250SHB100KS1LE overview
250SHB100KS1LE is a component documented by Exxelia Group. The PDF description identifies it as "Super HiQ 06/20." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.
Datasheet snapshot
- Manufacturer: Exxelia Group
- Part number: 250SHB100KS1LE
- Category: IC
- Datasheet length: 34 Pages
Key features noted in the PDF
- Lowest ESR in class, High Self-Resonant Frequencies, RF c ap a ci t or s
- Highest working voltage in class: 1,500V
- Standard EIA sizes: 0402 - 1111
- Capacitance range: 0.1 pF - 1,000pF
- NPO, RoHS & REACH compliant
- Operating temperature up to 125°C
- Laser Marked (optional)
Applications listed in the PDF
- Cellular Base Station Equipments
- Broadband Wireless Service
- Point to Point / Multipoint Radios
- RF Generators (NMR…) CIRCUIT APPLICATIONS
- Filter Networks
- Matching Networks
Specifications and operating details
The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.
- Dielectric Withstanding (test voltage applied for 5 seconds) 2.5 x WV DC for WV DC ≤ 500V 1.8 x WV DC for extended range values ≥ 820pF 1.5 x WV DC for WV DC > 500V Aging none Piezo Effect none Environmental specifications Parameter Value L.
- The temperature withstanding for SHF and SHS is 150°C for the whole capacitance range.
- A = ±0.05pF B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% See note 1 S = Standard: tin-plated nickel Available on sizes 0505, 0603 and 1111: C = Non-magnetic: tin-plated copper Available on sizes 0505, 0805 (from 0.5pF.
- The chart below gives the resistance to soldering heat per termination type, based on a SAC387 solder bath at 260°C.
- The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of the maximum soldering temperature.
- 150s <180°C 180°C Ramp down rate <6K/s Ramp up rate <3K/s 200°C 150°C 100°C 50°C SnPb solders – Infrared Soldering NB: the lines indicate the upper and lower limits of typical process (terminal temperature).
- 60s >180°C 215 ° C Preheating Ramp down rate <6K/s Ramp up rate <3K/s 180°C 160°C 130°C 230°C 240°C SnPb solders – Infrared Soldering NB: these profiles are given for mid size components.
Topics covered by the datasheet
The document includes sections related to:
- SH-SERIES EXXELIA
- FEATURES
- APPLICATIONS
Engineering review checklist
- Check resistance value, tolerance, temperature coefficient and long-term stability over the operating range.
- Derate continuous power for ambient temperature and verify pulse or surge capability separately.
- Match the land pattern, termination finish and current-sense routing to the exact package option.
Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.
View the complete PDF and model record
Open the 250SHB100KS1LE datasheet and model details to review the complete PDF, document pages and available product information.
Source attribution
Adapted from the PDF associated with this DigiCamel model page.
Source model URL: https://www.digicamel.com/product.php?slug=250shb100ks1le-exxelia-group