ZXMN10A08DN8 DIODES | Alldatasheet

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Technical content

V(BR)DSS = 100V; RDS(ON) = 0.25 ID = 2.1A

DESCRIPTION

This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.

FEATURES

  • Low on-resistance
  • Fast switching speed
  • Low threshold
  • Low gate drive
  • Low profile SOIC package

APPLICATIONS

  • DC - DC converters
  • Power management functions
  • Disconnect switches
  • Motor control DEVICE MARKING
  • ZXMN 10A08D ZXMN10A08DN8 ISSUE 4 - JANUARY 2005 100V N-CHANNEL ENHANCEMENT MODE MOSFET DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL ZXMN10A08DN8TA 7” 12mm 500 units ZXMN10A08DN8TC 13” 12mm 2,500 units

ORDERING INFORMATION

PARAMETER SYMBOL V ALUE UNIT Junction to ambient (a) R θJA 100 °C/W Junction to ambient (b) R θJA 69 °C/W NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t/H110885 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300/H9262s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph THERMAL RESISTANCE PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V DSS 100 V Gate source voltage V GS 20 V Continuous drain current V GS=10V; T A=25°C (b) VGS=10V; T A=70°C (b) VGS=10V; T A=25°C (a) ID 2.1 1.7 1.6 A Pulsed drain current (c) IDM 9A Continuous source current (body diode) (b) IS 2.6 A Pulsed source current (body diode) (c) ISM 9A Power dissipation at T A=25°C (a) Linear derating factor PD 1.25 W mW/°C Power dissipation at T A=25°C (b) Linear derating factor PD 1.8 14.5 W mW/°C Operating and storage temperature range T j:Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL MIN. TYP . MAX. UNIT C ONDITIONS. STATIC Drain-source breakdown voltage V (BR)DSS 100 V I D=250 /H9262A, V GS=0V Zero gate voltage drain current I DSS 0.5 /H9262AV DS=100V, V GS=0V Gate-body leakage I GSS 100 nA V GS=/H1100620V, V DS=0V Gate-source threshold voltage V GS(th) 2.0 V I D=250 /H9262A, V DS=V GS Static drain-source on-state resistance (1) RDS(on) 0.25 0.30 /H9024 /H9024 VGS=10V, I D=3.2A VGS=6V, I D=2.6A Forward transconductance (1)(3) gfs 5.0 S V DS=15V,I D=3.2A DYNAMIC (3) Input capacitance C iss 405 pF VDS=50 V, V GS=0V, f=1MHzOutput capacitance C oss 28.2 pF Reverse transfer capacitance C rss 14.2 pF SWITCHING (2) (3) Turn-on delay time t d(on) 3.4 ns VDD =30V, I D=1.2A RG≅6.0 /H9024,V GS=10V Rise time t r 2.2 ns Turn-off delay time t d(off) 8n s Fall time t f 3.2 ns Gate charge Q g 4.2 nC V DS=50V,V GS=5V, ID=1.2A Total gate charge Q g 7.7 nC VDS=50V,V GS=10V, ID=1.2AGate-source charge Q gs 1.8 nC Gate-drain charge Q gd 2.1 nC SOURCE-DRAIN DIODE Diode forward voltage (1) VSD 0.87 0.95 V T J=25°C, I S=3.2A, VGS=0V Reverse recovery time (3) trr 27 ns T J=25°C, I F=1.2A, di/dt= 100A/ /H9262sReverse recovery charge (3) Qrr 32 nC ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated). NOTES: (1) Measured under pulsed conditions. Width = 300µs. Duty cycle ≤ 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.

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Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park Chadderton, Oldham, OL9 9LL United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on towww.zetex.com © Zetex Semiconductors plc 2005 DIM Millimeters Inches DIM Millimeters Inches Min Max Min Max Min Max Min Max H 5.80 6.20 0.228 0.244 /H90520° 8° 0° 8° PACKAGE DIMENSIONS CONTROLLING DIMENSIONS IN MILLIMETERS APPROX CONVERSIONS INCHES PACKAGE OUTLINE