ZXMP3F30FH overview

ZXMP3F30FH is a component documented by Diodes Incorporated. The PDF description identifies it as "30V SOT23 P-CHANNEL ENHANCEMENT MODE MOSFET AUGUST 2008." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.

Datasheet snapshot

  • Manufacturer: Diodes Incorporated
  • Part number: ZXMP3F30FH
  • Category: IC
  • Datasheet length: 8 Pages

Specifications and operating details

The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.

  • ZXMP3F30FH NEW PRODUCT P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary V(BR)DSS RDS(on) max ID TA = +25°C -30V 80mΩ@ VGS = -10V -4.0A 140mΩ@ VGS =-4.5V  This new generation Trench MOSFET is designed to minimize the on- state resistance.
  • Mechanical Data  Package: SOT23  Package Material: Molded Plastic, “Green” Molding Compound UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish  Matte Tin annealed over Copper Le.
  • For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
  • Repetitive rating on 25mm x 25mm FR4 PCB, D=0.02, pulse width 300s – pulse width limited by maximum junction temperature.
  • Thermal resistance from junction to solder-point (at the end of the drain lead).
  • ZXMP3F30FH NEW PRODUCT Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS -30   V VGS = 0V, ID = -250μA Zer.

Topics covered by the datasheet

The document includes sections related to:

  • Description
  • Applications

Engineering review checklist

  • Confirm repetitive reverse voltage, average forward current, surge current and leakage at the intended temperature.
  • Check forward-voltage loss and reverse-recovery behavior at the actual current and switching frequency.
  • Review package thermal resistance, copper area, polarity marking and transient derating before layout release.

Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.

View the complete PDF and model record

Open the ZXMP3F30FH datasheet and model details to review the complete PDF, document pages and available product information.

Source attribution

Adapted from the PDF associated with this DigiCamel model page.

Source model URL: https://www.digicamel.com/product.php?slug=zxmp3f30fh-diodes-incorporated

ZXMP3F30FH Diodes Incorporated IC ZXMP3F30FH datasheet ZXMP3F30FH specifications ZXMP3F30FH applications