209-3SURSYGW-S530-A3 EVERLIGHT | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

Features

  • Two chips are matched for uniform light output, wide viewing angle
  • Long life-solid state reliability
  • I.C. compatible/Low power consumption
  • Pb free
  • The product itself will remain within RoHS compliant version
  • Compliance with EU REACH
  • Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm)

Description

  • The 209-3LED lamp contain two integral chips and is available as both bicolor and bipolar types.
  • The Brilliant Red and Brilliant Yellow Green light is emitted by diodes of AlGaInP and AlGaInP .
  • Type of bipolar lamps are both White Diffused and Water Clear while the bicolor are White Diffused.

Applications

  • TV set
  • Monitor
  • Telephone
  • Computer

Materials Emitted Color Resin Color AlGaInP Brilliant Red White Diffused AlGaInP Brilliant Yellow Green Absolute Maximum Ratings (Ta=25 ℃℃℃℃) Parameter Symbol Rating Unit Continuous Forward Current I F SUR 25 mA SYG 25 Peak Forward Current (Duty 1/10 @ 1KHZ) IFP SUR 60 mA SYG 60 Reverse Voltage V R 5 V Power Dissipation Pd SUR 60 mW SYG 60 Operating Temperature T opr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature T sol 260 ℃ for 5 sec. Electro-Optical Characteristics (Ta=25 ℃℃℃℃) Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF SUR 1.7 2.0 2.4 V I F=20mA SYG 1.7 2.0 2.4 Reverse Current IR SUR ----- ----- 10 μ A VR=5V SYG ----- ----- 10 Luminous Intensity IV SUR 25 50 ---- mcd I F=20mA SYG 10 20 ---- Viewing Angle 2θ1/2 SUR ---- 80 ---- deg I F=20mA SYG ---- 80 ---- Peak Wavelength λ p SUR ---- 632 ---- nm I F=20mA SYG ---- 575 ---- Dominant Wavelength λ d SUR ---- 624 ---- nm I F=20mA SYG ---- 573 ---- Spectrum Radiation Bandwidth △λ SUR ---- 20 ---- nm I F=20mA SYG ----- 20 ----

Typical Electro-Optical Characteristics Curves SUR Relative Intensity vs. Wavelength (Ta=25 ℃℃ ℃℃ ) Directivity (Ta=25 ℃℃ ℃℃ ) Relative Intensity (a.u.) Radiation Angle Wavelength (nm) Relative Intensity (a.u.) Forward Current vs. Forward Voltage (Ta=25 ℃℃ ℃℃ ) Relative Intensity vs. Forward Current (Ta=25 ℃℃ ℃℃ ) Forward Current (mA) Relative Intensity(a.u.) 0 5 10 15 20 25 0.0 0.5 1.0 1.5 Forward Voltage (V) Forward Current (mA) Relative Intensity vs. Ambient Temp. Forward Current vs. Ambient Temp. Relative Intensity (a.u.) 25 30 35 40 45 50 55 60 65 70 0.0 0.5 1.0 1.5 2.0 Forward Current (mA) 0 20 40 60 80 100 Forward Current (mA) Ambient Temperature Ta (℃)

Relative Intensity vs. Wavelength (Ta=25 ℃℃ ℃℃ ) Directivity (Ta=25 ℃℃ ℃℃ ) Relative Intensity (a.u.) Radiation Angle Wavelength (nm) Relative Intensity (a.u.) Forward Current vs. Forward Voltage (Ta=25 ℃℃ ℃℃ ) Relative Intensity vs. Forward Current (Ta=25 ℃℃ ℃℃ ) Forward Current (mA) Relative Intensity(a.u.) 0 5 10 15 20 25 0.0 0.5 1.0 1.5 Forward Voltage (V) Forward Current (mA) Chromaticity Coordinate vs. Forward Curren t(Ta=25 ℃℃ ℃℃ ) Forward Current vs. Ambient Temp. Relative Intensity (a.u.) 25 30 35 40 45 50 55 60 65 70 0.0 0.5 1.0 1.5 2.0 Forward Current (mA) 0 20 40 60 80 100 Forward Current (mA) Ambient Temperature Ta (℃)

Note: Note: 1. All dimensions are in millimeters 2. The height of flange must be less than 1.5mm(0.059"). 3. Without special declared, the tolerance is ±0.25mm. 1 2 3 1 2 3

E L E C T R O S T A T I C E L E C T R O N A G N E T I C M A G N E T I C O R R A D I O A C T I V E R E L D S a n t i - s t a t i c f o r 7 5 0 Moisture Resistant Packing Materials Label Explanation ‧ CPN: Customer’s Production Number ‧ P/N : Production Number ‧ QTY: Packing Quantity ‧ CAT: Ranks of Luminous Intensity and Forward Voltage ‧ HUE: Color Rank ‧ REF: VF ‧ LOT No: Lot Number Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton RoHS Pb XEVERLIGHT 209-3SURSYGW/S530-A3 ■ Packing Quantity

1.500 PCS/1 Bag, 4 Bags/1 Inner Carton

  1. 10 Inner Cartons/1 Outside Carton
  1. Lead Forming /square6 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. /square6 Lead forming should be done before soldering. /square6 Avoid stressing the LED package during leads formin g. The stress to the base may damage the LED’s chara cteristics or it may break the LEDs. /square6 Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs. /square6 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage /square6 The LEDs should be stored at 30° C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed co ntainer with a nitrogen atmosphere and moisture absorbent material. /square6 Please avoid rapid transitions in ambient temperatu re, especially, in high humidity environments where condensation can occur. 3. Soldering /square6 Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder jo int to epoxy bulb, and soldering beyond the base of the tie bar is recommended. Recommended soldering conditions: Hand Soldering DIP Soldering Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max Distance 3mm Min.(From solder joint to epoxy bulb) Distance 3mm Min. (From solder joint to epoxy bulb) /square6 Recommended soldering profile /square6 Avoiding applying any stress to the lead frame whi le the LEDs are at high temperature particularly when soldering. /square6 Dip and hand soldering should not be done more tha n one time /square6 After soldering the LEDs, the epoxy bulb should be p rotected from mechanical shock or vibration until the LEDs return to room temperature. /square6 A rapid-rate process is not recommended for coolin g the LEDs down from the peak temperature. /square6 Although the recommended soldering conditions are s pecified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs.

/square6 Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning /square6 When necessary, cleaning should occur only with is opropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. /square6 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED 5. Heat Management /square6 Heat management of LEDs must be taken into consider ation during the design stage of LED application. Th e current should be de-rated appropriately by referring to the de-rating curve found in each product specification. /square6 The temperature surrounding the LED in the applicat ion should be controlled. Please refer to the data s heet de-rating curve. 6. ESD (Electrostatic Discharge) /square6 The products are sensitive to static electricity o r surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials /square6 Proper grounding is required for all devices, equip ment, and machinery used in product assembly. Surge protection should be considered when designing of commercial products. /square6 If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers 7. Directions for use /square6 The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjected to forward or reverse voltage while it is off. If r everse voltage is continuously applied to the LEDs, it may cause migration resulting in LED damage. 8. Other /square6 Above specification may be changed without notice. EVERLIGHT will reserve authority on material change fo r above specification. /square6 When using this product, please observe the absolu te maximum ratings and the instructions for using o utlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. /square6 These specification sheets include materials prote cted under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.