ZXMD63N03X
Document overview
- Manufacturer or author: Diodes Inc
- PDF pages: 8
Technical content
Features
Low On-Resistance Low Threshold Fast Switching Speed Low Gate Drive Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Mechanical Data Case: MSOP-8 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish Weight: 0.008 grams (approximate) Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXMD63N03XTA ZXM63N03 7 12 1,000 ZXMD63N03XTC ZXM63N03 13 12 4,000 Notes: 1. No purposely added lead. Fully EU Directiv e 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more in formation about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Marking Information Top View MSOP8 Device Symbol Top View Pin-Out ZXM63N03 = Product type Marking Code ZXM6 3N03
Document number: DS33501 Rev. 2 - 2 2 of 8 www.diodes.com March 2014 © Diodes Incorporated ZXMD63N03X Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 30 V Gate-Source Voltage VGSS ±20 V Continuous Drain Current Steady State @ VGS = 4.5V; TA = +25°C (Note 5 & 6) @ VGS = 4.5V; TA = +70°C (Note 5 & 6) ID 2.3 1.8 A Pulsed Drain Current (Notes 6 & 7) IDM 14 A Continuous Source Current (Body Diode) (Notes 5 & 6) IS 1.5 A Pulsed Source Current (Body Diode) (Notes 6 & 7) ISM 14 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Notes 6 & 8) PD 0.87 W (Notes 5 & 6) 1.25 (Notes 8 & 9) 1.04 Thermal Resistance, Junction to Ambient (Notes 6 & 8) RθJA 143 °C/W (Notes 5 & 6) 100 (Notes 8 & 9) 120 Thermal Resistance, Junction to Leads (Note 10) RθJL 84.9 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Notes: 5. For a device surface mount ed on FR4 PCB measured at t 10 sec. 6. For device with one active die. 7. Repetitive rating - 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300 μs – pulse width limited by maximum junction temperature. 8. For a device surface mounted on 25mm x 25mm FR4 PCB with hi gh coverage of single sided 1oz copper, in still air conditions. 9. For device with two active die running at equal power. 10. Thermal resistance from junction to solder-point (at the end of the drain lead).
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Document number: DS33501 Rev. 2 - 2 4 of 8 www.diodes.com March 2014 © Diodes Incorporated ZXMD63N03X Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS 30 — — V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current TJ = +25°C I DSS — — 1.0 µA VDS = 30V, VGS = 0V Gate-Source Leakage IGSS — — 100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS Gate Threshold Voltage VGS(th) 1.0 — — V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance (Note 11) RDS (ON) — — 135 mΩ VGS = 10V, ID = 1.7A — 200 VGS = 4.5V, ID = 0.85A Forward Transconductance (Notes 11 & 13) gfs 1.9 — — S VDS = 10V, ID = 0.85A Diodes Forward Voltage (Note 11) VSD — — 0.95 V TJ = 25°C, IS = 1.7A, VGS = 0V DYNAMIC CHARACTERISTICS Input Capacitance (Note 12 & 13) Ciss — 290 — pF VDS = 25V, VGS = 0V, f = 1.0MHz Output Capacitance (Notes 12 & 13) Coss — 70 — Reverse Transfer Capacitance (Notes 12 & 13) Crss — 20 — Total Gate Charge (Notes 12 & 13) Qg — — 8 nC VGS = 10V, VDS = 24V, ID = 1.7A Gate-Source Charge (Notes 12 & 13) Qgs — — 1.2 Gate-Drain Charge (Notes 12 & 13) Qgd — — 2 Reverse Recovery Time (Note 13) trr — 16.9 — ns TJ = +25°C, IF = 1.7A, di/dt = 100A/µs Reverse Recovery Charge (Note 13) Qrr — 9.5 — nC Turn-On Delay Time (Notes 12 & 13) tD(on) — 2.5 — ns VDD = 15V, ID = 1.7A, RG = 6.1Ω, RD = 8.7Ω, Turn-On Rise Time (Notes 12 & 13) tr — 4.1 — Turn-Off Delay Time (Notes 12 & 13) tD(off) — 9.6 — Turn-Off Fall Time (Notes 12 & 13) tf — 4.4 — Notes: 11. Measured under pulsed conditions. Pulse width 300s; duty cycle 2%. 12. Switching characteristics are independent of operating junction temperature. 13. For design aid only, not subject to production testing.
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Document number: DS33501 Rev. 2 - 2 7 of 8 www.diodes.com March 2014 © Diodes Incorporated ZXMD63N03X Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version. MSOP-8 Dim Min Max Typ A - 1.10 - A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e - - 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x - - 0.750 y - - 0.750 All Dimensions in mm Dimensions Value (in mm) C 0.650 X 0.450 Y 1.350 Y1 5.300 A e Seating Plane Gauge Plane L See Detail C Detail C c a E y x D b 0.25 4x10° 4x10° X C Y
Document number: DS33501 Rev. 2 - 2 8 of 8 www.diodes.com March 2014 © Diodes Incorporated ZXMD63N03X IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. Diodes Incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated a nd all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Inco rporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of t his document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporate d and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2014, Diodes Incorporated www.diodes.com