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Document overview

  • Manufacturer or author: Diodes Incorporated
  • PDF pages: 8

Technical content

Features

  • High-Gain Buffer With Typically 500mA Output from 10mA Input
  • Rugged Emitter-Follower to Latch-up/Shoot-Through Issues
  • Wide Supply Voltage to Minimize On-Losses
  • Optimized Pin-Out to Simplify PCB Layout and Reduce Parasitic Trace Inductances
  • Near-Zero Quiescent Supply Current
  • Qualified to AEC-Q101 Standards for High Reliability
  • Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3) Mechanical Data
  • Case: SOT26
  • Case Material: Molded Plastic. “Green” Molding Compound UL Flammability Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Finish—Matte Tin Plated Leads . Solderable per MIL-STD-202, Method 208
  • Weight: 0.018 grams (Approximate) Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXGD3009E6TA AEC-Q101 3009 7 8 3000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant . 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Pin Name Pin Function VCC Supply Voltage High IN Driver Input VEE Supply Voltage Low SOURCE Source Current Output * SINK Sink Current Output * * Typically connect SOURCE & SINK together SOT26 Top View Pin-Out V CC IN V EE SOURCE Not Internally Connected SINK Top View Internal Device Schematic ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 1 of 8 www.diodes.com July 2018 © Diodes Incorporated

Year 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 Code F G H I J K L M N P Q Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Typical Application Circuit YM 3009 3009 = Product Type Marking Code YM = Date Code Marking Y or Y = Year (ex: E = 2017) M or M = Month (ex: 9 = September) ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 2 of 8 www.diodes.com July 2018 © Diodes Incorporated

Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Supply Voltage, with Respect to VEE VCC 40 V Input Voltage, with Respect to VEE VIN 40 V Output Difference Voltage (Source – Sink) ∆V(source-sink) ±7 V Peak Pulsed Output Current (Source and Sink) IOM ±2 A Peak Pulsed Input Current IIM ±1 A Thermal Characteristics (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Notes 5 & 6) Linear Derating Factor PD 1.1 8.8 W mW/°C Thermal Resistance, Junction to Ambient (Notes 5 & 6) RϴJA 113 °C/W Thermal Resistance, Junction to Lead (Note 7) RϴJL 105 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C ESD Ratings (Note 8) Characteristics Symbols Value Unit JEDEC Class Electrostatic Discharge— Human Body Model ESD HBM 4000 V 3A Electrostatic Discharge— Machine Model ESD MM 400 V C Notes: 5. For a device mounted with pin 1 (VCC) and pin 3 (VEE) on 25mm × 25mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; the device is measured under still air conditions whilst operating in steady-state. The heatsink is split in half with pin 1 (VCC) and pin 3 (VEE) connected separately to each half. 6. For device with two active die running at equal power. 7. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 3 (VEE). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 3 of 8 www.diodes.com July 2018 © Diodes Incorporated

Electrical Characteristics (@ TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Output Voltage, High VOH VCC - 0.8 VCC - 0.4 — V I(source) = 1µA, VIN = VCC Output Voltage, Low VOL — VEE + 0.2 VEE + 0.5 I(sink) = 1µA, VIN = VEE Supply Breakdown Voltage BVCC 40 — — V IQ = 100µA, VIN = VCC 40 — — IQ = 100µA, VIN = VEE = 0V Quiescent Supply Current IQ — — 20 nA VCC = 32V, VIN = VCC — — 20 VCC= 32V, VIN = VEE = 0V Peak Pulsed Source Current I(source)M — 0.98 — A IIN= 10mA, VCC = 5V, VOUT= 0V Peak Pulsed Sink Current I(sink)M — 0.78 — IIN= -10mA, VEE = 0V, VOUT= 5V Peak Pulsed Source Current I(source)M — 1.58 — A IIN= 50mA, VCC = 5V, VOUT= 0V Peak Pulsed Sink Current I(sink)M — 1.38 — IIN= -50mA, VEE = 0V, VOUT= 5V Peak Pulsed Source Current with Varying Input Resistances I(source)M — 0.74 0.175 0.019 — A RIN = 100Ω RIN = 1kΩ RIN = 10kΩ VCC = 15V, VEE = 0V VIN = 15V CL =1nF, RL = 0.18Ω RSOURCE = 0Ω, RSINK = 0Ω Peak Pulsed Sink Current with Varying Input Resistances I(sink)M — 1.05 0.22 0.025 — A RIN = 100Ω RIN = 1kΩ RIN = 10kΩ VCC = 15V, VEE = 0V VIN = 15V CL =1nF, RL = 0.18Ω RSOURCE = 0Ω, RSINK = 0Ω Switching Times with Low Input Resistance td(rise) tr td(fall) tf 3.8 — ns VCC = 12V, VEE = 0V VIN = 0 to 10V RIN = 25Ω CL = 1nF, RL = 0.18Ω RSOURCE = 0Ω, RSINK = 0Ω Switching Times with Low Load Capacitance CL = 1nF td(rise) tr td(fall) tf — ns V CC = 15V, VEE = 0V VIN = 0 to 15V RIN = 1kΩ CL = 1nF, RL = 0.18Ω RSOURCE = 0Ω, RSINK = 0Ω Switching Times with High Load Capacitance CL = 10nF td(rise) tr td(fall) tf 210 240 — ns VCC = 15V, VEE = 0V VIN = 0 to 15V RIN = 1kΩ CL = 10nF, RL = 0.18Ω RSOURCE = 0Ω, RSINK = 0Ω ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 4 of 8 www.diodes.com July 2018 © Diodes Incorporated

Switching Test Circuit and Timing Diagram Typical Switching Characteristics (@ TA = +25°C, unless otherwise specified.) 10% 90% 90% tr td(rise) td(fall) tf VIN VOUT VCC VEE VCC IN ZXGD3009 SOURCE SINK RSOURCE RSINK RIN 50Ω 50Ω RL CL VIN VOUT 10% 90% 10% V ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 5 of 8 www.diodes.com July 2018 © Diodes Incorporated

Typical Switching Characteristics (@ TA = +25°C, unless otherwise specified.) 0.1 1 101 100 1000 0.1 1 101 100 1000 100 1k 10k 0.01 0.1 100 1k 10k 0.01 0.1 0.1 1 10 100 1000 0.1 1 10 100 1000 RIN=100Ω RIN=1kΩ RIN=10kΩ Turn-On Delay Time TA = 25°C VCC= 15V VIN = 15V RL = 0.18Ω td(rise) (ns) CL Load Capacitance (nF) RIN=100Ω RIN=1kΩ RIN=10kΩ Turn-Off Delay Time TA = 25°C VCC= 15V VIN = 15V RL = 0.18Ω td(fall) (ns) CL Load Capacitance (nF) CL=10nF CL=0.1nF CL=1nF Source Current vs. Input Resistance TA = 25°C VCC= 15V VIN = 15V RL = 0.18Ω Peak Source Current (A) RIN Input Resistance (Ω) CL=1nF CL=10nF CL=0.1nF TA = 25°C VCC= 15 VIN = 15V RL = 0.18Ω Sink Current vs. Input ResistancePeak Sink Current (A) RIN Input Resistance (Ω) RIN=100Ω RIN=1kΩ RIN=10kΩ TA = 25°C VCC= 15V VIN = 15V RL = 0.18Ω Turn-On Rise Time tr (ns) CL Load Capacitance (nF) RIN=1kΩ RIN=100Ω RIN=10kΩ TA = 25°C VCC= 15V VIN = 15V RL = 0.18Ω Turn-Off Fall Time CL Load Capacitance (nF) tf (ns) ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 6 of 8 www.diodes.com July 2018 © Diodes Incorporated

Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOT26 (SC74R) SOT26 (SC74R) Dim Min Max Typ A1 0.013 0.10 0.05 A2 1.00 1.30 1.10 A3 0.70 0.80 0.75 b 0.35 0.50 0.38 c 0.10 0.20 0.15 D 2.90 3.10 3.00 e — — 0.95 e1 — — 1.90 E 2.70 3.00 2.80 E1 1.50 1.70 1.60 L 0.35 0.55 0.40 a — — 8° a1 — — 7° All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOT26 (SC74R) Dimensions Value (in mm) C 2.40 C1 0.95 G 1.60 X 0.55 Y 0.80 Y1 3.20 D e E1 E b A2 A1 Seating Plane L c a Y1 G X Y C ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 7 of 8 www.diodes.com July 2018 © Diodes Incorporated

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, C ustomers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the expr ess written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incor porated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com ZXGD3009E6 Datasheet Number: DS36885 Rev. 3 - 2 8 of 8 www.diodes.com July 2018 © Diodes Incorporated