FBGA overview
FBGA is a component documented by STATS ChipPAC, Ltd. The PDF description identifies it as "Fine Pitch Ball Grid Array." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.
Datasheet snapshot
- Manufacturer: STATS ChipPAC, Ltd.
- Part number: FBGA
- Category: IC
- Datasheet length: 2 Pages
Key features noted in the PDF
- Thin, lightweight, space saving package Flexible body sizes range from 4mm x 4mm to 23mm x 23mm Eutectic & Pb free solder balls Green package available Multiple routing la.
Applications listed in the PDF
- Array molded, cost effective, space saving package solution Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness.
Specifications and operating details
The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.
- STATS ChipPAC’s FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA (<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and UFBGA (0.55mm max.) thickness.
- Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Topics covered by the datasheet
The document includes sections related to:
- FEATURES
- APPLICATIONS
- DESCRIPTION
Engineering review checklist
- Confirm supply rails, clock limits, memory size, peripheral mapping and I/O voltage compatibility.
- Check package pinout, boot configuration, programming interface and silicon-revision errata.
- Budget decoupling, thermal margin, startup timing and firmware recovery behavior before release.
Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.
View the complete PDF and model record
Open the FBGA datasheet and model details to review the complete PDF, document pages and available product information.
Source attribution
Adapted from the PDF associated with this DigiCamel model page.
Source model URL: https://www.digicamel.com/product.php?slug=fbga-stats-chippac-ltd