ERA-3YEB361V PANASONIC | Alldatasheet
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Issue No. : 151ERA011011 Date of Issue : Classification : New Changed : Metal Film (Thin Film)Chip Resistors (RoHS Compliance) : JAPAN : Standard electronic equipment *If you approve this specification, please fill in and sign the below and return 1 copy to us. Approval No : Approval Date : Executed by : (signature) Title : Dept. : Circuit Components Business Unit Prepared by : Engineering Section Panasonic Electronic Devices Co., Ltd. Contact Person : Signature 401 Sadamasa-cho, Name(Print) H.Yabukoshi Fukui City 910-8502 Japan Title : Authorized by : Phone : +81-776-56-8034 Signature Name(Print) T.Iseki Title : Manager of Engineering February 15.2011 Digi-Key
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PRODUCT SPECIFICATION FOR APPROVAL Product Description Product Part Number Country of Origin
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－1 Panasonic Electronic Devices Co., Ltd. 1. Dimension L W a b t mm inch 1.60±0.15 0.63±.006 0.80±0.20 .031±.008 0.30±0.20 .012±.008 0.30±0.20 .012±.008 0.45±0.10 .018±.004 2. Power deratimg Curve 120 100 -55 -40 0 40 80 120 140 160 125 Rated Load(%) 3. Ratings Item Rated value Explanation Rated power 0.10 W (at 70 °C or lower) When used at ambient temperture over 70°C, the load power should be reduced as shown in Flg.1 Flg.1 Ambient Temperature (°C) Category temperature range -55~+125°C L a a W t b b (1) Substrate Alumina (2) Protective coating Epoxy resin (3) Resistive element NiCr alloy (4) Inner termination special termination (5) Between termination Ni plating (6) Outer termination Sn plating
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－2 Panasonic Electronic Devices Co., Ltd. Rated voltage Limiting element voltage The rated voltage of each resistance should be calculated from the equation below, and when the rated voltage exceeds the ｌimiting element voltage, the ｌimiting element voltage should be the rated voltage. L i m i t i n g e l e m e n t v o l t a g e ; 7 5 V E : Rated voltage (V) P : Rated power (W) R : Rated resistance value (Ω) Tolerance for resistance Resistance range E-96 series :special When E-96 series overlap E-24 series, E-24 series Should be the first priority 4. Explanation of Part Number (1) Product Code : Metal Film Chip Resistors (2) Size and Rated Power : 1.6 mm x 0.8 mm, 0.10W (3) Series and marking Code Series Marking Y E-24 series 3 digit marking E E-96 series No marking (4) T.C.R. Code T.C.R. Resistance range Η ± 50x10 -6/°C 10Ω ~ 97.6Ω Ε ± 25x10 -6/°C 100Ω ~ 33 kΩ Κ ±100x10-6/°C 33.2k Ω ~ 330kΩ (5)Resistance Tolerance Code Resistance Tolerance D +/- 0.5% B +/- 0.1% (6) Resistance Value <E-24 series> 3-digits type 123 →12×103 →12kΩ <E-96 series> 4-digits type 3012 → 301×102 → 30.1kΩ (7) Packaging Configuration Code Packaging Configuration V Taping (5000pcs/reel) Code. Tolerance for resis. D ± 0.5% B ± 0.1% Tolerance Resistance range Series D 10 Ω ~330k Ω E-24 B 100Ω ~33k Ω E-24 E R A 3 Y E D 1 0 2 V RPE ×=
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－3 Panasonic Electronic Devices Co., Ltd. 5. Appearance & Construction Item Rated value Explanation Appearance & Construction 1. The resistive element should be covered with protective coating that don’t fade easily. The surface of coating should avoid unevenness, flaw, pinhole and discoloration. 2. The electrode should be printed uniformly, as shown in the dimensions. The plating should not fade easily, and should avoid unevenness, flaw, pinhole, projection and discoloration. 3. The electrode should be connected electrically, mechanically to resistive element. As far as there shall not designation especially, the following test and measurement shall be operated under normal temperature (15~35°C), normal humidity(25~75%), normal atmospheric pressure( 6. Performance Specification Specifications Item Chip Resistor Explanation DC Resistance DC Resistance value shall be within the specified tolerance At 20°C, 65%RH Temperature Coefficient Natural resistance change per Temperature degree centigrade. 6101)t21(tR 1R2R ×− R1 : Resistance value at reference temperature(t1) R2 : Resistance value at test temperature(t2) t2 – t1 = 100°C t1 = 25°C Short-time overload ± ( 0 . 5 % + 0 . 1Ω) Resistors shall be applied 2.5 times the rated voltage for 5 seconds. However, the upper limit of the voltage in the test shall be 150V. Dielectric Withstanding No evidence of flashover, mechanical damage, arcing or insulation break- down Insulation Resistance Min.1,000MΩ AC 100V between substrate and termination for 1 min. Resistors shall be facing down. After applying DC 100V to the resistor, insulation resistance shall be measured. Resit. range TCR 10Ω 100Ω 33.2kΩ ~330k Ω ±100x10-6/°C (10-6/℃) AC powersupply or Insulation resistance
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－4 Panasonic Electronic Devices Co., Ltd. 7. Mechanical characteristic Specifications Item Chip Resistor Explanation Without distinct deforma- tion in appearance Bond strength of the face plating ± (0.5 % + 0.05Ω) Substrate : Glass epoxy(t=1.6mm) Span : 90mm Bending distance :3mm (10 seconds) Solderability Termination should be covered uniformly with solder (min. 95% coverage) Resistors shall be dipped in the melted sol- der bath at 5235 ± °C for 5.02 ± sec. Flux shall be removed from the surface of termination with clean organic solvent. Resistance to Soldering Heat ± (0.5 % + 0.05Ω) Resistors shall be dipped in the melted solder bath at 3270 ± °C for 110 ± °C sec. Without distinct deformation in appearance Resistance to Solvent ± (0.5 % + 0.05Ω) olvent solution : Isopropyl alcohol (1)Dipping 10 +/- 1 hours, dry in room condition for 30 +/- 10 minutes. (2)Ultrasonic wave washing : 5 +/- 1 min. (0.3W/cm 2,28kHz) Dry in room condition for 30 +/-10 minutes. (unit: mm) 100 1.0 1.0 1.01
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－5 Panasonic Electronic Devices Co., Ltd. 8. Environment Test Specifications Item Chip Resistor Explanation High Temperature Exposure ± (0.5 % + 0.05Ω) Resistors shall be exposed at125±3°C for 1000 48 0± hours. Rapid change of temperatrure ± (0.5 % + 0.05Ω) 355 ±− °C 30minutes Normal Within 3minutes 5 cycles 3125 ± °C 30minutes Damp heat , Steady State ± (0.5 % + 0.05Ω) Resistors shall be exposed at 60±2°C and 90~95% relative humidity in a humidity test chamber for 1000 48 0± hours. Load Life ± (1.0 % + 0.1Ω) Resistors shall be exposed at 70±2°C and 1000 48 0± hours. During this time. The rated voltage shall be applied intermit- tently for 1.5 hours ON,0.5 hours OFF. Load Life in Humidity ± (1.0 % + 0.1Ω) Resistors shall be exposed to at 40±2°C and 90~95% relative humidity for 1000 48 0± hours. During this time the rated voltage shall be applied intermittently for 1.5 hours ON,0.5 hours OFF. 9. Marking Express resistance value on re sin side with three digits. (For example) 101 100 Ω The first two digits are significant figures of resistance and the third one denotes number of zeros following. E-96 series: No marking
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－6 Panasonic Electronic Devices Co., Ltd. 10. Common Precautions in Handling Resistors ! Notice for use (1) This specification shows the quality and performance of a unit component. Before adoption, be sure to evaluate and verify the product mounting it in your product. (2) We take no responsibility for troubles caused by the product usage that is not specified in this specification. (3) In advance-notification to us is required in case yo u demand high reliability in the resistors because there is a possibility that a trouble or a failure in our resistor which is used in your transportation units (e.g. Trains, cars, ships, traffic signal equipment etc.), ocean floor-equipment, medical equipment, aerospace equipment, electrothermal goods, combustion and gas equipment, power station control equipment, information control equipment, rotating equipment, disaster and crime preventive equipment, various safety devices, and the equivalent equipment may cause critical damage occurrence such as loss of life or property. In addition, use fail-safe design as mentioned bel ow for preventing extensive damage and for ensuring the safety: *Ensure safety by the system in which the protective circuits and/or protective equipment are installed. *Ensure safety by the system in which a single failure does not cause unsafety by installing such as redundant circuits. (4) When a dogma shall be occurred about safety fo r this product, be sure to inform us rapidly, operate your technical examination. (5) The product is designed to use in general standard applications of general electric equipment (AV products, household electric appliances, office equipment, information and communication equipment, etc.); hence, it do not take the use under the following special environments into consideration. Accordingly, the use in the following special environments, and such environmental conditions may affect the performance of the product; prior to use, verify the performance, reliability, etc. thoroughly. 1) Use in liquids such as water, oil, chemical, and organic solvent. 2) Use under direct sunlight, in outdoor or in dusty atmospheres. 3) Use in places full of corrosive gases such as sea breeze, Cl 2, H2S, NH3, SO2, and NOX. 4) Use in environment with large static electricity or strong electromagnetic waves or strong radial ray. 5) Where the product is close to a heating component, or where an inflammable such as a polyvinyl chloride wire is arranged close to the product. 6) Where the resistor is sealed or coated with resin etc. 7) Where solvent, water, or water-soluble detergent is used in cleaning free soldering and in flux cleaning after soldering. (Pay particular attention to water-soluble flux.) 8) Use in such a place where the product is wetted due to dew condensation. (6) If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with re sistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power and rated voltage. Temperature of resistors may become high even with specified conditions. Please confirm safety of heat from resistors on print circuit board and components around them. When the product shall be used under special condition, be sure to ask us in advance. (7) Halogen type (Chlorine type, Bromine type, etc.) or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. Strong acid flux, water soluble-flux and flux including fluorine ion shall not be used. (8) When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering ir on with a tip at high temperature, solder for a time as short as possible. (three seconds or less up to 350 deg.C) (9) Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistor’s performance. (10) Avoid immersion of chip resistor in solvent for long time. Use solvent after the effect of immersion is confirmed.
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－7 Panasonic Electronic Devices Co., Ltd. 11. Storage Method If the product is stored in the following environments and conditions, the performance and solderability may be badly affected, avoid the storage in the following environments. (1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX. (2) Storage in places exposed to direct sunlight. (3) Storage in places outside the temperature range of 5 oC to 35 oC and humidity range of 45 %RH to 85 %RH. (4) The period of guarantee for performance such as solderability is 1 year after our delivery; and this condition applies only to the case where the storage method specified in item (1) to (3) has been followed. 12. Laws and Regulations (1) This product has not been manufactured with any ozone-depleting chemical controlled under the Montreal Protocol. (2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous substances in electrical and elect ronic equipment (DIRECTIVE 2002/95/EC)). (3) All materials used in this part are registered material under the Law Concerning the examination and Regulation of Manufacturs, etc. of Chemical substances. (4) All the materials used in this part contain no brominated materials of PBBOS or PBBS as the flame-retardant. (5) If you need the notice by letter of “A preliminary judgement on the laws of Japan foreign exchange and foreign trade control”, be sure to let us know. 13. Production Site Country: Japan Plant: Panasonic Electronic Devices Japan Co., Ltd.
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－8 Panasonic Electronic Devices Co., Ltd. 14. Tape and Reel Package 14.1 Structure and reel dimensions shall be as shown in the figure below. Inaccordance with EIAJ ET-7200.
14.2 Carrier Tape Dimensions
T Do P1 P2 P0 A B F E W Sprocket hole Chip resistorChi p hole A B W F E P1 P2 P0 D0 T 01.50 ± 0.70±0.05 0.059 ± .028±.002
14.3 Tapping specifications
14.3.1 Taping
(1) Minimum Bending Radius There shall be no defection of chip and no breakage of carrier tape in case carrier tape have been bent by minimum bending radius (15mm). Test shall be conducted for 1 time. (2) Resistance to climate of top tape The top tape shall not tear off after exposure at 60 oC, 90 %RH to 95 %RH for 120 h. (3) Peeling strength Peeling strength shall be within 0.049 N to 0.49 N. There shall be no burr or breakage after test. Test method is as follows: Carrier tape Top tape Adhesive tape Unit : mm Min. 60.0 11.4 +/- 9.0 +/- 1.0 180.0 +0 / 13.0 +/- 1.0 Min. 60.0
Spec. No. Subject Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION 151-SRA-E102RPart No. E R A 3 10－9 Panasonic Electronic Devices Co., Ltd. <Test Methods> 14.3.2 Quantity in Taping: 5000 pcs. /reel
14.3.3 Tape packaging
(1) Resistance side shall be facing upward. (2) Chip resistor shall not be sticking to top tape and bottom tape. (3) Chip resistor shall be easy to take out from carrier tape and chip hole or sprocket hole shall not have flash and break.
14.4 Outer Packaging
Quantity: 20 reels (Max. 100,000pcs.) * When taping shall not reach Max. or quantity, the remaining empty space shall be buried with buffer material. * When the quantity shall be few, alternative packaging methods may be used. No problem must occur during the exportation of the product.
14.5 Marking (Label)
Items listed below shall be displayed. (1) Side of reel (Marking shall be on one side) 1)Part name, 2)Part number, 3)Quantity, 4)Lot number, 5)Maker name, 6) Production country (2)Packaging box 1)Customer name, 2)Part name, 3)Part number, 4)Customer part number, 5)Quantity. 6)Maker name, 7)Production country Peeling directionCarrier tape Top tape 10 o Tape Marking