EPOP overview
EPOP is a component documented by Kingston Technology Far. The PDF description identifies it as "Embedded Package-on-Package Memory for Wearables." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.
Datasheet snapshot
- Manufacturer: Kingston Technology Far...
- Part number: EPOP
- Category: Memory
- Datasheet length: 2 Pages
Specifications and operating details
The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.
- more >> ePoP #KingstonIsWithYou EPOP PART NUMBERS AND SPECIFICATIONS LPDDR3 based ePoP Part Number Capacity Description Package FBGA Operating TemperatureNAND (GB) DRAM (Gb) eMMC DRAM (mm) 04EP04-N3GM627 4 4 5.0 LPDDR3 10x10x0.8 136 -25°C.
Engineering review checklist
- Confirm supply rails, clock limits, memory size, peripheral mapping and I/O voltage compatibility.
- Check package pinout, boot configuration, programming interface and silicon-revision errata.
- Budget decoupling, thermal margin, startup timing and firmware recovery behavior before release.
Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.
View the complete PDF and model record
Open the EPOP datasheet and model details to review the complete PDF, document pages and available product information.
Source attribution
Adapted from the PDF associated with this DigiCamel model page.
Source model URL: https://www.digicamel.com/product.php?slug=epop-kingston-technology-far