F29H85XDXX overview
F29H85XDXX is a component documented by Texas Instruments. The PDF description identifies it as "F29H85x and F29P58x Real-Time Microcontrollers NOVEMBER 2024." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.
Datasheet snapshot
- Manufacturer: Texas Instruments
- Part number: F29H85XDXX
- Category: Microcontroller
- Datasheet length: 346 Pages
Key features noted in the PDF
- Three C29x 64-bit CPUs (CPU1, CPU2, CPU3) running at 200MHz – 2x signal chain performance versus C28x with improved pipeline – Split lock and lockstep operating modes
- C29x CPU architecture – Byte addressability – High-performance real-time control with low latency – High-performance DSP and general-purpose processing capabilities – VLIW CPU exe.
- 4MB of CPU-mappable flash (ECC-protected) capable of supporting Firmware Over the Air (FOTA) with A/B swap and LFU
- 256KB of Data-only Flash (ECC-protected)
- 452KB of RAM (ECC-protected)
- Dedicated 512KB Flash and 36KB RAM memories for HSM (ECC-protected)
- Built in ECC logic for system-wide safety Safety Peripherals
Applications listed in the PDF
- On-board charger (OBC) with or without Host Integration
- HEV/EV DC/DC converter
- Electric power steering (EPS)
- Traction Inverter
- Medium/short range radar
- HVAC large commercial motor control
Specifications and operating details
The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.
- Thirty-six frequency-independent PWMs, all with high-resolution capability, enable control of multiple power stages, from 3-phase inverters to advanced multilevel power topologies.
- Each subsystem consists of a C28x CPU and a parallel control law accelerator (CLA), each running at 200 MHz.
- Other capabilities include up to 1.28MB of flash, 11 windowed comparators with dual-ramp generators, lockstep capability and a CLA module running at 200MHz.
- An external pullup resistor (recommended 2.2 kΩ) on the TMS pin to VDDIO should be placed on the board to keep JTAG in reset during normal operation.
- A resistor between 2.2 kΩ and 10 kΩ should be placed between XRSn and VDDIO.
- If a capacitor is placed between XRSn and VSS for noise filtering, it should be 100 nF or smaller.
- TI recommends placing a decoupling capacitor near each VDD pin with a minimum total capacitance of approximately 20 µF.
Topics covered by the datasheet
The document includes sections related to:
- Package Information
Engineering review checklist
- Confirm supply rails, clock limits, memory size, peripheral mapping and I/O voltage compatibility.
- Check package pinout, boot configuration, programming interface and silicon-revision errata.
- Budget decoupling, thermal margin, startup timing and firmware recovery behavior before release.
Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.
View the complete PDF and model record
Open the F29H85XDXX datasheet and model details to review the complete PDF, document pages and available product information.
Source attribution
Adapted from the PDF associated with this DigiCamel model page.
Source model URL: https://www.digicamel.com/product.php?slug=f29h85xdxx-texas-instruments