ZXSC4x0
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 17
Technical content
Features
1.65V to 8V Supply Range Typical Output Regulation of ±1% Over 85% Typical Efficiency Output Currents Up to 300mA 4.5µA Typical Shutdown Current ZXSC410/440 End of Regulation Output ZXSC420/440 Available in SOT26 and MSOP-8 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Pin Assignments ZXSC410 (SOT26) DRIVE VFB SENSE VCC GND STDN ZXSC420 (SOT26) DRIVE VFB SENSE VCC GND EOR ZXSC440 (MSOP-8) DRIVE VFB SENSE N/C VCC GND EOR STDN
Applications
System Power for Battery Portable Products LCD Bias Local Voltage Conversion High-Brightness LED Driving Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Hal ogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit ZXSC410 ZXTN25012EFH ZHCS2000 22µH 18mΩ 820mΩ 22µF 100µF
Document number: DS33618 Rev. 6 - 2 2 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Pin Descriptions Pin Name Pin Number Function ZXSC410 ZXSC420 ZXSC440 VCC 1 1 8 Supply Voltage GND 2 2 7 Ground STDN 3 — 5 Shutdown (ZXSC410 and ZXSC440) EOR — 3 6 End of regulation (ZXSC420 and ZXSC440) Sense 4 4 3 Inductor current sense input. Internal threshold voltage set to 28mV. Connect external sense resistor. VFB 5 5 2 Reference voltage. Internal threshold set to 300mV. Connect external resistor network to set output voltage. Drive 6 6 1 Drive output for external switching transistor. Connect to base or gate of external switching transistor. NC — — 4 No connection Functional Block Diagram
Document number: DS33618 Rev. 6 - 2 3 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Parameter Rating Unit VCC -0.3 to +10 V Drive -0.3 to VCC +0.3 V EOR -0.3 to VCC +0.3 V STDN -0.3 to The lower of (+5.0) or (VCC +0.3) V VFB, Sense -0.3 to The lower of (+5.0) or (VCC +0.3) V Operating Temperature -40 to +85 °C Storage Temperature -55 to +120 °C Power Dissipation @ +25°C 450 mW Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are str ess ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VCC VCC Range 1.8 8 V TA Ambient Temperature Range -40 +85 °C VIH Shutdown Threshold 1.5 VCC V VIL Shutdown Threshold 0 0.55 V Electrical Characteristics (VCC = 3V, @TA = +40°C to +85°C, unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit IQ (Note 4) Quiescent Current VCC = 8V - - 220 µA ISTDN Shutdown Current - - 4.5 - µA EFF (Note 5) Efficiency 50mA > IOUT > 300mA - 85 - % ACCREF Reference Tolerance 1.8V < VCC < 8V -3.0 - +3.0 % TCOREF Reference Temp Co. - - 0.005 - %/°C TDRV Discharge Pulse Width 1.8V < VCC < 8V - 1.7 - µs FOSC Operating Frequency - - - 200 kHz Input Parameters VSENSE Sense Voltage (Note 5) - 22 28 34 mV ISENSE Sense Input Current VFB = 0V; VSENSE = 0V -1 -7 -15 µA VFB Feedback Voltage TA = +25°C 291 300 309 mV IFB (Note 6) Feedback Input Current VFB = 0V; VSENSE = 0V -1.2 - -4.5 µA dVLN Line Voltage Regulation - - 0.5 - %/V Output Parameters IOUT (Note 7) Output Current VIN > 2V, VOUT = VIN 300 - - mA IDRIVE Transistor Drive Current VDRIVE = 0.7V 2 3.4 5 mA VDRIVE Transistor Voltage Drive 1.8V < VCC < 8V 0 - VCC -0.4 V CDRIVE MOSFET Gate Drive cpbty - - 300 - pF VOHEOR EOR Flag Output High IEOR = -300nA 2.5 - VCC V VOLEOR EOR Flag Output Low IEOR = 1mA 0 - 1.15 V TEOR EOR Delay Time TA = +25°C 70 195 250 µs dILD Load Current Regulation - - - 0.01 %/mA Notes: 4. Excluding gate/base drive current. 5. Effective sense voltage observed when switching at approximately 100kHz. The internal comparator propagation delay of approximately 1µs causes an increase in the effective sense voltage over a DC measurement of the sense voltage. 6. IFB is typically half of these values at 3V. 7. System not device specification, including recommended transistors.
Document number: DS33618 Rev. 6 - 2 4 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Typical Characteristics 1 82 3 4 5 6 7 29.0 27.0 28.5 28.0 27.5 INPUT VOLTAGE (V) Input Voltage vs. Sense Voltage SENSE VOLTAGE (mV) T = -40°CA T = 25°CA T = 85°CA 1 82 3 4 5 6 7 INPUT VOLTAGE (V) Input Voltage vs. Shutdown Voltage SHUTDOWN CURRENT (µA) T = -40°CA T = 25°CA T = 85°CA I = 0VSTDN 1 82 3 4 5 6 7 3.5 3.2 3.4 3.3 3.6 INPUT VOLTAGE (V) Input Voltage vs. Drive Current DRIVE CURRENT (mA) T = -40°CA T = 25°CA T = 85°CA INPUT VOLTAGE (V) Input Voltage vs. Feedback Voltage 1 82 3 4 5 6 7 310 290 300FEEDBACK VOLTAGE (mV) T = -40°CA T = 25°CA T = 85°CA
Document number: DS33618 Rev. 6 - 2 5 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440
Application Information
All threshold voltages and internal currents are derived from a temperature compensated bandgap reference circuit with a refe rence voltage of 1.22V nominal. Dynamic Drive Output Depending on the input signal, the output is either “LOW” or “HIGH”. In the high state a 2.5mA current source , (max drive voltage = V CC -0.4V) drives the base or gate of the external transistor. In order to operate the external switching transistor at optimum efficien cy, both output states are initiated with a short transient current in order to quickly discharge the base or the gate of the switching transistor. Switching Circuit The switching circuit consists of two comparators, Comp1 and Comp2, a gate U1, a monostable and the drive output. Normally the DRIVE output is “HIGH”; the external switching transistor is turned on. Current ramps up in the inductor, the switching transistor and ext ernal current sensing resistor. This voltage is sensed by comparator, Comp2, at input I SENSE. Once the current sense voltage across the sensing resistor exceeds 20mV, comparator Comp2 through gate U1 triggers a re -triggerable monostable and turns off the output drive stage for 2μs. The inductor discharges to the load of the application. After 2μs a new charge cycle begins, thus ramping the output voltage. When the output voltage reaches the nominal value and V FB gets an input voltage of more than 300mV, the monostable is forced “on” from Comp1 through gate U1, until the feedback voltage falls below 300mV. The above action continues to maintain regulation. EOR, End of Regulation Detector (ZXSC420/440) The EOR c ircuit is a retriggerable 120μs monostable, which is re -triggered by every down regulating action of comparator Comp1. As long as regulation takes place, output EOR is “HIGH ” (high impedance, 100K to VCC). Short dips of the output voltage of less than 120 μs are ignored. If the output voltage falls below the nominal value for more than 120μs, output EOR goes ”LOW”. The reason for this to happen is usually a slowly progressing drop of input voltage from the discharging battery. Therefore, the output voltage will also start to drop slowly. With the EOR detector, batteries can be used to the ultimate end of discharge, with enough time left for a safe shutdown. It can also be used in hig h-voltage photoflash with the ZXSC440 to show when the capacitor is fully charged. Shutdown Control The ZXSC410/440 offers a shutdown mode that consumes a standby current of less than 5µA. The ZXSC410/440 is enabled, and is i n normal operation, when the voltage at the STDN pin is between 1V and 8V (and also open circuit). Th e ZXSC410/440 is shutdown with the driver disabled when the voltage at the STDN pin is 0.7V or lower. The STDN input is a high impedance current source of 1µA typ. The driving device can be an open-collector or -drain or a logic output with a “High” voltage of 5V max. The device shutdown current depends on the supply voltage, (see typical characteristics graph).The ZXSC440 with its STDN pin and EOR pins can be used as a camera flash driver. The STDN pin is used to initiate the high -voltage capacitor charge cycle. The EOR pin is used as flag to show when the capacitor has been charged to the appropriate level. A transformer is used to boost the voltage. If designing a transformer, bear in mind that the primary current may be over an amp and, if this flows through 10 turns, the primary flux will be 10 Amp. Small number of turns and small cores will need an air gap to cope with this value without saturation. Secondary winding capacitance should not be too high as this is working at 300V and could soon cause excessive losses.
Document number: DS33618 Rev. 6 - 2 6 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Information (continued) External Component Selection Switching Transistor Selection The choice of switching transistor has a major impact on the converter efficiency. For optimum performance, a bipolar transistor with low VCE(SAT) and high gain is required. The V CEO of the switching transistor is also an important parameter as this sees the full output voltage when the transistor is switched off. Diodes SOT26 transistors are an ideal choice for this application. Schottky Diode Selection As with the switching transistor, the Schottky rectifier diode has a major impact on the converter efficiency. A Schottky dio de with a low forward voltage and fast recovery time should be used for this application. The diode should be selected so that the maximum forward current rating is greater or equal to the maximum peak current in the inductor, and the maximum reverse voltage is greater or equal to the output voltage. The Diodes ZHCS Series meets these needs. Inductor Selection The inductor value must be chosen to satisfy performance, cost and size requirements of the overall solution. Inductor selection has a significant impact on the converter performance. For applications where efficiency is critical, an i nductor with a series resistance of 500mΩ or less should be used. Output Capacitors Output capacitors are a critical choice in the overall performance of the solution. They are required to filter the output an d supply load transient currents. There are three parameters which are param ount in the selection of the output capacitors, capacitance, I RIPPLE and ESR. The capacitance value is selected to meet the load transient requirements. The capacitors IRIPPLE rating must meet or exceed the current ripple of the solution. The ESR of the output capacitor can also affect loop stability and transient performance. The capacitors selected for the solutions and indicated in the reference designs are optimized to provide the best overall performance. Input Capacitors The input capacitor is c hosen for its voltage and RMS current rating. The use of low ESR electrolytic or tantalum capacitors is recommended. Capacitor values for optimum performance are suggested in the reference design section. Also note that the ESR of the input capacitor is ef fectively in series with the input and hence contributes to efficiency losses in the order of I RMS ESR. Peak Current Definition In general, the IPK value must be chosen to ensure that the switching transistor, Q1, is in full saturation with maximum outpu t power conditions, assuming worse case input voltage and transistor gain under all operating temperatureextremes.Once IPK is decided, the value of RSENSE can be determined by: I VR PK SENSE SENSE Sense Resistor A low-value sense resistor is required to set the peak current. Power in this resistor is negligible due to the low sense voltage threshold, VSENSE.
Document number: DS33618 Rev. 6 - 2 7 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Information (cont.) Output Power Calculation By making the above assumptions for inductance and peak current the output power can be determined by: POUT = IAV x VIN x η = (Watts) Where: tt ttx2 II OFFON DISONPK AV and, V L It IN PK ON and, VV L It INOUT PK DIS and, tOFF ≈ 1.7μs (internally set by ZXSC410/420/440) and, η = efficiency i.e. 100% = 1 Operating frequency can be derived by: tt OFFON Output Adjustment The ZXSC410/420/440 are adjustable output controllers allowing the end user the maximum flexibilty. They can be used both as switching voltage regulators and as constant current regul ators. A feedback voltage of 300mV provides a good compromise for both voltage and current regulation. For a constant output voltage operation a potential divider network is connected as follows: VFB VOUT GND RA RB The output voltage is determined by the equation: B A FBOUT R R1VV where VFB = 300mV The resistor values, RA and RB, should be maximized to improve efficiency and decrease battery drain but not so much that they strongly affect the accuracy. Optimization can be achieved by assuming a current of IFB(MAX) = 2.2µA out of the VFB pin. Output is adjustable from V FB to the (BR)VCEO of the switching transistor, Q1. Note: For the reference designs, RA is assigned the label R2 and RB the label R3. The ZXSC410/420/440 can also b e used to generate a constant current between boosted output rail and the VFB pin by connecting a single resistor between VFB and GND.
Document number: DS33618 Rev. 6 - 2 8 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Information (cont.) LED Driving The ZXSC410/420/440 make simple low-voltage boost LED drivers; The current setting resistor value is determined by the following equation: LED FB LED R VI VFB GND RLED Open-Circuit Protection As a boost converter , if the load (LED chain) should become open -circuit, a Zener diode can be connected across the LED chain pr eventing overvoltage and possible damage to the main switching transistor. The Zener diodes should be selected by ensuring its voltage rat ing is higher than the combined forward voltage of the LED chain. Under open circuit conditions the current in the Zener diode defines the output current as: Z FB Z R VI The circuit example below give an open circuit output current of 300µA. VFB GND RLED RZ 1kΩ ZD1 To converter
Document number: DS33618 Rev. 6 - 2 9 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Information (cont.) Dimming Control There are many types of dimming control that can be implemented for the ZXSC410/420/440. Dimming Control Using the Shutdown Pin The first method uses the shutdown pin (only ZXSC410 and ZXSC440). By injecting a PWM waveform on this pin and varying the duty cycle, LED current and hence LED brightness can be adjusted. To implement this method of brightness control on the ZXSC410/440, a PWM signal with an amplitude between 0.7V and V CC at a frequency of 120Hz or above (to eliminate LED flicker) should be applied to the STDN pin. The LED current and hence LED brightness is linearly proportional to the duty cycle ratio, so for brightness control adjust the duty cycle ratio as necessary. For example, a 10% duty cycle equates to 10% of full LED brightness. OUTPUT CURRENT (A) 40 20 0100 80 60 DUTY CYCLE (%) LED Current vs. Duty Cycle
4 White LEDs
V = V = 3.3VIN EN Dimming Control Using a DC Voltage For applications where a PWM signal is not available or for the ZXSC420 a DC voltage can be used to control dimming by modulating the V FB pin. By adding resistors R2 and R3 and applying a DC voltage, the LED current can be adjusted from 100% to 0%. As the DC vo ltage increases, the voltage drop across R2 increases and the voltage drop across R1 decreases, thus reducing the current through the LEDs. Selection of R2 and R3 should ensure that the current from the DC voltage is much less than the LED current and m uch larger than the feedback current. The component values in the diagram above represent 0% to 100% dimming control from a 0 to 2V DC voltage. 10k 67k R1 VFB VDC Dimming Control Using a Filtered PWM Signal The filtered PWM signal can be considered as an adjustable DC voltage by applying a RC filter (R4 and C1). The values shown in the diagram below are configured to give 0% to 100% dimming for a 1kHz to 100kHz PWM signal with a 2V amplitude. e.g. a 50% duty cycle will give 50% dimming. 0.1µF 10k 67k R1 VFB PWM 10k
Document number: DS33618 Rev. 6 - 2 10 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Information (cont.) Dimming Control using a Logic Signal For applications where the LED current needs to be adjusted in discrete steps a logic signal can be applied as shown in the diagram below. When Q1 is ‘off’, R1 sets the minimum LED current. When Q1 is ‘on’, R2 sets the LED current that will be added to the minimum LED current. The formula for selecting values for R1 and R2 are given below: MOSFET ‘off’ FB )M IN(LED R VI I VFB LOGIC SIGNAL 2N7002 MOSFET ‘on’ )M IN(LED FB )M AX(LED IR VI Layout Issues Layout is critical for the circuit to function in the most efficient manner in terms of electrical efficiency, thermal considerations and noise. For ‘step-up converters’ there are four main current loops, the input loop, power -switch loop, rectifier loop and output loop. The supply ch arging the input capacitor forms the input loop. The power-switch loop is defined when Q1 is ‘on’, current flows from the input through the inductor, Q1, RSENSE and to ground. When Q1 is ‘off’, the energy stored in the inductor is transferred to the output capacitor and load via D1, forming the rectifier loop. The output loop is formed by the output capacitor supplying the load when Q1 is switched back off. To optimi ze for best performance , each of these loops is kept separate from one another and inte rconnected with short, thick traces , thus minimizing parasitic inductance, capacitance and resistance. Also the RSENSE resistor should be connected with minimum trace length, between emitter lead of Q1 and ground, (again minimizing stray parasitics).
Document number: DS33618 Rev. 6 - 2 11 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Examples ZXSC410 DC-DC Boost Voltage Regulators VIN = 2.5V to 4.2V, VOUT = 5V; ILOAD = 100mA 0 20 40 60 80 100 100 EFFICIENCY (%) LOAD CURRENT (mA) Load Current vs. Efficiency V = 3.6VIN V = 4.2VIN V = 3VIN 2.5 3.0 3.5 4.0 100 EFFICIENCY (%) INPUT VOLTAGE (V) Input Voltage vs. Efficiency I = 10mALOAD I = 100mALOAD I = 60mALOAD Switching Waveform Output Ripple ZXSC410 ZXTN25012EFH ZHCS2000 22µH 100m Ω 1k Ω 22µF 22µF V IN = 2.5V to 4.2V 16k Ω 100nF
Document number: DS33618 Rev. 6 - 2 12 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Examples (continued) Triple Output TFT Bias Generator ZXSC410 as Triple Output TFT Bias Sequencing AVDD and VON By adding the circuit below to the LCD bias output (V ON) of the converter, a 10ms delay can be achieved between A VDD power up and VON power up. The circuit operates by a delay in turning the PMOS transistor on, which transfers to a 10ms delay between input and output of the circuit. The delay is set by the RC time constant of R1 and C1. The diode, D1, discharges the gate of the PMOS when the main system supply is turned off, guaranteeing a delay every turn on cycle. System Voltage AVDD 0.1µF 470k LCD Bias Voltage VON ZXMP3A13F Sequenced Output 10ms Delay ZXSC410 Q1 ZXTN 25012EFH 10µF 1µF 47µF 22m Ω 30k Ω 1k Ω 22µH BAT54 V CC STDN GND V DRIVE I SENSE V FB 1µF 1µF 1µF 1µF V ON 27V, 10mA A VDD 9V, 180mA V OFF - 9V, 10mA 1µF V IN 4.2V ~ 3V BAT54S BAT54S BAT54S
Document number: DS33618 Rev. 6 - 2 13 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Examples (cont.) Battery Powered Two 1W LED Lamp This application shows the ZXSC410/420/440 driving 2 serial LEDs. The input voltage ranges from 2V to 3. 6V with a maximum output current of 360mA from 2.6V input. The wide input voltage range allows the use of different battery cell combinations. This could be dual alkaline cells with vo ltage starting from 3V down to 2V or triple NiCad/NiMH cells with voltage starting from 3.6V down to 2.7V. INPUT VOLTAGE (V) Efficiency vs. Input Voltage 100 EFFICIENCY (%) 0.4 0.0 0.2OUTPUT CURRENT (A) INPUT VOLTAGE (V) LED Current vs. Input Voltage ZXSC410 ZXTN25012EFH ZHCS2000 22µH 18m Ω 820m Ω 22µF 100µF
Document number: DS33618 Rev. 6 - 2 14 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Application Examples (cont.) High-Current LED Photoflash The input voltage is 3V with a maximum pulsed output current of 1A for 2ms. Operation In charging mode, with SW1 closed and SW2 open, the ZXSC410/420/440 is configured as a typical boost converter, charging capacitor C2 up the regulated output voltage set by the ratio of R1 and R2. This is typically 16V. The peak current of the co nverter (current drawn from the battery) is controlled by R3 plus R4, and is typically 280mA for this application. When C2 is charged to 16V the SW1 is opene d and SW2 is closed, converting the ZXSC400 to a step -down converter to provide a 1A constant curr ent for 2ms to the photoflash LED. During step -down operation, current flows from C2 through the photoflash LED, L1, U2 and is returned to C2 through R3. This means that the peak current is set at a higher value than in charging mode, typically 1A. When the current reaches its peak value, U2 is switched off and current flows from L1 through the Schottky diode in U2, to the photoflash LED. This cyclic process is repeated until C2 is discharged. ZXSC410 ZXTN 25012 EFH 1µF 1µF 150µF 22m Ω 100m Ω 10k Ω 12µH U1 SW1 SW2 VBATT D1 BAT54 V CC STDN GND V DRIVE I SENSE V FB Charging mode: SW1 closed, SW2 open Discharging mode: SW1 open, SW2 closed
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Ordering Information
Device Part Mark Package Code Packaging 7” Tape & Reel Quantity Part Number Suffix ZXSC410E6TA C410 E6 SOT26 3,000 TA ZXSC420E6TA C420 E6 SOT26 3,000 TA ZXSC440X8TA ZXSC
440 X8 MSOP-8EP 1,000 TA
Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version. SOT26 D e E1 E b A2 A1 Seating Plane L c a MSOP-8 SOT26 Dim Min Max Typ A1 0.013 0.10 0.05 A2 1.00 1.30 1.10 A3 0.70 0.80 0.75 b 0.35 0.50 0.38 c 0.10 0.20 0.15 D 2.90 3.10 3.00 e - - 0.95 e1 - - 1.90 E 2.70 3.00 2.80 E1 1.50 1.70 1.60 L 0.35 0.55 0.40 a - - 8° a1 - - 7° All Dimensions in mm MSOP-8 Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e - - 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x - - 0.750 y - - 0.750 All Dimensions in mm A e Seating Plane Gauge Plane L See Detail C Detail C c a E y x D b 0.25 4x10° 4x10°
Document number: DS33618 Rev. 6 - 2 16 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. SOT26 Y1 G X Y C MSOP-8 Dimensions Value (in mm) C 2.40 C1 0.95 G 1.60 X 0.55 Y 0.80 Y1 3.20 Dimensions Value (in mm) C 0.650 X 0.450 Y 1.350 Y1 5.300 X C Y
Document number: DS33618 Rev. 6 - 2 17 of 17 www.diodes.com August 2015 © Diodes Incorporated ZXSC410/ZXSC420/ZXSC440 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES O F MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability a rising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such appli cations shall assume all risks of such use and will agree to hold Diodes Incorporated and all the comp anies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnif y and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Customers must fully ind emnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2015, Diodes Incorporated www.diodes.com