27C020

AT27C020 ATMEL | Alldatasheet

Document overview

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Technical content

Features

• Fast Read Access Time - 55 ns
• Low Power CMOS Operation – 100 µA max. Standby – 25 mA max. Active at 5 MHz
• JEDEC Standard Packages – 32-Lead 600-mil PDIP – 32-Lead PLCC – 32-Lead TSOP
• 5V ± 10% Supply
• High-Reliability CMOS Technology – 2,000V ESD Protection – 200 mA Latchup Immunity
• Rapid™ Programming Algorithm - 100 µs/byte (typical)
• CMOS and TTL Compatible Inputs and Outputs
• Integrated Product Identification Code
• Commercial and Industrial Temperature Ranges

Description

The AT27C020 is a low-power, high performance 2,097,152-bit one-time programma- ble read only memory (OTP EPROM) organized as 256K by 8 bits. It requires only one 5V power supply in normal read mode operation. Any byte can be accessed in less than 55 ns, eliminating the need for speed reducing WAIT states on high perfor- mance microprocessor systems. In read mode, the AT27C020 typically consumes 8 mA. Standby mode supply current is typically less than 10 µA. Rev. 0570C-B–12/97 2-Megabit (256K x 8) OTP EPROM AT27C020 PDIP Top View VPP A16 A15 A12 GND VCC PGM A17 A14 A13 A11 OE A10 CE TSOP T op View Type 1 A11 A13 A14 A17 PGM VCC VPP A16 A15 A12 OE A10 CE GND PLCC T op View A14 A13 A11 OE A10 CE GND A12 A15 A16 VPP VCC PGM A17 Pin Configurations Pin Name Function A0 - A17 Addresses O0 - O7 Outputs CE Chip Enable OE Output Enable PGM Program Strobe

The AT27C020 is available in a choice of industry standard JEDEC-approved one-time programmable (OTP) plastic PDIP, PLCC, and TSOP packages. All devices feature two- line control (CE , OE) to give designers the flexibility to pre- vent bus contention. With 256K byte storage capability, the AT27C020 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. Atmel’s 27C020 have additional features to ensure high quality and efficient production use. The Rapid ™ Program- ming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these tran- sients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be uti- lized for each device. This capacitor should be connected between the V CC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the V CC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. Block Diagram

Absolute Maximum Ratings* Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to abso- lute maximum rating conditions for extended periods may affect device reliability. Note: 1. Minimum voltage is -0.6V DC which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is V CC + 0.75V DC which may overshoot to +7.0V for pulses of less than 20 ns. Voltage on Any Pin with Voltage on A9 with (1) VPP Supply Voltage with Operating Modes Notes: 1. X can be VIL or VIH. 2. Refer to Programming Characteristics. 4. T wo identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte. Mode/Pin CE OE PGM Ai V PP Outputs Read V IL VIL X(1) Ai X D OUT Output Disable X V IH XXX H i g h Z Standby V IH X XXX H i g h Z Rapid Program(2) VIL VIH VIL Ai V PP D IN PGM Verify V IL VIL VIH Ai V PP D OUT PGM Inhibit V IH XX X V PP High Z Product Identification(4) VIL VIL X A9 = VH (3) A0 = VIH or VIL A1 - A17 = VIL X Identification Code

AC Characteristics for Read Operation Note: 1. 2, 3, 4, 5. See AC Waveforms for Read Operation diagram. Symbol Parameter AT27C020 Units Condition Min Max Min Max Min Max Min Max Min Max tACC (3) Address to Output Delay CE =O E = VIL 55 70 90 120 150 ns tCE (2) CE to Output Delay OE = VIL 55 70 90 120 150 ns tOE (2)(3) OE to Output Delay CE = VIL 20 30 35 35 40 ns tDF (4)(5) OE or CE High to Output Float, whichever occurred first 18 20 20 30 40 ns t OH Output Hold from Address, CE or OE,whichever occurred first 77000 n s DC and AC Operating Conditions for Read Operation AT27C020 Operating T emperature (Case) Ind. -40 °C - 85C -40 °C - 85C -40 °C - 85C -40 °C - 85C -40 °C - 85C VCC Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% DC and Operating Characteristics for Read Operation Notes: 1. VCC must be applied simultaneously or before VPP , and removed simultaneously or after VPP . 2. VPP may be connected directly to VCC except during programming. The supply current would then be the sum of ICC and IPP . Symbol Parameter Condition Min Max Units ILI Input Load Current V IN = 0V to VCC (Com., Ind.) ±1.0 µA ILO Output Leakage Current V OUT = 0V to VCC (Com., Ind.) ±5.0 µA IPP (2) VPP (1) Read/Standby Current V PP = VCC ±10 µA ISB VCC (1) Standby Current ISB1 (CMOS), CE = VCC ± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1.0 mA ICC VCC Active Current f = 5 MHz, I OUT = 0 mA, CE = VIL 25 mA VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 V CC + 0.5 V VOL Output Low Voltage I OL = 2.1 mA 0.4 V VOH Output High Voltage I OH = -400 µA2 . 4 V

AC Waveforms for Read Operation(1) 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC . 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. Input Test Waveforms and Measurement Levels For -55 devices only: tR , tF < 5 ns (10% to 90%) For -70,-90,-12,-15 devices only: tR , tF < 20 ns (10% to 90%) 0.0V 3.0V 1.5V AC DRIVING LEVELS AC MEASUREMENT LEVEL Pin Capacitance f = 1 MHz, T = 25°C (1) Note: 1. T ypical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. Typ Max Units Conditions C IN 48 p F V IN = 0V C OUT 81 2 p F V OUT = 0V Output Test Load (1) Note: 1. CL = 100 pF including jig capacitance except -55 devices where CL = 30 pF .

Programming Waveforms (1) Notes: 1. The Input Timing reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the A T27C020, a 0.1 µF capacitor is required across VPP and ground to suppress voltage transients. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Symbol Parameter Test Conditions Limits UnitsMin Max ILI Input Load Current V IN = VIL, VIH ±10 µA VIL Input Low Level -0.6 0.8 V VIH Input High Level 2.0 V CC + 1.0 V VOL Output Low Voltage I OL = 2.1 mA 0.4 V VOH Output High Voltage I OH = -400 µA2 . 4 V ICC2 VCC Supply Current (Program and Verify) 40 mA IPP2 VPP Supply Current CE = PGM = VIL 20 mA VID A9 Product Identification Voltage 11.5 12.5 V

AC Programming Characteristics Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven — see timing diagram. 3. Program Pulse width tolerance is 100 µs ± 5%. Symbol Parameter Test Condition (1) Limits UnitsMin Max tAS Address Setup Time Input Rise and Fall Times: Input Pulse Levels: 0.45V to 2.4V Input Timing Reference Level: 0.8V to 2.0V Output Timing Reference Level: 0.8V to 2.0V 2 µs tCES CE Setup Time 2 µs tOES OE Setup Time 2 µs tDS Data Setup Time 2 µs tAH Address Hold Time 0 µs tDH Data Hold Time 2 µs tDFP OE High to Output Float Delay(2) 0 130 ns tVPS VPP Setup Time 2 µs tVCS VCC Set up Time 2 µs tPW PGM Program Pulse Width(3) 95 105 µs tOE Data Valid from OE 150 ns tPRT VPP Pulse Rise Time During Programming 50 ns Atmel’s 27C020 Integrated Product Identification Code Pins Codes A0 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 000011110 1 E D e v i c e T y p e 110000110 8 6

Rapid Programming Algorithm A 100 µ s PGM pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs PGM pulse without verification. Then a verification / reprogramming loop is executed for each address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been applied, the part is considered failed. After the byte verifies properly, the next address is selected until all have been checked. V PP is then lowered to 5.0V and VCC to 5.0V. All bytes are read again and compared with the origi- nal data to determine if the device passes or fails.

Ordering Information

(ns) ICC (mA) Ordering Code Package Operation RangeActive Standby 55 25 0.1 A T27C020-55JC A T27C020-55PC A T27C020-55TC 32J 32P6 32T Commercial (0°C to 70°C) 25 0.1 A T27C020-55JI A T27C020-55PI A T27C020-55TI 32J 32P6 32T Industrial (-40°C to 85°C) 70 25 0.1 A T27C020-70JC A T27C020-70PC A T27C020-70TC 32J 32P6 32T Commercial (0°C to 70°C) 25 0.1 A T27C020-70JI A T27C020-70PI AT27C020-70TI 32J 32P6 32T Industrial (-40°C to 85°C) 90 25 0.1 A T27C020-90JC A T27C020-90PC A T27C020-90TC 32J 32P6 32T Commercial (0°C to 70°C) 25 0.1 A T27C020-90JI A T27C020-90PI AT27C020-90TI 32J 32P6 32T Industrial (-40°C to 85°C) 120 25 0.1 A T27C020-12JC A T27C020-12PC A T27C020-12TC 32J 32P6 32T Commercial (0°C to 70°C) 25 0.1 A T27C020-12JI A T27C020-12PI A T27C020-12TI 32J 32P6 32T Industrial (-40°C to 85°C) 150 25 0.1 A T27C020-15JC A T27C020-15PC A T27C020-15TC 32J 32P6 32T Commercial (0°C to 70°C) 25 0.1 A T27C020-15JI A T27C020-15PI A T27C020-15TI 32J 32P6 32T Industrial (-40°C to 85°C) Package Type 32J 32-Lead,Plastic J-Leaded Chip Carrier (PLCC) 32P6 32-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32T 32-Lead, Plastic Thin Small Outline Package (TSOP)