7 1 7x7 Mono 4128x1 INVAR DR4K3.5 1 3.5x3.5 Mono 4160x1 INVAR/LCC DR2x4K7 2 7x7 Mono/RGB 4128x2 INVAR DR6K7 1 7x7 Mono 6176x1 INVAR DR8K7 1 7x7 Mono 8224x1 INVAR DR8K3.5 1 3.5x3.5 Mono 8256x1 INVAR DR2x8K7 2 7x7 Mono/RGB 8224x2 INVAR DR16K3.5 1 3.5x3.5 Mono 16448x1 INVAR Sensors with 3.5 μm pixels are structurally identical to sensors with 7 μm pixel. However, for the sensor with 3.5 μm, two independent readout blocks are placed, one on top of the sensor line, which reads out odd pixels and one at the bottom of the sensor line which reads out even pixels. Thus, for sensors with 3.5 μm pixel, two independent segments are always placed together to form a segment with double resolution compared to the segment with 7 μm pixel. The lowest and maximum resolutions for 7 μm pixel are 2K and 2x8K, respectively. Regarding 3.5 μm pixel, the lowest and maximum resolutions are 4K and 16K, respectively. The first line of the first 2K segment (7 µm) is built of a line of 2080 pixels, having 32 special pixels counting from the left. Similarly, the first 4K segment (3.5 µm) is built of a line of 4160 pixels with 64 special pixels in the beginning. The first 32 (or 64) pixels are used to have a reference for dark current and signal offsets. The remaining 2048 (or 4096) pixels are the light sensitive, responsible for the image effective resolution.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 23 / 109 For sensors with multiple segments, the added 2K (7 μm) and 4K (3.5 µm) segments have only 2048 or 4096 sensitive pixels, respectively. Regarding readout, these segments are completely independent. This can be exploited to align the readout of the light sensitive pixels from each segment. To do so, the readout is started in the most left segment 16 pixel clock cycles earlier than the segments farther to the right. The individual start of readout for different segments can also be exploited to reduce the required signal bandwidth by sequentially addressing the SRAM blocks of different 2K/4K segments and multiplexing the data lines. The sensor features a 13-bit ramp ADC1 with programmable conversion gain and end of range stage. The on chip digital control circuit generates all necessary control for conversion and the readout modes. However, the readout of a new line can be triggered over an external signal if required. The ADC conversion range (maximum number of bits) can be programmed over the serial interface. Higher conversion range requires longer ADC conversion time.

7.1.1 Placement of pixels

7.1.1.1 DR-XK-7

Figure 7: Placement of pixels sensors with 7 µm pixel pitch (DR8K7) The first 32 pixels include not only dark pixels but also special pixels like described:

• The output from the first pixel is directly connected to the pad 1.2
• The output from the second pixel is directly connected to the pad 21.2
• The third pixel is a black pixel, electrically fixed to ADC low saturation.
• The fourth pixel is a white pixel, electrically fixed to ADC high saturation. 1 It is recommended to only use 12-bit ADC resolution, making use of “Enable Saturation” feature (register CONTROL 1 (0x01), bit 5). For more details, check Section 9.1.1. 2 These pixels are light sensitive. The respective outputs are connected to a test point on the headboard for debugging purpose in certain package variations. 7 µmSpecial Pixels Active Pixels

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• The pixels 5 - 24 are normal pixels however, the photo diode is covered by a metal light shield. They serve as a dark reference. However, at longer wavelengths the metal shield will not completely shield light anymore.
• The pixels 25 - 32 are electrical black pixels. In these pixels the photo diode is disconnected electrically from the readout chain. These pixels will follow all analogue and digital offset variations, however not integrate dark current or any photo current. They can be used check the validity of the dark pixels 5 - 24, or to compensate for line by line ADC offset variations. 7.1.1.2 DR-XK-3.5 Figure 8: Placement of pixels sensors with 3.5 µm pixel pitch (DR16K3.5) The first 64 pixels include not only dark pixels but also special pixels like described:
• The output from the first & second pixels are directly connected to the pad 1 of the most left segments on top and bottom.3
• The output from the third and fourth pixels are directly connected to the pad 2 of the most left segments on top and bottom.2
• The fifth and sixth pixels are a black pixel, electrically fixed to ADC low saturation.
• The seventh and eight pixels are white pixel, electrically fixed to ADC high saturation.
• The pixels 9 - 48 are normal pixels however, the photo diode is covered by a metal light shield. They serve as a dark reference. However, at longer wavelengths the metal shield will not completely shield light any more.
• The pixels 49 - 64 are electrical black pixels. In these pixels the photo diode is disconnected electrically from the readout chain. These pixels will follow all analogue and digital offset variations, however, not integrate dark current or any photo current. They can be used to check the validity of the dark pixels 9 - 48, or to compensate for line-by-line ADC offset variations. 3 These pixels are light sensitive. The respective outputs are connected to a test point on the headboard for debugging purpose in certain package variations. 3.5 µm 3.5 µm Special Pixels Active Pixels

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7.1.2 Color filter arrangement for RGB Dragster versions

On the dual line Dragster there is a possibility to have RGB filters that are organized in both lines as shown in the Figure 9. Figure 9: Color filter arrangement on Dragster dual line (DR2x8K7)

7.2 Description dragster pixel

The Dragster line scan sensors features a pixel which provides true CDS capability for elimination of reset noise. Other features include programmable analogue gain, anti-blooming and anti-corona circuits that can be activated by register configuration. Each pixel features a programmable 12-bit ADC and memory. Pixels integration, A/D conversion and line readout can be made fully pipelined so that line rate is limited by the longest operation and not by the sum of all three. An overview of the most important blocks of the analogue part and their functionality as well as the register bits which control the features are described below. 7 µm 7 µm Upper Line Lower Line Special Pixels Active Pixels

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 26 / 109 Figure 10: Overview of the functional blocks for the analogue part of the pixel

7.2.1 Anti-blooming circuitry

“Blooming” is a phenomenon observed when a single pixel is heavily over exposed and saturates. Photo generated charges then tend to spill in neighboring pixels. This is prevented by an internal circuit, which will drain charges when the pixel is saturated and prevent them from spilling into neighboring pixels. This circuit is controlled by register 0x02 bit '3'. This bit should be set to ‘0’ for most applications, as it grants the largest linear signal range. Under extreme over exposure conditions, this bit can be set to ’1’, which will start draining excessive charges earlier. RST_CVC Pixel Internal Bias Generation Controled by Register 2, Bit 3 Anti Blooming CDS Stage Gain x1, x4 Register 2, Bit 5 Internal Bias Generation Controled by Register 2, Bit 1 RST_CDS Test Mux Anti Corona Detection Sample & Hold Sample ADC VRef White Clamping Register 2, Bit 4 Internal Bias Generation Controled by Register 1, Bit 7 VThr

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7.2.2 Anti-corona circuitry

“Corona effect” is a phenomenon sometimes observed under heavy over exposure condition when the most exposed pixels start to become dark again instead of white. This condition can be detected by a special circuitry and saturated pixels are then clamped to the white reference value before A/D conversion. This circuitry can be enabled or bypassed by means of register 0x01 bit '7'. The bit set to ‘0’ will disable the anti-corona circuitry and bypass the signal, while ’1’ will enable it.

7.2.3 Analogue gain

The pixel features a programmable analogue gain of factor x4 at CDS stage level. This gain is controlled by register 0x02 bit '5'. The bit set to ‘0’ unity gain is set and ’1’ sets the gain to x4.

7.2.4 CDS reference generation

The reference voltage for all CDS stages is generated in parallel by the internal bias generation block. The power consumption of the driver to this voltage can be regulated by means of register 0x02 bit '1'. A value of ‘1’ will use an adaptive bias scheme to the buffer for this voltage, which will reduce power consumption when this driver is not used (recommended). A ‘0’ will choose a fixed bias value, which will result in a higher overall consumption. The reference voltage of the CDS stage is sampled at start of integration for each line, and thus influences the finally digitized analogue value. Any noise on this signal also influences the final signal value as noise will be added equally to all pixels in the line. For ultimate noise performance, it is advised to compute the average of the first dark pixels 16th to 20th and subtract this value from the finally read out pixels for each line. This computation has to be done off chip, but will lead to better noise performance than the one specified.

7.2.5 Analogue voltage references

The analogue voltage references, especially the references to define the ADC start voltage and the ADC gain are interconnected along the sensor line, however, remain individual for odd an even pixels in the case of 3.5 μm pixels sensors. Each segment comprises an individual SPI block to configure these voltages. Normally, it is recommended to program the registers controlling an interconnected voltage with the same settings. The figures below illustrate how analogue voltages are interconnected over multiple segments and controlled over the respective SPI interfaces for sensors with 7 μm and 3.5 μm pixel pitch respectively.

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7.3 Startup sequence

To avoid latch up problems that can create faulty operation points, the correct sequential power on sequence for all devices in INVAR headboard package is: 1. VDDESD 2. VDDA 3. VDD_BULK 4. VDDD 5. VDDIO 6. Ramp up signals on any inputs 7. Release N_RESET_# If the control overall supplies is not possible, at least care must be taken for the sensor supplies to raise up in the following order: 1. VDDESD 2. VDD_BULK, VDDA, VDDD, VDDIO 3. Ramp up signals on any inputs 4. Release N_RESET_# For the LCC Ceramic package versions, it is important that VDD ramps prior to any digital input signal. The Power Off sequence is the inverse order of Power On, for above both situations. Information:

• Fault A: Any VDDx is supplied before VDDESD or to a higher value than VDDESD.
• Fault B: Digital inputs are supplied prior to supply of VDDESD

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7.4 Conversion cycle

7.4.1 General description

The A/D conversion happens when END_ADC signal is at low state. As soon as sampling stage ends (falling edge of SAMPLE) the END_ADC signal leaves reset state and the sensor starts the A/D conversion. Each pixel features a multi stage ADC, which minimizes the offset and gain error between individual pixels and segments. The physical block diagram of the ADC and a description of the main functional modes, are given in Figure 13. For a high resolution, low noise ADC functionality, the ADC is made such that the critical analogue blocks can run at relatively low speed.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 31 / 109 Figure 13: Functional block diagram of the pixel level ADC The ADC features two modes of operation: Linear A/D conversion and Companding A/D conversion. Sample & Hold PGA ADC Mode Register 1, Bit 6 ADC Thresholds Register 6, 7, 8 ADC End of Range Register 9 Write Offset Register 2, Bit 2 13 bit readout register 13 bit offset register Second Level ADC Up to 13 bit digital Range Detector

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7.4.2 ADC linear mode

On linear conversion the ADC will require as many clock cycles as the register programmed ADC end of range. Figure 14 shows a diagram of the ADC linear response function and the effect of the different registers on the transfer function. Information: It is important to program the end of range according to the pixel data bit width. If digital saturation logic is not enabled in the register 0x01 bit '5', ADC end of range is above 4095 DN and only 12 LSBs are read out, this can create signal “wrap around” artefacts when the pixel value is over 4095 DN. In order to reduce the ADC conversion time, comparing to readout time and keep the ADC in linear mode, the conversion can be operated at a higher clock frequency than the remaining circuitry. This is done by directly supplying the higher clock frequency to the chip main clock and programming the internal clock divider (register 0x01 bits 1 and 2) such that the clock frequency in chip's readout remains below 50 MHz. Figure 14: ADC transfer function in linear mode and registers defining the ADC parameters When in linear mode conversion time (CT) is obtained by the Equation below: Equation 1: 𝐶𝑇 = 𝐸𝑛𝑑 𝑜𝑓 𝑅𝑎𝑛𝑔𝑒 𝑅𝑒𝑔𝑖𝑠𝑡𝑒𝑟 × 32 × 1 𝑀𝐶𝐿𝐾 DN ADC End Range Register 9 ADC Step Register 3 ADC Black Level Register 4 Analogue Voltage Range

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7.4.3 ADC companding mode

An alternative to running the ADC at higher clock rate is to use the ADC companding mode. As for an optical signal, the photon shot noise increases with signal level, a very small quantization step is only required at the very low signal values. For higher impinging optical signals, the ADC quantization step can be increased such as to match the shot noise present in the light signal. This may significantly reduce the total ADC time required to generate a 12- bit value, while no information is lost. Figure 15 and Figure 16 illustrates the companding ADC mode and the registers involved in programming it is response function. Figure 15: ADC transfer function in companding mode DN V ADC End Range ADC Step ADC Black Level ADC Threshold 3 ADC Threshold 2 ADC Threshold 1 Analogue Voltage Range

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 34 / 109 Figure 16: Adaptation of the ADC conversion step in companding ADC mode ADC Black Level Register 4 ADC Step Register 3 ADC Slope Threshold 1 Register 6 ADC Slope Threshold 2 Register 7 ADC Slope Threshold 3 Register 8 ADC End Range Register 9 Black White Analogue Signal Level

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 35 / 109 When using companding ADC mode, to reduce conversion time it is possible to still produce a linear sensor output by enabling on chip digital re-linearization circuitry (register 0x05 bit '1'). When using on chip re-linearization, the histogram will show missing codes in the range where the ADC was working in companding mode, that can be corrected by enabling on chip dithering (register 0x01 bit '3'). When in companding mode conversion time (CT) is obtained by the Equation 2: Equation 2: 𝐶𝑇 = [𝑇ℎ1 + 𝑇ℎ2 − 𝑇ℎ1 2 + 𝑇ℎ3 − 𝑇ℎ2 4 + 𝐸𝑛𝑑𝑅𝑎𝑛𝑔𝑒 − 𝑇ℎ3 8 ] × 32 × 1 𝑀𝐶𝐿𝐾 Information: When using the ADC in companding mode, it is important to program the three thresholds strictly monotonously increasing, and smaller than the end of range value. Otherwise, the ADC will not function correctly and produce strongly distorted output signals.

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7.5 Readout cycle

As the pixel level ADC signal is stored in an SRAM bench (LOAD_PULSE rising edge), the digital readout is triggered by LOAD_PULSE falling edge. LOAD_PULSE signal can either be provided externally or be generated internally (register 0x02 bit '0'). This signal must be sent after the end of A/D conversion (rising edge of END_ADC), at the earliest possible time, based on the state of the integration time controlling signals (RST_CVC; RST_CDS, SAMPLE) and the programmed ADC end range. The readout is started from the most left pixel to the right. An LVAL signal is generated to indicate valid pixel data. Each Dragster variant has a specific number of outputs (taps). Table 13: Dragster outputs per variant Sensor variant # Lines # Outputs Outputs Connectors DR2K7 1 2 A1, B1 1 DR2x2K7 2 4 A1, B1, C1, D1 1 & 2 DR4K7 1 4 A1, A2, B1, B2 1 DR4K3.5 1 4 A1, B1, C1, D1 1 & 2 DR2x4K7 2 8 A1, A2, B1, B2, C1, C2, D1, D2 1 & 2 DR6K7 1 6 A1, A2, B1, B2, E1, F1 1 & 2 DR8K7 1 8 A1, A2, B1, B2, E1, E2, F1, F2 1 & 3 DR8K3.5 1 8 A1, A2, B1, B2, C1, C2, D1, D2 1 & 2 DR2x8K7 2 16 A1, A2, B1, B2, C1, C2, D1, D2, E1, E2, F1, F2, G1, G2, H1, H2 1 - 4 DR16K3.5 1 16 A1, A2, B1, B2, C1, C2, D1, D2, E1, E2, F1, F2, G1, G2, H1, H2 1 - 4

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7.5.1 Tap organization DR2K7, DR4K7, DR8K7

Figure 17: Tap organization DR2K7, DR4K7, DR8K7

7.5.2 Tap organization DR6K7

Figure 18: Tap organization DR6K7 Information: For the DR6K7, all data taps are 12-bit and not 13-bit like on all other remaining variants. ... 8223 82248222 Tap A1 2K7 4K7 8K7 Tap B1 4131 Tap A2 Tap B2 6174 6175 6176 Tap E1 Tap F1 Tap E2 Tap F2 Bottom, Connector 1 Bottom, Connector 3 Tap B1 Tap A2 Tap B2 Tap E1 Tap F1Tap A1 Bottom, Connector 1 Top, Connector 2

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 38 / 109 Figure 19: Tap organization DR4K3.5, DR8K3.5, DR16K3.5

7.5.4 Tap organization DR2x2K7, DR2x4K7, DR2x8K7

Figure 20: Tap organization DR2x2K7, DR2x4K7, DR2x8K7 Tap A1 Tap B1 Tap A2 Tap B2 Tap E1 Tap F1 Tap C1 Tap D1 Tap C2 Tap D2 Tap G1 Tap G2 Tap H2 Tap E2 Tap F2 Tap H1 4K3.5 8K3.5 16K3.5 Top, Connector 2 Top, Connector 4 Bottom, Connector 1 Bottom, Connector 3 ... 8222 8223 8224 ... 8222 8223 8224 Tap A1 Tap B1 4131 Tap A2 Tap B2 6174 6175 6176 Tap E1 Tap F1 Tap E2 Tap F2 Bottom, Connector 1 Bottom, Connector 3 Tap C1 Tap D1 Tap C2 Tap D2 Tap G1 Tap H1 Tap G2 Tap H2 2x2K7 2x4K7 2x8K7 Top, Connector 2 Top, Connector 4

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7.5.5 Tap organization DR2x2K7_RGB, DR2x4K7_RGB, DR2x8K7_RGB

Figure 21: Tap organization DR2x2K7_RGB, DR2x4K7_RGB, DR2x8K7_RGB

7.6 Timings

For proper sensor operation, the digital control signals must set with correct timings. This section shows the recommended Dragster timings.

7.6.1 Timing diagram considerations

When stated a value in time (usually ns or µs), this is a fixed or minimum value.

7.6.2 Dragster interleaved integration timing

The sensor enables interleaved integration, A/D conversion and readout, where the next integration is performed after the previous one, during A/D conversion and Readout. Therefore, the overall pipeline delay is two minimum line times. ... 8222 8223 8224 ... 8222 8223 8224 Tap A1 Tap B1 4131 Tap A2 Tap B2 6174 6175 6176 Tap E1 Tap F1 Tap E2 Tap F2 Bottom, Connector 1 Bottom, Connector 3 Tap C1 Tap D1 Tap C2 Tap D2 Tap G1 Tap H1 Tap G2 Tap H2 2x2K7 2x4K7 2x8K7 Top, Connector 2 Top, Connector 4

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 41 / 109 SAMPLE Signal Timing:

• SAMPLE rising edge must follow below rules: – Occur at least 1 µs after RST_CDS falling edge. – Occur at least 1 clock cycle after END_ADC goes HIGH. Two configuration options for SAMPLE pulse width are available: 1. Fixed Pulse Width (1 µs): – The entire SAMPLE pulse (rising and falling edges) is shifted in time to adjust when the integration ends, having in consideration the respective timing rules. 2. Variable Pulse Width: – Both SAMPLE rising and falling edges areadjusted to control integration time, having in consideration the respective timing rules. – For a minimum integration time of 2 µs, the SAMPLE pulse must remain high for at least 1 µs. END_ADC Timing:
• The END_ADC falling edge occurs 8 clock cycles after SAMPLE falling edge. LOAD_PULSE Timing:
• The LOAD_PULSE signal (1 clock cycle) rising edge must occur at least 4 clock cycles after the later of: – LVAL falling edge, or – END_ADC rising edge. LVAL Timing:
• The rising edge occurs 8 clock cycles after the LOAD_PULSE falling edge.

7.6.2.1 Idle time

Idle Time consists of:

• The fixed RST_CDS pulse width (2 µs), plus
• The interval between the SAMPLE falling edge and RST_CVC/RST_CDS rising edge (≥ 7 clock cycles).

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7.6.2.2 Line rate control

For a Fixed Integration Time:

• The line period (or line rate) is adjusted by changing the interval between the SAMPLE falling edge and RST_CVC/RST_CDS rising edge.

7.6.2.3 Integration time control

For a Fixed Line Period: 1. If SAMPLE has a fixed 1 µs duration:

• To increase integration time: – Move the entire SAMPLE pulse forward, ensuring its falling edge is at least ≥ 7 clock cycles before the next RST_CVC/RST_CDS rising edge.
• To decrease integration time: – Move the entire SAMPLE pulse backward, ensuring a minimum 1 µs interval from RST_CDS falling edge to the SAMPLE rising edge, a minimum 1 µs SAMPLE pulse width and SAMPLE rising edge at least 1 clock apart from END_ADC rising edge. 2. If SAMPLE has a variable width:
• To increase integration time: – Extend SAMPLE pulse by delaying the falling edge, while maintaining at least ≥ 7 clock cycle before the next RST_CVC/RST_CDS rising edge, taking in consideration that SAMPLE rising edge needs always come after END_ADC rising edge.
• To decrease integration time: – Advance SAMPLE falling edge, ensuring a minimum 1 µs interval from RST_CDS failing edge to SAMPLE rising edge, a minimum 1 µs SAMPLE pulse width and SAMPLE rising edge at least 1 clock apart from END_ADC rising edge.

7.6.2.4 Minimum line period requirement

The line period cannot be shorter than:

• The total duration of: – Integration time – RST_CDS pulse width – Time between SAMPLE falling edge and RST_CVC/RST_CDS rising edge
• ADC conversion time
• LVAL period

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7.6.2.5 Load pulse signal generation

The LOAD_PULSE signal is at the sensor side latched with the rising edge of pixel clock, thus the phase in which it is generated must be adjusted such that at the sensor pin. The LOAD_PULSE is high only during one rising edge of pixel clock. For low temperatures (below 10ºC) it is recommended to use a pulse width of 2 x Pixel Clock period. In case of problems with stable LVAL generation (no LVAL generated or LVAL signal not with the correct length), please change the phase on which the LOAD_PULSE is generated. Figure 24: LOAD_PULSE signal generated with correct timing(1) (1) The drawing signals are indicated, as they are present on the pin of the chip.

7.6.3 Dragster sequential/pipeline timing

While in Pipeline mode the next integration is performed after the previous one, during A/D conversion and Readout, the Sequential mode, as the name refers, each stage of Integration, A/D conversion and Readout are done sequentially, not in parallel with the other timing stages. Figure 25: Dragster sequential timings Pixel Clock Load_Pulse Reset CVC Reset CDS Integration I Reset CVC Conversion I Sample Start AD Start Readout Readout I Reset CDS Integration I+1 Conversion I+1 Sample Start AD Start Readout Readout I+1 Integration I+2 Conversion I+2 Sample Start AD Start Readout Readout I+2 Reset CVC Reset CDS Scan I Scan I+1 Scan I+2

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7.6.4 Dragster idle mode

Below is an example how to put sensor in idle mode. Figure 26: Timing diagram – end of readout entering idle To put the sensor in idle mode, the user should send a rising edge on both RST_CVC and RST_CDS, and keep both signals at high level. Additionally, ensure that the SAMPLE and LOAD_PULSE signals are held low, and the END_ADC signal remains high during this period.

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8 Digital interface

The sensor features two different types of control interfaces: SPI interface (using on chip registers) and digital control lines.

8.1 Digital control lines

The digital control lines allows a dynamic control that grant maximum flexibility for readout control operations, CVC control, CDS control and test control signals. Most of these signals changes the logic state during pixel integration and readout that cannot be done using static configuration, due to read and write operation times. Table 14: Digital control lines Signal DIG In/Out Function N_RESET In Low active global reset signal RST_CVC In Reset signal to CVC block RST_CDS In Reset signal to CDS block SAMPLE In Performs the signal sampling at the ADC input LOAD_PULSE In Starts the readout of last converted line END_ADC Out Indication from counter being in reset LVAL Out When at high informs that the line data is valid

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8.2 Serial 4-wire configuration interface

8.2.1 General description

The SPI interface controls static configuration data, such as operation modes, ADC gain, black level and other special features. It is present in every segment, top and bottom sides. This interface is based on 8-bit registers and addressed using 8-bit addresses. The interface uses the following signals: Table 15: SPI signals Signal DIG In/Out Function MISO Out Master In, Slave Out MOSI In Master Out, Slave In N_CS In Low active chip select SCLK In Serial interface clock For access to the internal registers of the sensor, a serial interface with four wires are implemented. The interface consists in four different lines, one clock line (SCLK), one receive (MOSI) and transmit (MISO) line which are synchronous to each other. The fourth line is the chip select (N_CS) and must be low to send/receive data through the lines. The sensor is always slave in the application. By the use of the N_CS signal, the master can activate the serial interface of an individual segment or several segments together. The bus frequency range is from DC to 20 MHz, but must always be lower than MCLK/2.

8.2.2 Writing operation

The writing operation is performed by sending the word containing the data and the address. No acknowledge signal or indication is given back. The data is sent from LSB to MSB. The command word has a length of 16 bits and contains the data of the register and the register address. It is possible to write multiple registers consecutively, sending data and address each 16 SCLK. After the last written word, the SCLK should be sent for minimum of two extra clocks, (maximum 4 SCLK) while N_CS is still low. The updating to the registers is performed after update request bit is sent at the next rising edge of END_ADC signal. The last word sent to the registers has to be always to register 0x01 and containing the update request bit, otherwise the update is not performed.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 47 / 109 Figure 27: Writing operation

8.2.3 Reading operation

To perform a read operation, the address for the register to be read, has to be written on register 0x15 (as data). After two and half SCLKs relative to the last MOSI bit (A7), the MISO line will send a leading ‘1’, followed by the 8-bit output data (LSB to MSB). It is only possible to read one register at a time, but it is possible to perform consecutive reads from the same segment and register. The raise of N_CS signal can be made right after the complete read of the last bit and SCLK should be placed on hold. Figure 28: Reading operation Time 0 LSB MSB

16 Bit of Serial Data

N_CS SCLK MOSI D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 A3 A4 A5 A6 A7

3 SCLK

N_CS SCLK MOSI LSB MSB Data (Read Adress) Address Time 0 Time 16SCLK D0 D1 D2 D3 D4 D5 D6 D7 A0 A1 A2 A3 A4 A5 A6 A7

2.5 SCLK

8 SCLK

'1'

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9 Register description

Every internal status of the sensor will be controlled by the serial interface and be written to the internal registers. All registers are 8-bit oriented. The unused bits on a register are set to zero and reserved for future use.

9.1 Detailed register description

9.1.1 Control register 1 (Address 0x01)

Table 16: Control register 1 Address: 0x01 Default value: 0xA8 Access: Read/Write Bit Bit name Default value Bit description 7:7 VThr Bit 1b Set to '0' – For test purposes only. Do not use. Set to '1' – The threshold voltage for the white clamping is given internally. 6:6 ADC Mode Bit 0b Set to '0' – Linear ADC conversion is used. Set to '1' – Companding ADC conversion is used. 5:5 Enable Saturation(1)(2) 1b Set to '0' – The digital saturation is not enabled, so the output will cover full 13-bit. If 12 bits are read out "wrap around" error may occur if End ADC range is not properly configured. Set to '1' – Digital saturation is enabled, the output will be saturated to the 12 LSB's (4095 DN). 4:4 Offset Subtraction(3) 0b Set to '0' – The digital offset is not subtracted from the read value. Set to '1' – The value stored in the offset register is subtracted from the readout signal. 3:3 Dithering 1b Set to '0' – Dithering deactivated (for ADC linear mode). Set to '1' – Dithering activated (noise generated for ADC). This bit enables the on chip dithering logic to avoid missing codes in the output histogram when on chip re-linearization is used in combination with companding ADC mode. 2:2 Clock Division 2 0b These bits are responsible for the definition of readout clock (pixel clock), the different values are presented in Table 17. 1:1 Clock Division 1 0b

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 49 / 109 Address: 0x01 Default value: 0xA8 Access: Read/Write Bit Bit name Default value Bit description 0:0 Update Request 0b In order to activate a set of new register values uploaded over SPI, this bit has to be set to 1. Register data does not change unless this bit was set to 1 and a rising edge of End ADC occurred. When this bit is set, at the next rising edge of End ADC signal the register values are updated. (1) The 13th bit should be ignored if on chip saturation is enabled, it holds an overflow identification flag in this case. (2) It is recommended to configure ADC resolution to 12 bits, enable saturation set to ‘1’ and End of Range Register (register 0x09) to 0x80H, which allows for an output of 4095DN. (3) The digital subtraction feature enabled (bit set to ‘1’) is not recommended, creating artifacts in the image. Still, if using this feature, the bit 2 in Control Register 3 (register 0x05) "Enable Offset SRAM" must be set to ‘1’, at user’s responsibility. Table 17: Clock division Bit 2 Bit 1 Description 0 0 Readout clock set to MCLK 0 1 Readout clock set to MCLK/2 ADC CLK remains at MCLK 1 0 Readout clock set to MCLK/4 ADC CLK remains at MCLK 1 1 Do not use, clock not generated

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9.1.2 Control register 2 (Address 0x02)

Table 18: Control register 2 Address: 0x02 Default value: 0x12 Access: Read/Write Bit Bit name Default value Bit description 7:6 N/A 00b Not used 5:5 Analogue Gain 0b Set to '0' – No analogue gain (x1) in the CDS. Set to '1' – Analogue gain (x4) in the CDS. 4:4 Enable White Clamping (Anti-Corona) 1b Set to '0' – The white clamp is not active. Set to '1' – The clamping of white values set. White clamp is used to avoid contrast inversion of heavily over exposed scenes (corona effect) 3:3 Enable Anti-Blooming(1) 0b Set to '0' – Additional anti blooming feature OFF. Set to '1' – Additional anti blooming feature ON. 2:2 White Offset(2) 0b Set to '0' – Not active, values of the A/D conversion go to the readout registers. Set to '1' – When active, a new value is written to the offset registers. 1:1 Enable Control VRef 1b Set to '0' – VRef buffer bias is in constant power mode. Set to '1' – VRef buffer bias in low power mode (recommended). 0:0 Auto Gen Load Pulse 0b Set to '0' – The pulse for readout has to be provided externally. Set to '1' – The pulse for readout is generated internally, immediately after completed AD conversion and once the LVAL of the previous line readout is back to zero. Multiple readouts of the same data occur if no new A/D conversion has been started after finalization of the line readout. (1) The pixels inherent anti-blooming structures will under normal conditions prevent any kind of blooming. Only under the most extreme over exposure condition, this additional anti-blooming circuitry may be required. (2) Feature related to digital subtraction, which is not recommended to be set to ‘1’. Still, if using this feature, the bit 2 in Control Register 3 (register 0x05) "Enable Offset SRAM" must be set to ‘1’, at user’s responsibility.

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9.1.3 Inversed ADC gain register (Address 0x03)

Table 19: Inversed ADC gain register Address: 0x03 Default value: 0x1D Access: Read/Write Bit Bit name Default Bit description 7:0 Inversed ADC Gain Register 00011101b Responsible for ADC conversion gain. Respectively the ADC conversion step. The register is proportional to the voltage step required for 1 DN. Higher value on this register, results in a lower ADC gain (higher voltage step for 1 DN).

9.1.4 Offset register (Address 0x04)

Table 20: Offset register Address: 0x04 Default value: 0xC8 Access: Read/Write Bit Bit name Default Bit description 7:0 Offset Register 11001000b Responsible for ADC black level offset. The lower the value of the offset register the closer the output signal will be to the white level, with the increasing of the register value the output signal will become more black.

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9.1.5 Control register 3 (Address 0x05)

Table 21: Control register 3 Address: 0x05 Default value: 0x12 Access: Read/Write Bit Bit name Default value Bit description 7:6 N/A 00b Not used 5:3 Bandgap Switch 010b These bits can be used to trim the reference current generated by the bandgap circuit of different segments. The bits configuration is shown in Table 22. 2:2 Enable Offset SRAM(1) 0b Set to '0' – Offset SRAM is powered down. Stored offset values are lost. Set to '1' – Offset SRAM is enabled. 1:1 Re-linearization 1b Set to '0' – In companding ADC mode the piece wise linear compressed data is given out. Set to '1' – When using the companding ADC mode, the compressed data is re-linearized on chip to a linear 12 bits representation. It is recommended to use dithering (control register 0x01 bit 3) together with this feature to avoid missing codes in the output signal. 0:0 Pixel Clock Output Enable 0b Set to '0' – The pixel clock pad is in tristate mode. No pixel clock in given out. Set to '1' – The pixel clock is provided to the user on the pad. (1) Feature related to digital subtraction, which is not recommended to be set to ‘1’. Still, if using this feature, it is at user’s responsibility.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 53 / 109 Table 22: Bandgap switch Bit 5 Bit 4 Bit 3 Relative current to nominal(1) 0 0 0 132% 0 0 1 77% 0 1 0 100% 0 1 1 64% 1 0 0 112% 1 0 1 70% 1 1 0 86% 1 1 1 59% (1) The generated reference current can be observed at the TEST_MUX output pins. The target is 100 μA. These bits can be used to tune the general reference back to target values, in case production parameters spread leads to strong deviation. Further these bits can be used to reduce overall power consumption, though the reference voltages, (namely ADC zero reference will drift from target values) and may have to be over driven to get proper operation at lower overall current. (Register 0x0A, channel 0x0F).

9.1.6 Threshold register 1 (Address 0x06)

Table 23: Threshold register 1 Address: 0x06 Default value: 0x01 Access: Read/Write Bit Bit name Default Bit description 7:0 Threshold Register 1 00000001b This register is responsible for holding the value for the first ADC threshold in companding mode. The register content is multiplied by 32.

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9.1.7 Threshold register 2 (Address 0x07)

Table 24: Threshold register 2 Address: 0x07 Default value: 0x06 Access: Read/Write Bit Bit name Default Bit description 7:0 Threshold Register 2 00000110b This register is responsible for holding the value for the second ADC threshold in companding mode. The register content is multiplied by 32.

9.1.8 Threshold register 3 (Address 0x08)

Table 25: Threshold register 3 Address: 0x08 Default value: 0x6D Access: Read/Write Bit Bit name Default Bit description 7:0 Threshold Register 3 01101101b This register is responsible for holding the value for the third ADC threshold in companding mode. The register content is multiplied by 32.

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9.1.9 End of range register (Address 0x09)

Table 26: End of range register Address: 0x09 Default value: 0x7F Access: Read/Write Bit Bit name Default Bit description 7:0 End of Range Register 01111111b This register is responsible for holding the value to configure the end of the ADC range (the highest digital value computed by the ADC). The register holds the 8 MSB's of a 13-bit value (the 5 LSB's are set by hard wiring to zero). The time in master clock cycles the ADC requires for a conversion equals the value in this register multiplied by 32. Use this register to choose between 10-bit, 11-bit, 12-bit ADC resolution. The ADC resolution trades versus the ADC conversion time. Higher resolution thus requires longer line periods, or the ADC to be run at higher clock frequency.

9.1.10 Test multiplexer register (Address 0x0A)

Table 27: Test multiplexer register Address: 0x0A Default value: 0x00(1) Access: Read/Write Bit Bit name Default Bit description 7:7 hv_3 0b This register is responsible for holding the value to configure the test multiplexer. It defines the channel (Table 28) that will select as output for the test multiplexer. 6:6 hv_2 0b 5:5 hv_1 0b 4:4 hv_0 0b 3:3 Test_3 0b 2:2 Test_2 1b 1:1 Test_1 1b 0:0 Test_0 0b (1) It is recommended to write value 0x0F which helps to stabilize VRef for the chip and reducing significantly line by line offset noise.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 56 / 109 Table 28: Test multiplexer channels Channel Signal Comment 0x00 VSS Reset default 0x01 Vbg Internal bandgap reference voltage 0x02 Bias_VRef Bias reference of on chip CDS reference buffer 0x03 GND_RST_CVC Anti-blooming reference voltage 0x04 PCAS_CDS Internal reference voltage 0x05 NCAS_CDS Internal reference voltage 0x06 VBias_CDS Internal reference voltage 0x07 VBias_White_Clamp Internal reference voltage 0x08 VThr Threshold voltage for saturation detection 0x09 VBias_CVC Internal reference voltage 0x0A IRef Current output (measure towards VSS) for internal bias generation. The target value is 100 µA 0x0B VBias_Comp_1 Internal reference voltage 0x0C RST_CVC Monitor of digital control signal RST_CVC 0x0D VRST Internal reference voltage 0x0E Rmp Internal reference voltage 0x0F ADC_Reference Reference voltage for ADC zero level. Can be overdriven. Additional decoupling on this signal may improve noise performance.

9.1.11 Read request register (Address 0x0F)

Table 29: Read request register Address: 0x0F Default value: 0x00 Access: Read/Write Bit Bit name Default Bit description 7:0 Address to Read 00000000b Defines the register address to be read in a read back operation over SPI interface.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 57 / 109

9.2 Register mapping overview

Table 30: Default sensor register setting Address Register ID and description Default value 0x01 Control register 1 – Holds several configuration bits 0xA8 0x02 Control register 2 – Holds several configuration bits 0x12 0x03 Inverse ADC Gain – Sets the analogue gain (step size of ADC) 0x1D 0x04 Offset – Sets the black level reference for the ADC 0xC8 0x05 Control register 1 – Holds several configuration bits 0x12 0x06 Threshold register 1 – Sets the first knee point for companding ADC mode 0x01 0x07 Threshold register 2 – Sets the second knee point for companding ADC mode 0x06 0x08 Threshold register 3 – Sets the third knee point for for companding ADC mode 0x6D 0x09 End of range – Sets the end of range for the ADC (highest ADC code & ADC conversion time) 0x7F 0x0A Test multiplexer – Sets the output of test multiplexer to the test analogue pad 0x00 0x0F Read Request – Defines the register address to be read in a read back operation over SPI interface 0x00

Application information

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 58 / 109

10.1 External components

Figure 29: Recommended power supply strategy for the sensor headboard VDDA GND VDDBulk GND VDDESD GND VDDD VDDIO C1 C2 C2 C3 C2 C3 1X 1X 1X 1X C1 C2 C1 C2 GND GND Test_Mux Board Contact for VDDA Board Contact for GND Board Contact for VDDD DAC

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 59 / 109 Information: Please note that in the above image the component DAC is optional. Table 31: Recommended values for capacitors and inductances Component Description Nominal value Tolerance Voltage range Power decoupling capacitor, close to each VDDx connector pin Low ESR Ceramic 10 nF ±25% >3.6 V Power decoupling capacitor, placed one time per power supply Tantalum type 10 µF ±25% >3.6 V Power decoupling capacitor, placed one time per power supply Tantalum type 100 µF ±25% >3.6 V L1 Power decoupling inductance 10 nH ±25% Dimension according to power consumption of respective sensor variation C4 Additional decoupling capacitor on the outputs of Test_Mux(1) 100 nF ±25% >3.6 V (1) If the Test_Mux_# signals are accessible an additional capacitance should be placed in this signal and then by writing on register 0x0A with the value 0x0F the line by line offset noise is reduced significantly. If added an external DAC, the circuit schematic to be used is shown in Figure 30. If the Test_Mux_# signals are accessible, this option allows to set the ADC offset (black reference) in more fine steps and possibly, with better temperature stability. In order to perform this operation, the Test_Mux_# outputs should be connected and the value 0x0F should be written to register 0x0A in all segments. Also, make sure the DAC output impedance is higher than 200 kΩ. On chip there is an 8-bit resolution DAC for this purpose, but an external DAC can provide benefit if more fine adjustment steps are required. For sensors with 3.5 μm pixel and dual line sensors, once there are individual SPI blocks, it is recommended to connect a DAC for top (DAC1) and bottom (DAC2) side separately, though is not mandatory. Once the individual DAC offsets are equalized over the external connection, the black level can be adjusted by writing the same value to the registers on each segment.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 61 / 109 Figure 31: Equivalent load scheme for use of external DAC VDDA A D VSSA VSSA VSSA VDDA Test_Mux Channel 15 63KΩ VRef Black Internal 1V -2V Set by register 0x04 ~ 20µA Dragster Sensor

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 62 / 109

11 Soldering information

Figure 32 shows the maximum recommended thermal profile for a reflow soldering system (following Standard J-STD-020), relative to LCC ceramic package. If the temperature/time profile exceeds these recommendations, damage to the image sensor can occur. Figure 32: Solder reflow profile graph Attention Image sensors with color filter arrays (CFA) are especially sensitive to high temperatures. Prolonged heating at elevated temperatures may result in deterioration of the optical performance of the sensor. A socket is the safest way to avoid any thermal stress. When not using a socket, to avoid heating up the device we recommend to use manual hand soldering. Wave soldering can be used with precautions (see below). Reflow soldering is not recommended.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 63 / 109 Manual soldering: Use partial heating method and use a soldering iron with temperature control. The soldering iron tip temperature is not to exceed 350°C with a 270°C maximum pin temperature. Touch for a 2 seconds maximum duration per pin. Avoid touching and global heating of the ceramic package during soldering. Failure to do so may alter device performance and reliability. Wave soldering: Wave solder dipping can cause damage to the glass and harm the imaging capability of the device. Avoid the solder to come in contact with the glass or ceramic body.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 64 / 109

12 Pin description

12.1 Signal assignment to LCC ceramic packaging

Table 33: Pinout DR2K7_LCC_Ceramic, DR2x2K7_LCC_Ceramic, DR4K3.5_LCC_Ceramic Pin number Pin name (DR4K3.5_LCC_Ceramic DR2x2K7_LCC_Ceramic) Pin name (DR2K7_LCC_Ceramic) Pin type(1)

1 Tap A1 Bit 11 Tap A1 Bit 11 DO

2 Tap A1 Bit 9 Tap A1 Bit 9 DO

3 Tap A1 Bit 7 Tap A1 Bit 7 DO

4 Tap A1 Bit 5 Tap A1 Bit 5 DO

5 Tap A1 Bit 3 Tap A1 Bit 3 DO

6 Tap A1 Bit 1 Tap A1 Bit 1 DO

7 VSS VSS GND

8 LVAL Tap A1/B1 LVAL Tap A1/B1 DO

9 Tap A1 Bit 12 Tap A1 Bit 12 DO

10 Tap A1 Bit 10 Tap A1 Bit 10 DO

11 Tap A1 Bit 8 Tap A1 Bit 8 DO

12 Tap A1 Bit 6 Tap A1 Bit 6 DO

13 Tap A1 Bit 4 Tap A1 Bit 4 DO

14 Tap A1 Bit 2 Tap A1 Bit 2 DO

15 Tap A1 Bit 0 Tap A1 Bit 0 DO

16 Pixel_CLK_Tap A1/B1 Pixel_CLK_Tap A1/B1 DO

17 End_ADC_Tap A1/B1 End_ADC_Tap A1/B1 DO

18 VSS VSS GND

19 Tap B1 Bit 1 Tap B1 Bit 1 DO

20 Tap B1 Bit 3 Tap B1 Bit 3 DO

21 Tap B1 Bit 5 Tap B1 Bit 5 DO

22 Tap B1 Bit 7 Tap B1 Bit 7 DO

23 Tap B1 Bit 9 Tap B1 Bit 9 DO

24 Tap B1 Bit 11 Tap B1 Bit 11 DO

25 Tap B1 Bit 0 Tap B1 Bit 0 DO

26 Tap B1 Bit 2 Tap B1 Bit 2 DO

27 Tap B1 Bit 4 Tap B1 Bit 2 DO

28 VSS VSS GND

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 65 / 109 Pin number Pin name (DR4K3.5_LCC_Ceramic DR2x2K7_LCC_Ceramic) Pin name (DR2K7_LCC_Ceramic) Pin type(1)

29 Tap B1 Bit 6 Tap B1 Bit 6 DO

30 Tap B1 Bit 8 Tap B1 Bit 8 DO

31 Tap B1 Bit 10 Tap B1 Bit 10 DO

32 Tap B1 Bit 12 Tap B1 Bit 12 DO

33 VSS VSS GND

34 VDDA VDDA 3.3 V Analogue 35 VDD VDD 3.3 V Supply 36 VDD VDD 3.3 V Supply 37 VDD VDD 3.3 V Supply 38 VDDA VDDA 3.3 V Analogue

39 N_Reset N_Reset DI

40 VSS GND GND

41 Tap D1 Bit 12 Not connected DO

42 Tap D1 Bit 10 Not connected DO

43 Tap D1 Bit 8 Not connected DO

44 Tap D1 Bit 6 Not connected DO

45 VSS VSS GND

46 Tap D1 Bit 4 Not connected DO

47 Tap D1 Bit 2 Not connected DO

48 Tap D1 Bit 0 Not connected DO

49 Tap D1 Bit 11 Not connected DO

50 Tap D1 Bit 9 Not connected DO

51 Tap D1 Bit 7 Not connected DO

52 Tap D1 Bit 5 Not connected DO

53 Tap D1 Bit 3 Not connected DO

54 Tap D1 Bit 1 Not connected DO

55 VSS GND GND

56 End_ADC_Tap C1/D1 Not connected DO

57 Pixel_CLK_Tap C1/D1 Not connected DO

58 Tap C1 Bit 0 Not connected DO

59 Tap C1 Bit 2 Not connected DO

60 Tap C1 Bit 4 Not connected DO

61 Tap C1 Bit 6 Not connected DO

62 Tap C1 Bit 8 Not connected DO

63 Tap C1 Bit 10 Not connected DO

64 Tap C1 Bit 12 Not connected DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 66 / 109 Pin number Pin name (DR4K3.5_LCC_Ceramic DR2x2K7_LCC_Ceramic) Pin name (DR2K7_LCC_Ceramic) Pin type(1)

65 LVAL Tap C1/D1 Not connected DO

66 VSS GND GND

67 MISO C1/D1 Not connected DO

68 Tap C1 Bit 1 Not connected DO

69 Tap C1 Bit 3 Not connected DO

70 Tap C1 Bit 5 Not connected DO

71 Tap C1 Bit 7 Not connected DO

72 Tap C1 Bit 9 Not connected DO

73 VSS GND GND

74 Tap C1 Bit 11 Not connected DO

75 RESET_CDS DI DI

76 N_CS C1/D1 Not connected DI

77 MOSI DI DI

78 Main_CLK DI DI

79 Load_Pulse DI DI

80 VSS GND GND

81 VDD 3.3V 3.3 V 82 VDD 3.3V 3.3 V 83 VDDA VDDA 3.3 V Analogue 84 VDDA VDDA 3.3 V Analogue

85 N_CS A1/B1 DI DI

86 Sample DI DI

87 RST_CVC DI DI

88 SCLK DI DI

89 MISO A1/B1 DO DO

90 VSS GND GND

(1) Explanation of abbreviations: DI Digital Input DO Digital Output

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 67 / 109 DR2x2K7, DR4K3.5, DR2K7 For DR2K7_Invar, connector 2 is present but not required. Only the powers present on the connector are routed to the sensor. Connector 2 can be left completely unconnected for DR2K7_Invar. Table 34: Connector 1 pinout Pin number Pin name Pin type(1)

1 N_CS_AB_1 DI

2 MISO_AB_1 DO

3 VDDA VDDA

4 VDDD VDDD

5 VSSA GND

6 VSS_Bulk GND

7 VSSD GND

8 Load_Pulse_AB_1 DI

9 VDDIO VDDIO

10 End_ADC_AB_1 DI

11 VDDA VDDA

12 VDD_Bulk VDD_Bulk

13 VDDD VDDD

14 VDDESD VDDESD

15 VSSA GND

16 VSS_Bulk GND

17 VSSD GND

18 VDDIO VDDIO

19 Test_Mux_AB_1 Analogue Monitor - Leave n.c.

20 VDDA VDDA

21 VDDD VDDD

22 VSSA GND

23 VSS_Bulk GND

24 VSSD GND

25 VSSESD/IO GND

26 Pixel_CLK_AB_1 DO

27 VClamp_AB_1 VDDA

28 Sample_AB DI

29 RST_CDS_AB DI

30 RST_CVC_AB DI

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 68 / 109 Pin number Pin name Pin type(1)

31 Not connected

32 SCLK_AB_EF DI

33 MOSI_AB_EF DI

34 Not connected

35 VDDA VDDA

36 VDD_Bulk VDD_Bulk

37 VDDD VDDD

38 VDDESD VDDESD

39 VSSA GND

40 VSS_Bulk GND

41 VSSD GND

42 Not connected

43 VDDIO VDDIO

44 Not connected

45 VDDA VDDA

46 VDDD VDDD

47 VSSA GND

48 VSSD GND

49 VDDIO VDDIO

50 Not connected

51 VDDA VDDA

52 VDD_Bulk VDD_Bulk

53 VDDD VDDD

54 VDDESD VDDESD

55 VSSA GND

56 VSS_Bulk GND

57 VSSD GND

58 N_Reset_AB DI

59 Not connected

60 Not connected

61 VSSESD/IO GND

62 LVAL_AB_1 DO

63 Bit_12_Tap_A1 DO

64 Bit_11_Tap_A1 DO

65 Bit_10_Tap_A1 DO

66 Bit_09_Tap_A1 DO

67 Bit_08_Tap_A1 DO

68 Bit_07_Tap_A1 DO

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69 Bit_06_Tap_A1 DO

70 Bit_05_Tap_A1 DO

71 Bit_04_Tap_A1 DO

72 Bit_03_Tap_A1 DO

73 Bit_02_Tap_A1 DO

74 Bit_01_Tap_A1 DO

75 Bit_00_Tap_A1 DO

76 VSSESD/IO GND

77 Bit_00_Tap_B1 DO

78 Bit_01_Tap_B1 DO

79 Bit_02_Tap_B1 DO

80 Bit_03_Tap_B1 DO

81 Bit_04_Tap_B1 DO

82 Bit_05_Tap_B1 DO

83 Bit_06_Tap_B1 DO

84 Bit_07_Tap_B1 DO

85 Bit_08_Tap_B1 DO

86 Bit_09_Tap_B1 DO

87 Bit_10_Tap_B1 DO

88 Bit_11_Tap_B1 DO

89 Bit_12_Tap_B1 DO

90 Main_CLK DI

91 VSSESD/IO GND

92 Not connected

93 Not connected

94 Not connected

95 Not connected

96 Not connected

97 Not connected

98 Not connected

99 Not connected

100 Not connected

101 Not connected

102 Not connected

103 Not connected

104 Not connected

105 Not connected

106 VSSESD/IO GND

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107 Not connected

108 Not connected

109 Not connected

110 Not connected

111 Not connected

112 Not connected

113 Not connected

114 Not connected

115 Not connected

116 Not connected

117 Not connected

118 Not connected

119 Not connected

120 VSSESD/IO GND

(1) Explanation of abbreviations: DI Digital Input DO Digital Output Information: SCLK and MOSI are connected between connector 1 and connector 3 in the headboard, resulting names are SCLK_AB_EF and MOSI_AB_EF. The user can provide the headboard one pair of this signals to connector 1 or 3 to communicate with the SPI, taking the advantage that two IO lines from the control unit (FPGA or CPLD) are saved. Each SPI can be selected individually by selecting respective negative chip select pin.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 71 / 109 Table 35: Connector 2 pinout Pin number Pin name Pin type(1)

1 VSSESD/IO GND

2 LVAL_CD_1 DO

3 Bit_12_Tap_C1 DO

4 Bit_11_Tap_C1 DO

5 Bit_10_Tap_C1 DO

6 Bit_09_Tap_C1 DO

7 Bit_08_Tap_C1 DO

8 Bit_07_Tap_C1 DO

9 Bit_06_Tap_C1 DO

10 Bit_05_Tap_C1 DO

11 Bit_04_Tap_C1 DO

12 Bit_03_Tap_C1 DO

13 Bit_02_Tap_C1 DO

14 Bit_01_Tap_C1 DO

15 Bit_00_Tap_C1 DO

16 VSSESD/IO GND

17 Bit_00_Tap_D1 DO

18 Bit_01_Tap_D1 DO

19 Bit_02_Tap_D1 DO

20 Bit_03_Tap_D1 DO

21 Bit_04_Tap_D1 DO

22 Bit_05_Tap_D1 DO

23 Bit_06_Tap_D1 DO

24 Bit_07_Tap_D1 DO

25 Bit_08_Tap_D1 DO

26 Bit_09_Tap_D1 DO

27 Bit_10_Tap_D1 DO

28 Bit_11_Tap_D1 DO

29 Bit_12_Tap_D1 DO

30 Not connected

31 VSSESD/IO GND

32 Not connected

33 Not connected

35 Not connected

36 Not connected

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37 Not connected

38 Not connected

39 Not connected

40 Not connected

41 Not connected

43 Not connected

45 Not connected

46 VSSESD/IO GND

47 Not connected

48 Not connected

49 Not connected

51 Not connected

52 Not connected

53 Not connected

54 Not connected

55 Not connected

56 Not connected

57 Not connected

58 Not connected

60 VSSESD/IO GND

61 N_CS_CD_1 DI

62 MISO_CD_1 DO

63 VDDA VDDA

64 VDDD VDDD

65 VSSA GND

66 VSS_Bulk GND

67 VSSD GND

68 Load_Pulse_CD_1 DI

69 VDDIO VDDIO

70 End_ADC_CD_1 DO

71 VDDA VDDA

72 VDD_Bulk VDD_Bulk

73 VDDD VDDD

74 VDDESD VDDESD

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 73 / 109 Pin number Pin name Pin type(1)

75 VSSA GND

76 VSS_Bulk GND

77 VSSD GND

78 VDDIO VDDIO

79 Test_Mux_CD_1 Analogue Monitor - Leave n.c.

80 VDDA VDDA

81 VDDD VDDD

82 VSSA GND

83 VSS_Bulk GND

84 VSSD GND

85 VSSESD/IO GND

86 Pixel_CLK_CD_1 DO

87 VClamp_CD_1 VDDA

88 Sample_CD DI

89 RST_CDS_CD DI

90 RST_CVC_CD DI

91 Not connected

92 SCLK_CD_GH DI

93 MOSI_CD_GH DI

95 VDDA VDDA

96 VDD_Bulk VDD_Bulk

97 VDDD VDDD

98 VDDESD VDDESD

99 VSSA GND

100 VSS_Bulk GND

101 VSSD GND

103 VDDIO VDDIO

105 VDDA VDDA

106 VDDD VDDD

107 VSSA GND

108 VSSD GND

109 VDDIO VDDIO

111 VDDA VDDA

112 VDD_Bulk VDD_Bulk

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 74 / 109 Pin number Pin name Pin type(1)

113 VDDD VDDD

114 VDDESD VDDESD

115 VSSA GND

116 VSS_Bulk GND

117 VSSD GND

118 N_Reset_CD DI

120 Not connected

(1) Explanation of abbreviations: DI Digital Input DO Digital Output Information: SCLK and MOSI are connected between connector 2 and connector 4 in the headboard, resulting names are SCLK_CD_GH and MOSI_CD_GH. The user can provide the headboard one pair of this signals to connector 2 or 4 to communicate with the SPI, taking the advantage that two IO lines from the control unit (FPGA or CPLD) are saved. Each SPI can be selected individually by selecting respective negative chip select pin.

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12.3 Connector signal assignment for Invar headboard variations DR4K7,

DR8K7, DR8K3.5, DR16K3.5, DR2x4K7, DR2x8K7 Table 36: Connector 1 pinout Pin number Pin name Pin type(1) 19 Test_Mux_AB_1 Analogue Monitor - Leave n.c.

31 N_CS_AB_2 DI

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 76 / 109 Pin number Pin name Pin type(1)

34 MISO_AB_2 DO

42 Load_Pulse_AB_2 DI

44 End_ADC_AB_2 DO

50 Test_Mux_AB_2 Analogue Monitor - Leave n.c.

59 Pixel_Clock_AB_2 DO

60 VClamp_AB_2 VDDA

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 77 / 109 Pin number Pin name Pin type(1)

92 LVAL_AB_2 DO

93 Bit_12_Tap_A2 DO

94 Bit_11_Tap_A2 DO

95 Bit_10_Tap_A2 DO

96 Bit_09_Tap_A2 DO

97 Bit_08_Tap_A2 DO

98 Bit_07_Tap_A2 DO

99 Bit_06_Tap_A2 DO

100 Bit_05_Tap_A2 DO

101 Bit_04_Tap_A2 DO

102 Bit_03_Tap_A2 DO

103 Bit_02_Tap_A2 DO

104 Bit_01_Tap_A2 DO

105 Bit_00_Tap_A2 DO

107 Bit_00_Tap_B2 DO

108 Bit_01_Tap_B2 DO

109 Bit_02_Tap_B2 DO

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110 Bit_03_Tap_B2 DO

111 Bit_04_Tap_B2 DO

112 Bit_05_Tap_B2 DO

113 Bit_06_Tap_B2 DO

114 Bit_07_Tap_B2 DO

115 Bit_08_Tap_B2 DO

116 Bit_09_Tap_B2 DO

117 Bit_10_Tap_B2 DO

118 Bit_11_Tap_B2 DO

119 Bit_12_Tap_B2 DO

(1) Explanation of abbreviations: DI Digital Input DO Digital Output Information: SCLK and MOSI are connected between connector 1 and connector 3 in the headboard, resulting names are SCLK_AB_EF and MOSI_AB_EF. The user can provide the headboard one pair of this signals to connector 1 or 3 to communicate with the SPI, taking the advantage that two IO lines from the control unit (FPGA or CPLD) are saved. Each SPI can be selected individually by selecting respective negative chip select pin.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 79 / 109 Table 37: Connector 2 pinout Pin number Pin name Pin type(1)

32 LVAL_CD_2 DO

33 Bit_12_Tap_C2 DO

34 Bit_11_Tap_C2 DO

35 Bit_10_Tap_C2 DO

36 Bit_09_Tap_C2 DO

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37 Bit_08_Tap_C2 DO

38 Bit_07_Tap_C2 DO

39 Bit_06_Tap_C2 DO

40 Bit_05_Tap_C2 DO

41 Bit_04_Tap_C2 DO

42 Bit_03_Tap_C2 DO

43 Bit_02_Tap_C2 DO

44 Bit_01_Tap_C2 DO

45 Bit_00_Tap_C2 DO

47 Bit_00_Tap_D2 DO

48 Bit_01_Tap_D2 DO

49 Bit_02_Tap_D2 DO

50 Bit_03_Tap_D2 DO

51 Bit_04_Tap_D2 DO

52 Bit_05_Tap_D2 DO

53 Bit_06_Tap_D2 DO

54 Bit_07_Tap_D2 DO

55 Bit_08_Tap_D2 DO

56 Bit_09_Tap_D2 DO

57 Bit_10_Tap_D2 DO

58 Bit_11_Tap_D2 DO

59 Bit_12_Tap_D2 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 81 / 109 Pin number Pin name Pin type(1) 79 Test_Mux_CD_1 Analogue Monitor - Leave n.c.

91 N_CS_CD_2 DI

94 MISO_CD_2 DO

102 Load_Pulse_CD_2 DI

104 End_ADC_CD_2 DO

110 Test_Mux_CD_2 Analogue Monitor - Leave n.c.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 82 / 109 Pin number Pin name Pin type(1)

119 Pixel_CLK_CD_2 DO

120 VClamp_CD_2 VDDA

(1) Explanation of abbreviations: DI Digital Input DO Digital Output Information: SCLK and MOSI are connected between connector 2 and connector 4 in the headboard, resulting names are SCLK_CD_GH and MOSI_CD_GH. The user can provide the headboard one pair of this signals to connector 2 or 4 to communicate with the SPI, taking the advantage that two IO lines from the control unit (FPGA or CPLD) are saved. Each SPI can be selected individually by selecting respective negative chip select pin.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 83 / 109 Table 38: Connector 3 pinout Pin number Pin name Pin type(1)

1 N_CS_EF_1 DI

2 MISO_EF_1 DO

8 Load_Pulse_EF_1 DI

10 End_ADC_EF_1 DO

19 Test_Mux_EF_1 Analogue Monitor - Leave n.c.

26 Pixel_CLK_EF_1 DO

27 VClamp_EF_1 VDDA

28 Sample_EF DI

29 RST_CDS_EF DI

30 RST_CVC_EF DI

31 N_CS_EF_2 DI

34 MISO_EF_2 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 84 / 109 Pin number Pin name Pin type(1)

42 Load_Pulse_EF_2 DI

44 End_ADC_EF_2 DO

50 Test_Mux_EF_2 Analogue Monitor - Leave n.c.

58 N_Reset_EF DI

59 Pixel_Clock_EF_2 DO

60 VClamp_EF_2 VDDA

62 LVAL_EF_1 DO

63 Bit_12_Tap_E1 DO

64 Bit_11_Tap_E1 DO

65 Bit_10_Tap_E1 DO

66 Bit_09_Tap_E1 DO

67 Bit_08_Tap_E1 DO

68 Bit_07_Tap_E1 DO

69 Bit_06_Tap_E1 DO

70 Bit_05_Tap_E1 DO

71 Bit_04_Tap_E1 DO

72 Bit_03_Tap_E1 DO

73 Bit_02_Tap_E1 DO

74 Bit_01_Tap_E1 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 85 / 109 Pin number Pin name Pin type(1)

75 Bit_00_Tap_E1 DO

77 Bit_00_Tap_F1 DO

78 Bit_01_Tap_F1 DO

79 Bit_02_Tap_F1 DO

80 Bit_03_Tap_F1 DO

81 Bit_04_Tap_F1 DO

82 Bit_05_Tap_F1 DO

83 Bit_06_Tap_F1 DO

84 Bit_07_Tap_F1 DO

85 Bit_08_Tap_F1 DO

86 Bit_09_Tap_F1 DO

87 Bit_10_Tap_F1 DO

88 Bit_11_Tap_F1 DO

89 Bit_12_Tap_F1 DO

92 LVAL_EF_2 DO

93 Bit_12_Tap_E2 DO

94 Bit_11_Tap_E2 DO

95 Bit_10_Tap_E2 DO

96 Bit_09_Tap_E2 DO

97 Bit_08_Tap_E2 DO

98 Bit_07_Tap_E2 DO

99 Bit_06_Tap_E2 DO

100 Bit_05_Tap_E2 DO

101 Bit_04_Tap_E2 DO

102 Bit_03_Tap_E2 DO

103 Bit_02_Tap_E2 DO

104 Bit_01_Tap_E2 DO

105 Bit_00_Tap_E2 DO

107 Bit_00_Tap_F2 DO

108 Bit_01_Tap_F2 DO

109 Bit_02_Tap_F2 DO

110 Bit_03_Tap_F2 DO

111 Bit_04_Tap_F2 DO

112 Bit_05_Tap_F2 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 86 / 109 Pin number Pin name Pin type(1)

113 Bit_06_Tap_F2 DO

114 Bit_07_Tap_F2 DO

115 Bit_08_Tap_F2 DO

116 Bit_09_Tap_F2 DO

117 Bit_10_Tap_F2 DO

118 Bit_11_Tap_F2 DO

119 Bit_12_Tap_F2 DO

(1) Explanation of abbreviations: DI Digital Input DO Digital Output

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 87 / 109 Table 39: Connector 4 pinout Pin number Pin name Pin type(1)

2 LVAL_GH_1 DO

3 Bit_12_Tap_G1 DO

4 Bit_11_Tap_G1 DO

5 Bit_10_Tap_G1 DO

6 Bit_09_Tap_G1 DO

7 Bit_08_Tap_G1 DO

8 Bit_07_Tap_G1 DO

9 Bit_06_Tap_G1 DO

10 Bit_05_Tap_G1 DO

11 Bit_04_Tap_G1 DO

12 Bit_03_Tap_G1 DO

13 Bit_02_Tap_G1 DO

14 Bit_01_Tap_G1 DO

15 Bit_00_Tap_G1 DO

17 Bit_00_Tap_H1 DO

18 Bit_01_Tap_H1 DO

19 Bit_02_Tap_H1 DO

20 Bit_03_Tap_H1 DO

21 Bit_04_Tap_H1 DO

22 Bit_05_Tap_H1 DO

23 Bit_06_Tap_H1 DO

24 Bit_07_Tap_H1 DO

25 Bit_08_Tap_H1 DO

26 Bit_09_Tap_H1 DO

27 Bit_10_Tap_H1 DO

28 Bit_11_Tap_H1 DO

29 Bit_12_Tap_H1 DO

32 LVAL_GH_2 DO

33 Bit_12_Tap_G2 DO

34 Bit_11_Tap_G2 DO

35 Bit_10_Tap_G2 DO

36 Bit_09_Tap_G2 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 88 / 109 Pin number Pin name Pin type(1)

37 Bit_08_Tap_G2 DO

38 Bit_07_Tap_G2 DO

39 Bit_06_Tap_G2 DO

40 Bit_05_Tap_G2 DO

41 Bit_04_Tap_G2 DO

42 Bit_03_Tap_G2 DO

43 Bit_02_Tap_G2 DO

44 Bit_01_Tap_G2 DO

45 Bit_00_Tap_G2 DO

47 Bit_00_Tap_H2 DO

48 Bit_01_Tap_H2 DO

49 Bit_02_Tap_H2 DO

50 Bit_03_Tap_H2 DO

51 Bit_04_Tap_H2 DO

52 Bit_05_Tap_H2 DO

53 Bit_06_Tap_H2 DO

54 Bit_07_Tap_H2 DO

55 Bit_08_Tap_H2 DO

56 Bit_09_Tap_H2 DO

57 Bit_10_Tap_H2 DO

58 Bit_11_Tap_H2 DO

59 Bit_12_Tap_H2 DO

61 N_CS_GH_1 DI

62 MISO_GH_1 DO

68 Load_Pulse_GH_1 DI

70 End_ADC_GH_1 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 89 / 109 Pin number Pin name Pin type(1) 79 Test_Mux_GH_1 Analogue Monitor - Leave n.c.

86 Pixel_CLK_GH_1 DO

87 VClamp_GH_1 VDDA

88 Sample_GH DI

89 RST_CDS_GH DI

90 RST_CVC_GH DI

91 N_CS_GH_2 DI

94 MISO_GH_2 DO

102 Load_Pulse_GH_2 DI

104 End_ADC_GH_2 DO

110 Test_Mux_GH_2 Analogue Monitor - Leave n.c.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 90 / 109 Pin number Pin name Pin type(1)

118 N_Reset_GH DI

119 Pixel_CLK_GH_2 DO

120 VClamp_GH_2 VDDA

(1) Explanation of abbreviations: DI Digital Input DO Digital Output

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 91 / 109

12.4 Connector signal assignment for Invar headboard variant DR6K7

Information: In this module, analogue and digital grounds are in separate nets. When providing proper decoupling to these signals, the noise parameters can be reduced to a minimum. The data pin order differs from the other variations but the sensor control signals are placed in the same pins. With this it is possible to control the sensor with the same electronics and only changing the data pins reassignment on the processing board. Table 40: Connector 1 pinout Pin number Pin name Pin type(1)

5 VSSD GND

6 VSSD GND

7 VSSA GND

15 VSSD GND

16 VSSD GND

17 VSSA GND

19 Test_Mux_AB_1 Analogue Monitor - Leave n.c.

22 VSSD GND

23 VSSD GND

25 VSSA GND

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 92 / 109 Pin number Pin name Pin type(1)

27 Not connected

39 VSSD GND

40 VSSD GND

41 VSSA GND

47 VSSD GND

48 VSSA GND

55 VSSD GND

56 VSSD GND

57 VSSA GND

61 VSSD GND

63 Not connected

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 93 / 109 Pin number Pin name Pin type(1)

64 Bit_00_Tap_B1 DO

65 Bit_01_Tap_B1 DO

66 Bit_02_Tap_B1 DO

67 Bit_03_Tap_B1 DO

68 Bit_04_Tap_B1 DO

69 Bit_05_Tap_B1 DO

70 Bit_06_Tap_B1 DO

71 Bit_07_Tap_B1 DO

72 Bit_08_Tap_B1 DO

73 Bit_09_Tap_B1 DO

74 Bit_10_Tap_B1 DO

75 Bit_11_Tap_B1 DO

76 VSSD GND

77 Bit_11_Tap_A2 DO

78 Bit_10_Tap_A2 DO

79 Bit_09_Tap_A2 DO

80 Bit_08_Tap_A2 DO

81 Bit_07_Tap_A2 DO

82 Bit_06_Tap_A2 DO

83 Bit_05_Tap_A2 DO

84 Bit_04_Tap_A2 DO

85 Bit_03_Tap_A2 DO

86 Bit_02_Tap_A2 DO

87 Bit_01_Tap_A2 DO

88 Bit_00_Tap_A2 DO

89 Not connected

91 VSSD GND

94 Bit_00_Tap_B2 DO

95 Bit_01_Tap_B2 DO

96 Bit_02_Tap_B2 DO

97 Bit_03_Tap_B2 DO

98 Bit_04_Tap_B2 DO

99 Bit_05_Tap_B2 DO

100 Bit_06_Tap_B2 DO

101 Bit_07_Tap_B2 DO

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 94 / 109 Pin number Pin name Pin type(1)

102 Bit_08_Tap_B2 DO

103 Bit_09_Tap_B2 DO

104 Bit_10_Tap_B2 DO

105 Bit_11_Tap_B2 DO

106 VSSD GND

107 Bit_11_Tap_E1 DO

108 Bit_10_Tap_E1 DO

109 Bit_09_Tap_E1 DO

110 Bit_08_Tap_E1 DO

111 Bit_07_Tap_E1 DO

112 Bit_06_Tap_E1 DO

113 Bit_05_Tap_E1 DO

114 Bit_04_Tap_E1 DO

115 Bit_03_Tap_E1 DO

116 Bit_02_Tap_E1 DO

117 Bit_01_Tap_E1 DO

118 Bit_00_Tap_E1 DO

120 VSSD GND

(1) Explanation of abbreviations: DI Digital Input DO Digital Output

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 95 / 109 Table 41: Connector 2 pinout Pin number Pin name Pin type(1)

1 VSSD GND

2 LVAL_EF_1 DO

3 Not connected DO

4 Bit_11_Tap_A1 DO

5 Bit_10_Tap_A1 DO

6 Bit_09_Tap_A1 DO

7 Bit_08_Tap_A1 DO

8 Bit_07_Tap_A1 DO

9 Bit_06_Tap_A1 DO

10 Bit_05_Tap_A1 DO

11 Bit_04_Tap_A1 DO

12 Bit_03_Tap_A1 DO

13 Bit_02_Tap_A1 DO

14 Bit_01_Tap_A1 DO

15 Bit_00_Tap_A1 DO

17 Not connected

18 Not connected

19 Not connected

20 Not connected

21 Not connected

22 Not connected

23 Not connected

24 Not connected

25 Not connected

26 Not connected

28 Not connected

29 Not connected

31 VSSD GND

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 96 / 109 Pin number Pin name Pin type(1)

46 VSSD GND

47 Bit_00_Tap_F1 DO

48 Bit_01_Tap_F1 DO

49 Bit_02_Tap_F1 DO

50 Bit_03_Tap_F1 DO

51 Bit_04_Tap_F1 DO

52 Bit_05_Tap_F1 DO

53 Bit_06_Tap_F1 DO

54 Bit_07_Tap_F1 DO

55 Bit_08_Tap_F1 DO

56 Bit_09_Tap_F1 DO

57 Bit_10_Tap_F1 DO

58 Bit_11_Tap_F1 DO

60 VSSD GND

61 N_CS_EF_1 DI

62 MISO_EF_1 DO

64 Not connected

65 VSSD GND

66 VSSD GND

67 VSSA GND

68 Load_Pulse_EF_1 DI

69 Not connected

70 End_ADC_EF_1 DO

71 Not connected

72 Not connected

73 Not connected

74 Not connected

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 97 / 109 Pin number Pin name Pin type(1)

75 VSSD GND

77 VSSA GND

78 Not connected

79 Not connected

80 Not connected

81 Not connected

82 VSSD GND

83 VSSD GND

85 VSSA GND

86 Pixel_CLK_EF_1 DO

87 Not connected

88 Sample_EF DI

89 RST_CDS_EF DI

90 RST_CVC_EF DI

91 ID_Chip

99 VSSD GND

100 VSSD GND

101 VSSA GND

106 VDDD 3.3V

107 VSSD GND

108 VSSA GND

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 98 / 109 Pin number Pin name Pin type(1) 114 VDDD 3.3V

115 VSSD GND

116 VSSD GND

117 VSSA GND

118 N_Reset_EF DI

(1) Explanation of abbreviations: DI Digital Input DO Digital Output

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 99 / 109 13.1 DR2K7 / DR2x2K7 / DR4K3.5 INVAR Figure 33: DR2K7 / DR2x2K7 / DR4K3.5 Invar package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 100 / 109

13.2 DR2K7 LCC ceramic

Figure 34: DR2K7 LCC ceramic package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 101 / 109

13.3 DR2x2K7 LCC ceramic

Figure 35: DR2x2K7 LCC ceramic package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 102 / 109 13.4 DR4K3.5 LCC ceramic Figure 36: DR4K3.5 LCC ceramic package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 103 / 109

13.5 DR4K7 INVAR

Figure 37: DR4K7 Invar package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 104 / 109 13.6 DR2x4K7 / DR8K3.5 INVAR Figure 38: DR2x4K7 / DR8K3.5 Invar package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 105 / 109

13.7 DR6K7 INVAR

Figure 39: DR6K7 Invar package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 106 / 109

13.8 DR8K7 INVAR

Figure 40: DR8K7 Invar package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice.

Package drawings & markings Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 107 / 109 13.9 DR2x8K7 / DR16K3.5 INVAR Figure 41: DR2x8K7 / DR16K3.5 Invar package outline drawing (1) All dimensions are in millimeters. Angles in degrees. (2) If not otherwise noted all tolerances are ±0.1 mm. (3) This package contains no lead (Pb). (4) This drawing is subject to change without notice. Information: For additional support on mechanical drawings, please contact the Technical Support Team

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 108 / 109 Document status Product status Definition Product Preview Pre-development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade Other definitions Draft / Preliminary: The draft / preliminary status of a document indicates that the content is still under internal review and subject to change without notice. ams-OSRAM AG does not give any warranties as to the accuracy or completeness of information included in a draft / preliminary version of a document and shall have no liability for the consequences of use of such information. Short datasheet: A short datasheet is intended for quick reference only, it is an extract from a full datasheet with the same product number(s) and title. For detailed and full information always see the relevant full datasheet. In case of any inconsistency or conflict with the short datasheet, the full datasheet shall prevail. Changes from previous released version to current revision v5-00 Page Updated pixel timing 39 - 45 Updated Figure 23 40

• Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
• Correction of typographical errors is not explicitly mentioned.

Datasheet • PUBLIC • Document Feedback DS000444 • v5-00 • 2025-Aug-29 109 / 109

15 Legal information

Copyright & disclaimer Copyright ams-OSRAM AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams-OSRAM AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams- OSRAM AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams-OSRAM AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams-OSRAM AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams-OSRAM AG for each application. This product is provided by ams-OSRAM AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams-OSRAM AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams- OSRAM AG rendering of technical or other services. Product and functional safety devices/applications or medical devices/applications: ams-OSRAM AG components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. ams-OSRAM AG products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using ams-OSRAM AG components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of ams-OSRAM AG immediately and ams-OSRAM AG and buyer and /or customer will analyze and coordinate the customer-specific request between ams-OSRAM AG and buyer and/or customer. ams OSRAM RoHS and REACH compliance statements for semiconductor products RoHS compliant: The term “RoHS compliant” means that semiconductor products from ams OSRAM fully comply with current RoHS directives, and China RoHS. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU2015/863) above the defined threshold limit in the Annex II. REACH compliant: Semiconductor products from ams OSRAM are free of Substances of Very High Concern (SVHC) according Article 33 of the REACH Regulation 2006/1907/EC; please refer to the Candidate List of Substances of ECHA here. Important information: The information provided in this statement represents ams OSRAM knowledge and belief as of the date that it is provided. ams OSRAM bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. We are undertaking efforts to better integrate information from third parties. ams OSRAM has taken and will continue to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams OSRAM and its suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Headquarters ams-OSRAM AG Tobelbader Strasse 30

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