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D esign G uide & A pplications M anual For M axi, M ini, M icro Fam ily D C-D C Converters and Configurable P ow er Supplies M axi, M ini, M icro D esign G uide Rev 4 .8 vicorpow er.com Page 76 of 8 8 A pps. Eng. 8 00 9 27.9 4 74 8 00 73 5 .6200 1 6. Through-hole Socket M ount System (InM ate) InM ates are an innovative solution for through-hole socket requirem ents. Consisting of individual plastic carriers for the input and the output, each contains an array of sockets for either a full, half or quarter-brick sized m odule. T he sockets are factory loaded into the carrier, w hich holds them rigidly in place throughout the assem bly and soldering process. T he carriers are later rem oved, leaving the sockets accurately positioned. D esigned for use w ith pin-com patible M axi, M ini, and M icro Fam ily converters, InM ates are available for a w ide range of P CB sizes and m ounting styles. P CB thicknesses can range from 0.05 5 " (1,39 m m ) to 0.137 5 " (3,49 m m ). Sockets also allow for m ounting m odules either inboard, w ith a cutout in the P CB for the m odule, to m inim ize the height above the board, or onboard. InM ates are com pati - ble w ith the M oduM ate or RoHS pin style. InM ates are available in standard recyclable JE D E C style trays for use w ith autom ated pick-and-place equipm ent and are com patible w ith m ost standard w ave or hand solder operations. T he sockets are soldered into the board as part of the P CB assem bly process. T he m odule can then be plugged into place at anytim e later. N O TE: Please refer to Section 1 3 of the design guide for the InM ate soldering procedure. Insert  Solder  Rem ove Carrier  Insert M odule  Figure 16–1 — InM ate carrier / socket assem bly and soldering process

D esign G uide & A pplications M anual For M axi, M ini, M icro Fam ily D C-D C Converters and Configurable P ow er Supplies M axi, M ini, M icro D esign G uide Rev 4 .8 vicorpow er.com Page 77 of 8 8 A pps. Eng. 8 00 9 27.9 4 74 8 00 73 5 .6200 1 6. Through-hole Socket M ount System (InM ate) Board Thickness Full Brick (M axi) H alf Brick (M ini) Q uarter Brick (M icro) N orm . M ounting Input O utput 5 Sets Input O utput 5 Sets Input O utput 5 Sets Pin (M in. / M ax.) Style Style 0.06 2" Inboard 1837 4 18382 1836 2 1837 4 18384 1836 6 1837 6 18386 1837 0 S or F (0.05 5 " / 0.07 1" ) 1,5 m m O nboard 1837 8 18388 1836 4 1837 8 1839 0 1836 8 18380 1839 2 1837 2 N or G (1,4 m m / 1,8 m m ) 0.09 3 " Inboard 1837 5 18383 1836 3 1837 5 18385 1836 7 1837 7 18387 1837 1 S or F (0.084" / 0.104" ) 2,4 m m O nboard 1837 9 18389 1836 5 1837 9 1839 1 1836 9 18381 1839 3 1837 3 N or G (2,1 m m / 2,6 m m ) 0.125 " O nb oard 215 39 215 43 215 10 215 39 215 44 215 11 215 40 215 45 215 12 N or G (0.1125 " /0.137 5 " ) 3,1 m m (2,8 m m / 3,5 m m ) 1. Select Board Thickness. Nom inal 0.06 2" (1,5 m m ) , 0.09 3" (2,4 m m ) or 2. Select M ounting Style. Inboard requires a P CB cutout for the “belly” of the m odule. See dotted lines in P CB draw ing links on P age 80 for cut out area. 3. Identify M odule Type. Full brick (M axi), half brick (M ini) or quarter brick (M icro). 4. Select the O rdering Part N um ber. O rder packages of five input / output sets or in higher quantities order input and output InM ates separately. For individual input or output InM ates, m inim um orders of 35 for M axi or M ini and 40 for M icro apply. 5 . Verify Correct Pin Style for the M odule. For predefined parts, “S” or “F”= short M oduM ate and “N” or “G ”= long M oduM ate See Table 16 –4 for standoff recom m endations. Table 16–1 — G uide to InM ate selection InM ate: Through-hole Sockets

D esign G uide & A pplications M anual For M axi, M ini, M icro Fam ily D C-D C Converters and Configurable P ow er Supplies M axi, M ini, M icro D esign G uide Rev 4 .8 vicorpow er.com Page 78 of 8 8 A pps. Eng. 8 00 9 27.9 4 74 8 00 73 5 .6200 1 6. Through-hole Socket M ount System (InM ate) Table 16–2 — InM ate specifications and m aterials Table 16–3 — M aterial properties of InM ate com ponents Param eter Specification Value Reference Com patibility F = short Au plated Short RoHS pins M odule pin styles S = short Au plated Short M oduM ate pins G = long Au plated Long RoHS pins N = long Au plated Long M oduM ate pins M echanical Contact norm al force 100 gram s E O L m in. G R-1217 -CO RE , R5 -23 Num ber of m ating cycles 5 m ax. (Note4) E xception to G R-1217 -CO RE w hich specifies 25 m ating cycle M odule engagem ent force 32 lbs per connector m ax. G R-1217 -CO RE , R5 -31,32 M odule disengagem ent force 32 lbs per connector m ax. G R-1217 -CO RE , R5 -31,32 E lectrical Current rating for output pin sockets 5 0 A M axi (Note1) / 5 0 A M ini / 25 A M icro G old plating standards, and (B ased on 248°F (120°C) m ax socket tem p. & accepted industry standards 86 °F (30°C) m ax tem perature rise of contact) such as IICIT, E IA, B ellcore guidelines Low level contact resistance 0.080" (2,03 m m ) dia socket (LLCR) 400 µ Ω m ax. G R-1217 -CO RE , 6 .2.1 Low level contact resistance 0.15 0" (3,81 m m ) dia socket (LLCR) 300 µ Ω m ax. G R-1217 -CO RE , 6 .2.1 Low level contact resistance 0.180" (4,5 7 m m ) dia sockets (LLCR) 200 µ Ω m ax. G R-1217 -CO RE , 6 .2.1 Therm al M ax continuous use M ax socket tem perature 248°F (120°C) m ax. tem perature for gold plating Tem perature rise 86 °F (30°C) m ax. G R-1217 -CO RE (Note3) E IA-36 4-7 0A (Note2) E nvironm ental InM ate products are tested in random vibration environm ents to best sim ulate the broad spectrum Shock and vibration of frequencies and am plitudes that m ay be encountered in typical applications. Actual system resonant frequencies w ill depend on P CB construction and m ounting details. For critical, or unusual, shock and vibration environm ents, the perform ance of the system should be independently verified. M aterials Ratings H eaders M aterial: Ryton T M R–7 P P S, 6 5 % glass fiber and m ineral filled com pound P oly-P henylene Sulfide Flam m ability UL9 4 V-0/5 VA T herm al stability (short term ) 5 00°F (26 0°C) T herm al stability (long term ) 39 2°F (200°C) Solder Cap M aterial 305 stainless steel P lating Clear passivate to repel solder Sockets B rush W ellm an Alloy # 25 M aterial C17 200 deep draw quality or equiv. 0.010" thick P lating W oods nickel strike follow ed by 5 0 µ in. m in. low stress sulfam ate-based electrolytic nickel, follow ed by 20 µ in m in hard gold follow ed by 10 µ in. m in. soft gold (Note1) For 80 A operation w ith M axi, contact Applications E ngineering. (Note2) G R-1217 -CO RE issue 1, Novem ber 19 9 5 G eneric requirem ents for separable electrical connectors used in telecom m unications hardw are. A m odule of NE B SFR, FR-206 3 (Note3) ANSI/E IA-36 4 Am erican National Standards Institute / E lectronic Industries Association (E lectronic Com ponents, Assem blies & M aterials Association) (Note4) T he m odule and socket m ust be replaced after 5 m ating cycles. (1) For 80 A operation w ith M axi, contact Applications E ngineering.

D esign G uide & A pplications M anual For M axi, M ini, M icro Fam ily D C-D C Converters and Configurable P ow er Supplies M axi, M ini, M icro D esign G uide Rev 4 .8 vicorpow er.com Page 79 of 8 8 A pps. Eng. 8 00 9 27.9 4 74 8 00 73 5 .6200 1 6. Through-hole Socket M ount System (InM ate) InM ate P CB layout draw ing for M axi M odule http://asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 4 00&ct=PD F InM ate P CB layout draw ing for M ini M odule http://asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 3 9 9 &ct=PD F InM ate P CB layout draw ing for M icro M odule http://asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 3 9 8 &ct=PD F InM ate and Socket outline draw ing for Inboard M axi M odules http:// asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 4 8 3 -XX&ct=PD F InM ate and Socket outline draw ing for Inboard M ini M odules http:// asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 4 8 2-XX&ct=PD F InM ate and Socket outline draw ing for Inboard M icro M odules http:// asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 4 8 1-XX&ct=PD F InM ate and Socket outline draw ing for O nboard M axi M odules http:// asp.vicorpow er.com /cadU til/display_cad.asp? pn=18 4 8 0-XX&ct=PD F InM ate and Socket outline draw ing for O nboard M ini M odules http:// asp.vicorpow er.com /cadU til/display_cad.asp? pn=2003 0-XX&ct=PD F InM ate and Socket outline draw ing for O nboard M icro M odules http://vdac2.vicr.com /cadU til/display_cad.asp? pn=20029 -XX&ct=PD F References Standoff Kits for InM ate M ounted M odules* Board Thickness Slotted Baseplate Through-H ole Baseplate Threaded Baseplate N om . M ounting Through-H ole Threaded Through-H ole Threaded Through-H ole (M in. / M ax.) Style H eat Sink H eat Sink H eat Sink H eat Sink H eat Sink 0.06 2" Inboard Ki t-1815 3 Ki t-1815 4 Ki t-18148 Ki t-18149 Ki t-18148 (0.05 5 " / 0.07 1" ) B a g-19 129 B a g-19 130 B a g-19 124 B a g-19 125 B a g-19 124 1,5 m m (1,4 m m /1,8 m m ) O nboard Ki t-1815 8 Ki t-1815 9 Ki t-1815 3 Ki t-1815 5 Ki t-1815 3 B a g-19 134 B a g-19 135 B a g-19 129 B a g-19 131 B a g-19 129 0.09 3" Inboard Ki t-1815 3 Ki t-1815 4 Ki t-18148 Ki t-18149 Ki t-18148 (0.084" / 0.104" ) B a g-19 129 B a g-19 130 B a g-19 124 B a g-19 125 B a g-19 124 2,4 m m (2,1 m m /2,6 m m ) O nboard Ki t-1815 6 Ki t-1815 7 Ki t-1815 0 Ki t-1815 2 Ki t-1815 0 B a g-19 132 B a g-19 133 B a g-19 126 B a g-19 128 B a g-19 126 0.125 " O nb oard Ki t - 2405 4 Ki t-1815 7 Ki t-2405 6 Ki t - 1815 2 Kit -2405 6 (0.113" / 0.138" ) B a g-19 132 B a g-19 133 B a g -19 126 B a g - 19 128 B ag-19 126 3,1 m m Used in facilitating the proper extraction of m odules from InM ate or SurfM ate sockets. Rem oval w ithout using the E xchange Tool m ay cause dam age to the sockets. D escription Part N um ber M axi E xchange Tool 22827 M ini E xchange Tool 22828 M icro E xchange Tool 22829 22827 22829 22828 M odule E xchange Tool Table 16–4 — InM ate standoff recom m endations * Kits include six (6 ) standoffs and screw s. M ini and M icro m odules require a m inim um of four (4) standoffs. B ags of one hundred (100) do not include screw s; # 4-40 thread hardw are required.