ZXMP4A16G DIODES | Alldatasheet

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Technical content

V(BR)DSS = -40V: RDS(on) = 0.060 : ID = -6.4A

DESCRIPTION

This new generation of Trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.

FEATURES

/c183Low on-resistance /c183Fast switching speed /c183Low threshold /c183Low gate drive /c183SOT223 package

APPLICATIONS

/c183DC-DC Converters /c183Disconnect switches /c183Audio output stages /c183Motor Control DEVICE MARKING /c183ZXMP 4A16 ZXMP4A16G 40V P-CHANNEL ENHANCEMENT MODE MOSFET ISSUE 4 - JULY 2003 DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL ZXMP4A16GTA 7” 12mm 1000 units ZXMP4A16GTC 13” 12mm 4000 units

ORDERING INFORMATION

PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DSS -40 V Gate-Source Voltage V GS /H1100620 V Continuous Drain Current (V GS= -10V; T A=25°C) (b) (VGS= -10V; T A=70°C) (b) (VGS= -10V; T A=25°C) (a) ID -6.4 -5.1 -4.6 A Pulsed Drain Current (c) IDM -21 A Continuous Source Current (Body Diode) (b) IS -5.2 A Pulsed Source Current (Body Diode)(c) I SM -21 A Power Dissipation at T A=25°C (a) Linear Derating Factor PD 2.0 W mW/°C Power Dissipation at T A=25°C (b) Linear Derating Factor PD 3.9 W mW/°C Operating and Storage Temperature Range T j:Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATING PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) RθJA 62.5 °C/W Junction to Ambient (b) RθJA 32.2 °C/W THERMAL RESISTANCE NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t/H1108810 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width limited by maximum junction temperature.

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS STATIC Drain-Source Breakdown Voltage V (BR)DSS -40 V ID=-250 µ A, V GS=0V Zero Gate Voltage Drain Current I DSS -1 /H9262AV DS=-40V, V GS=0V Gate-Body Leakage I GSS 100 nA V GS=/H1100620V, V DS=0V Gate-Source Threshold Voltage V GS(th) -1.0 V I D=-250 /H9262A, V DS=V GS Static Drain-Source On-State Resistance (1) RDS(on) 0.060 0.100 /H9024 /H9024 V GS=-10V, I D=-3.8A VGS=-4.5V, I D=-2.9A Forward Transconductance (1)(3) gfs 8.85 S V DS=-15V,I D=-3.8A DYNAMIC (3) Input Capacitance C iss 1007 pF VDS=-20V, V GS=0V, f=1MHzOutput Capacitance C oss 130 pF Reverse Transfer Capacitance C rss 85 pF SWITCHING (2)(3) Turn-On Delay Time t d(on) 2.33 ns VDD =-20V, I D=-1A RG/G40 6.0 /H9024,VGS=-10V Rise Time t r 8.84 ns Turn-Off Delay Time t d(off) 29.18 ns Fall Time t f 12.54 ns Gate Charge Q g 13.6 nC V DS=-20V,V GS=-5V, ID=-3.8A Total Gate Charge Q g 26.1 nC VDS=-20V,V GS=-10V, ID=-3.8AGate-Source Charge Q gs 2.8 nC Gate-Drain Charge Q gd 4.8 nC SOURCE-DRAIN DIODE Diode Forward Voltage (1) VSD -0.85 -1.2 V T J=25 /H11034C, I S=-3.4A, VGS=0V Reverse Recovery Time (3) trr 27.2 ns T J=25 /H11034C, I F=-3A, di/dt= 100A/ /H9262s Reverse Recovery Charge (3) Qrr 25.4 nC ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated). NOTES (1) Measured under pulsed conditions. Width /H11349300µs. Duty cycle /H113492%. (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.

Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc

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Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com © Zetex plc 2003 PAD LAYOUT DETAILSPACKAGE OUTLINE DIM Millimetres Inches DIM Millimetres Inches Min Max Min Max Min Max Min Max A - 1.80 - 0.071 e 2.30 BSC 0.0905 BSC D 6.30 6.70 0.248 0.264 PACKAGE DIMENSIONS