S1G overview

S1G is a component documented by NXP Semiconductors. The PDF description identifies it as "SMA controlled avalanche rectifiers 2000 Feb 14." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.

Datasheet snapshot

  • Manufacturer: NXP Semiconductors
  • Part number: S1G
  • Category: IC
  • Datasheet length: 12 Pages

Key features noted in the PDF

  • Glass passivated
  • High maximum operating temperature
  • Ideal for surface mount automotive applications
  • Low leakage current
  • Excellent stability
  • Guaranteed avalanche energy absorption capability
  • UL 94V-O classified plastic package

Specifications and operating details

The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.

  • LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).
  • Device mounted on Al2O 3 printed-circuit board, 0.7 mm thick; thickness of copper≥35 µm.
  • Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper≥40 µm.
  • UNIT VF forward voltage I F = 1 A; see Fig.4 − 1.1 V IR reverse current V R =V RRMmax ; see Fig.5 S1A to S1J − 1 µA S1K and S1M − 5 µA VR =V RRMmax ; Tj= 165°C; see Fig.5 − 50 µA trr reverse recovery time when switched from IF = 0.5 A to I.
  • Fig.3 Maximum permissible junction temperature as a function of reverse voltage.
  • handbook, halfpage 2.50 0.5 1 VF (V) IF (A) 1.5 2 102 10−1 10−2 10−3 MCD795 Fig.4 Forward current as a function of forward voltage; typical values.
  • handbook, halfpage 1000 20 40 VR (%VRmax ) IR (µA) 60 80 102 10−1 10−2 10−3 MCD802 Tj = 165 °C Tj = 25 °C Fig.5 Reverse current as a function of reverse voltage; typical values.

Topics covered by the datasheet

The document includes sections related to:

  • FEATURES
  • DESCRIPTION
  • ELECTRICAL CHARACTERISTICS
  • Application information

Engineering review checklist

  • Confirm repetitive reverse voltage, average forward current, surge current and leakage at the intended temperature.
  • Check forward-voltage loss and reverse-recovery behavior at the actual current and switching frequency.
  • Review package thermal resistance, copper area, polarity marking and transient derating before layout release.

Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.

View the complete PDF and model record

Open the S1G datasheet and model details to review the complete PDF, document pages and available product information.

Source attribution

Adapted from the PDF associated with this DigiCamel model page.

Source model URL: https://www.digicamel.com/product.php?slug=s1g-nxp-semiconductors